XCS20XL-4CS144C
| Part Description |
Spartan®-XL Field Programmable Gate Array (FPGA) IC 113 12800 950 144-TFBGA, CSPBGA |
|---|---|
| Quantity | 1,224 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-LCSBGA (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-TFBGA, CSPBGA | Number of I/O | 113 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 950 | ||
| Number of Gates | 20000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12800 |
Overview of XCS20XL-4CS144C – Spartan®-XL FPGA, 950 logic elements, 144-TFBGA
The XCS20XL-4CS144C is a Spartan®-XL field programmable gate array (FPGA) manufactured by AMD, designed for commercial embedded applications. It provides 950 logic elements and approximately 0.0128 Mbits of embedded memory in a compact 144-ball TFBGA/CSPBGA package, delivering a balance of programmable logic, I/O density, and small form-factor packaging.
With a 3 V to 3.6 V supply range, 113 user I/Os, and an operating temperature range of 0 °C to 85 °C, this device is suited for a variety of low- to mid-complexity designs that require configurable logic and on-chip memory in a surface-mount BGA footprint.
Key Features
- Core Logic 950 logic elements provide the programmable fabric for implementing custom logic, state machines, and glue logic functions.
- Embedded Memory Approximately 0.0128 Mbits (12,800 bits) of on-chip RAM to support small buffering, FIFOs, and state storage within designs.
- I/O Density 113 user I/Os allow for flexible interfacing with peripherals, sensors, and external devices within a compact footprint.
- Gate Count Around 20,000 gates to support moderate logic integration without external logic complexity.
- Power and Supply Operates from a 3 V to 3.6 V supply, suitable for common commercial power domains.
- Package and Mounting Available in a 144-TFBGA / CSPBGA surface-mount package (supplier package: 144-LCSBGA, 12×12), enabling high-density board integration.
- Temperature Range Commercial operating range from 0 °C to 85 °C for standard commercial deployments.
- Compliance RoHS compliant, meeting common environmental regulations for electronics manufacturing.
Typical Applications
- Commercial Embedded Systems Implement custom logic, protocol bridging, and peripheral control where moderate logic capacity and on-chip RAM suffice.
- Interface and Glue Logic Use the device to consolidate discrete logic, translate between interfaces, or add bespoke timing and control functions between components.
- Prototyping and Evaluation Compact package and accessible I/O counts make it suitable for board-level prototyping and proof-of-concept designs in commercial products.
Unique Advantages
- Compact, BGA Packaging: The 144-ball TFBGA/CSPBGA package enables high-density PCB placement while keeping the board footprint small.
- Balanced Logic and Memory: 950 logic elements combined with 12,800 bits of on-chip RAM supports a range of control and data-path functions without external RAM for modest buffering needs.
- Generous I/O Count: 113 user I/Os provide flexibility to interface with multiple peripherals and buses directly from the FPGA fabric.
- Commercial Voltage Compatibility: 3 V to 3.6 V supply range aligns with common commercial power rails for easy integration.
- RoHS Compliant: Environmentally compliant construction simplifies assembly and end-product regulatory considerations.
Why Choose XCS20XL-4CS144C?
The XCS20XL-4CS144C positions itself as a practical choice for designers needing a programmable logic device with moderate capacity, compact packaging, and a solid set of I/Os. Its combination of 950 logic elements, embedded RAM, and a 144-ball BGA package makes it suitable for commercial embedded designs that require custom logic integration without large board area or high power budgets.
This device is well suited to engineers and procurement teams targeting cost-effective, RoHS-compliant FPGA solutions for commercial applications where the specified operating voltage and temperature range match system requirements.
Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the XCS20XL-4CS144C.

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