XC7S15-1FTGB196Q

The XC7S15-1FTGB196Q is a Spartan®-7 field programmable gate array (FPGA) supplied in a 196-LBGA (CSPBGA) package. It delivers 12,800 logic elements and approximately 0.37 Mbits of embedded memory in a compact surface-mount package aimed at designs that require programmable logic with automotive qualification.

With 100 general I/O pins, low-voltage core operation, and AEC-Q100 qualification, this device is suitable for applications where environmental robustness, compact integration, and programmable logic flexibility are required.

Key Features

• Logic Capacity — 12,800 logic elements provide a programmable fabric for implementing custom combinational and sequential logic.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM for buffering, small FIFOs, and local data storage.
• I/O Count — 100 available I/O pins to support interface consolidation and peripheral integration on a single device.
• Low-Voltage Core — Core voltage range from 0.95 V to 1.05 V for compatibility with low-voltage power architectures.
• Package and Mounting — 196-LBGA (196-CSBGA, 15×15) surface-mount package for high-density board designs.
• Automotive Qualification — Grade: Automotive with AEC-Q100 qualification and an operating temperature range of -40°C to 125°C for in-vehicle environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Automotive Control Modules — Programmable logic for in-vehicle control functions where AEC-Q100 qualification and a -40°C to 125°C range are required.
• Sensor Aggregation and Preprocessing — Consolidate sensor interfaces and perform local data conditioning using the device’s I/O count and on-chip memory.
• Custom I/O and Protocol Bridging — Implement protocol translation or custom peripheral logic leveraging 100 I/O pins and reconfigurable logic.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification supports deployment in automotive electronic applications requiring recognized component-level qualification.
• Compact, High-Density Package: The 196-LBGA (15×15) surface-mount package enables space-efficient board layouts for constrained enclosures.
• Balanced Logic and Memory: 12,800 logic elements paired with approximately 0.37 Mbits of embedded RAM allow implementation of moderate-complexity control and buffering tasks on a single device.
• Wide Operating Temperature: Rated from -40°C to 125°C to maintain operation across typical automotive thermal extremes.
• Low-Voltage Core Compatibility: 0.95 V to 1.05 V supply range aligns with modern low-voltage system power architectures to help manage overall system power design.
• Environmental Compliance: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose XC7S15-1FTGB196Q?

The XC7S15-1FTGB196Q positions itself as a compact, automotive-qualified FPGA option for designers needing reconfigurable logic with verified environmental performance. Its combination of 12,800 logic elements, on-chip RAM, 100 I/O pins, and AEC-Q100 qualification makes it suited to vehicle electronics and other applications that demand programmable integration and extended temperature operation.

This part is appropriate for teams aiming to consolidate interfaces, implement custom control logic, or add field-updateable functionality while adhering to automotive component qualification and compact board footprint constraints.

Request a quote or submit an inquiry to purchase the XC7S15-1FTGB196Q and discuss availability and lead times for your design needs.