XCS20XL-4PQG208C

IC FPGA 160 I/O 208QFP
Part Description

Spartan®-XL Field Programmable Gate Array (FPGA) IC 160 12800 950 208-BFQFP

Quantity 733 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O160Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells950
Number of Gates20000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits12800

Overview of XCS20XL-4PQG208C – Spartan®-XL Field Programmable Gate Array (FPGA), 208-BFQFP

The XCS20XL-4PQG208C is a Spartan®-XL Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded applications. It provides a compact, surface-mount solution with a 208-BFQFP package and a balance of logic capacity, I/O count and on-chip memory for glue logic, I/O expansion and custom digital functions.

Key electrical and environmental characteristics include a 3.0 V to 3.6 V supply range and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for typical commercial electronic designs.

Key Features

  • Logic Capacity  Approximately 950 logic elements and about 20,000 gates, providing discrete programmable resources for combinational and sequential logic implementation.
  • On-Chip Memory  Approximately 0.013 Mbits of embedded memory (12,800 bits) for small data buffering, state storage and local scratch memory.
  • I/O Count  Up to 160 general-purpose I/O pins to interface with peripherals, sensors, and external logic devices.
  • Package and Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB integration.
  • Power  Single-supply operation from 3.0 V to 3.6 V to match common system power rails.
  • Operating Conditions  Commercial grade device rated for 0 °C to 85 °C, suitable for standard commercial environments.
  • Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Embedded Control  Implement custom control logic and finite-state machines where up to 950 logic elements and multiple I/Os are required.
  • I/O Expansion and Bridging  Use the 160 I/O pins to bridge between different peripherals, bus interfaces or to aggregate sensor inputs.
  • Glue Logic and System Integration  Replace discrete logic with a programmable solution to simplify board design and consolidate functions in a single device.
  • Prototyping and Evaluation  Validate digital designs and proof-of-concept implementations that require modest logic density and on-chip memory.

Unique Advantages

  • Balanced Logic and Memory: Combines approximately 950 logic elements with 12,800 bits of embedded RAM for practical on-chip data handling without external memory.
  • High I/O Density: 160 available I/O pins enable flexible interfacing to multiple peripherals and buses, reducing the need for external port expanders.
  • Compact Surface-Mount Package: The 208-BFQFP (28×28 PQFP) package supports dense PCB layouts while maintaining a robust pinout for complex designs.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C and RoHS compliant to align with common commercial production and environmental requirements.
  • Standard Power Requirements: Operates from a 3.0 V to 3.6 V supply, simplifying power-supply design for systems using common 3.3 V rails.

Why Choose XCS20XL-4PQG208C?

The XCS20XL-4PQG208C positions itself as a practical, commercially graded FPGA option for designers who need a reliable, surface-mount programmable device with a balanced set of resources: roughly 950 logic elements, 12,800 bits of embedded RAM and up to 160 I/O pins. Its 208-pin PQFP package and 3.0 V–3.6 V supply range make it straightforward to integrate into existing 3.3 V systems.

This device is well suited to engineering teams working on embedded control, I/O bridging, glue logic consolidation or prototyping tasks where moderate gate density and on-chip memory meet project requirements. Its RoHS compliance and commercial temperature rating support standard manufacturing and deployment scenarios.

Request a quote or submit an inquiry to obtain pricing, lead-time and availability information for the XCS20XL-4PQG208C.

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