XCS20XL-4PQ208I

The XCS20XL-4PQ208I is a Spartan®-XL field programmable gate array (FPGA) from AMD designed for industrial-grade embedded logic implementations. It provides a moderate logic capacity with 950 logic elements, approximately 12.8 kbits of embedded RAM, and up to 160 user I/O pins to support a range of control and interface functions.

With a 3.0–3.6 V supply range, a surface-mount 208-BFQFP package, and an operating temperature range of −40°C to 100°C, this device targets designs that require reliable operation across extended temperature conditions and compact board-level integration.

Key Features

• Core Capacity  950 logic elements and approximately 20,000 equivalent gates provide the programmable fabric needed for glue logic, control functions, and moderate-complexity finite-state machines.
• Logic Blocks  The device contains 400 configurable logic blocks (CLBs) to structure combinational and sequential logic efficiently for custom designs.
• Embedded Memory  Approximately 12.8 kbits of on-chip RAM support small buffering, FIFOs, and state storage for control and communication tasks.
• I/O Capacity  Up to 160 user I/O pins enable connectivity to peripherals, buses, and external logic while providing flexibility in pin assignment and interface mapping.
• Power  Operates from a 3.0 V to 3.6 V supply, suitable for systems designed around standard 3.3 V power rails.
• Package & Mounting  Available in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28 mm) for compact PCB integration and automated assembly.
• Industrial Temperature Range  Rated for −40°C to 100°C operation, supporting deployment in industrial environments where extended temperature tolerance is required.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial control and automation  Industrial-grade temperature rating and flexible I/O make the device suitable for control logic, sequencing, and interface tasks in automated equipment.
• Embedded control and glue logic  950 logic elements and 160 I/Os provide the capacity needed to implement board-level glue logic, address decoding, and peripheral management.
• Protocol bridging and interface adaptation  The combination of logic resources and abundant I/O supports custom protocol translation and signal adaptation between subsystems.

Unique Advantages

• Industrial-grade operation: Rated for −40°C to 100°C to support deployment in temperature-challenging environments.
• Balanced logic and I/O mix: 950 logic elements paired with 160 I/Os enable a wide range of mid-density implementations without excessive board-level complexity.
• Compact SMT package: The 208-BFQFP surface-mount package (28×28 PQFP form factor) simplifies PCB layout and supports automated assembly.
• Standard 3.3 V compatibility: 3.0–3.6 V supply range aligns with common 3.3 V system rails for easy integration into existing power architectures.
• RoHS compliant: Meets environmental compliance expectations for modern manufacturing processes.

Why Choose XCS20XL-4PQ208I?

The XCS20XL-4PQ208I delivers a practical balance of programmable logic, embedded memory, and I/O capacity in a compact, industrial-grade package. It is well suited for engineers and procurement teams building mid-density FPGA solutions that require reliable operation across an extended temperature range and seamless integration with standard 3.3 V power systems.

Backed by AMD manufacturing, this Spartan®-XL device provides a straightforward, verifiable option for designs that need durable, field-deployable programmable logic with clear electrical and mechanical specifications.

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