XCS20XL-4PQG208C
| Part Description |
Spartan®-XL Field Programmable Gate Array (FPGA) IC 160 12800 950 208-BFQFP |
|---|---|
| Quantity | 733 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 160 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 950 | ||
| Number of Gates | 20000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12800 |
Overview of XCS20XL-4PQG208C – Spartan®-XL Field Programmable Gate Array (FPGA), 208-BFQFP
The XCS20XL-4PQG208C is a Spartan®-XL Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded applications. It provides a compact, surface-mount solution with a 208-BFQFP package and a balance of logic capacity, I/O count and on-chip memory for glue logic, I/O expansion and custom digital functions.
Key electrical and environmental characteristics include a 3.0 V to 3.6 V supply range and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for typical commercial electronic designs.
Key Features
- Logic Capacity Approximately 950 logic elements and about 20,000 gates, providing discrete programmable resources for combinational and sequential logic implementation.
- On-Chip Memory Approximately 0.013 Mbits of embedded memory (12,800 bits) for small data buffering, state storage and local scratch memory.
- I/O Count Up to 160 general-purpose I/O pins to interface with peripherals, sensors, and external logic devices.
- Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB integration.
- Power Single-supply operation from 3.0 V to 3.6 V to match common system power rails.
- Operating Conditions Commercial grade device rated for 0 °C to 85 °C, suitable for standard commercial environments.
- Regulatory RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Embedded Control Implement custom control logic and finite-state machines where up to 950 logic elements and multiple I/Os are required.
- I/O Expansion and Bridging Use the 160 I/O pins to bridge between different peripherals, bus interfaces or to aggregate sensor inputs.
- Glue Logic and System Integration Replace discrete logic with a programmable solution to simplify board design and consolidate functions in a single device.
- Prototyping and Evaluation Validate digital designs and proof-of-concept implementations that require modest logic density and on-chip memory.
Unique Advantages
- Balanced Logic and Memory: Combines approximately 950 logic elements with 12,800 bits of embedded RAM for practical on-chip data handling without external memory.
- High I/O Density: 160 available I/O pins enable flexible interfacing to multiple peripherals and buses, reducing the need for external port expanders.
- Compact Surface-Mount Package: The 208-BFQFP (28×28 PQFP) package supports dense PCB layouts while maintaining a robust pinout for complex designs.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C and RoHS compliant to align with common commercial production and environmental requirements.
- Standard Power Requirements: Operates from a 3.0 V to 3.6 V supply, simplifying power-supply design for systems using common 3.3 V rails.
Why Choose XCS20XL-4PQG208C?
The XCS20XL-4PQG208C positions itself as a practical, commercially graded FPGA option for designers who need a reliable, surface-mount programmable device with a balanced set of resources: roughly 950 logic elements, 12,800 bits of embedded RAM and up to 160 I/O pins. Its 208-pin PQFP package and 3.0 V–3.6 V supply range make it straightforward to integrate into existing 3.3 V systems.
This device is well suited to engineering teams working on embedded control, I/O bridging, glue logic consolidation or prototyping tasks where moderate gate density and on-chip memory meet project requirements. Its RoHS compliance and commercial temperature rating support standard manufacturing and deployment scenarios.
Request a quote or submit an inquiry to obtain pricing, lead-time and availability information for the XCS20XL-4PQG208C.

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