XCS30XL-5BG256C

IC FPGA 192 I/O 256BGA
Part Description

Spartan®-XL Field Programmable Gate Array (FPGA) IC 192 18432 1368 256-BBGA

Quantity 1,807 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O192Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells1368
Number of Gates30000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of XCS30XL-5BG256C – Spartan®-XL FPGA, 192 I/O, 1368 Logic Elements, 256-BBGA

The XCS30XL-5BG256C is a Spartan®-XL field programmable gate array (FPGA) IC designed for commercial applications requiring reprogrammable digital logic. The device combines moderate logic capacity, on-chip memory, and a substantial I/O count in a compact surface-mount package.

This FPGA targets mid-range designs where a balance of logic resources, embedded RAM, and connectivity is needed within a commercial temperature and supply envelope.

Key Features

  • Core Logic  1368 logic elements and approximately 30,000 gates provide capacity for mid-size digital designs and custom logic implementations.
  • Embedded Memory  Approximately 18,432 bits of on-chip RAM suitable for buffering, state storage, and small lookup tables.
  • I/O  192 user I/O pins to support multiple peripherals, buses, and external interfaces.
  • Power  Operates from a 3 V to 3.6 V supply range to match common commercial system rails.
  • Package & Mounting  Surface-mount 256-BBGA package; supplier device package listed as 256-PBGA (27×27) for compact board integration.
  • Temperature & Grade  Commercial grade device rated for 0°C to 85°C operating temperature.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • Custom digital logic and prototyping  Reprogrammable FPGA fabric and 1368 logic elements enable iterative development and validation of digital functions.
  • Peripheral and interface bridging  192 I/O pins accommodate multiple peripheral connections and interface translation tasks on compact boards.
  • Embedded control and sequencing  On-chip RAM and gate capacity support control logic, state machines, and timing/sequencing functions in commercial systems.

Unique Advantages

  • Balanced logic capacity: 1368 logic elements and ~30,000 gates provide room for mid-level integration without excessive board area.
  • On-chip memory availability: Approximately 18,432 bits of embedded RAM reduce the need for external buffering in many designs.
  • High I/O count: 192 I/O pins simplify connections to multiple peripherals, sensors, and buses.
  • Common power compatibility: 3 V to 3.6 V operating range aligns with standard commercial supply rails.
  • Compact surface-mount package: 256-BBGA / 256-PBGA (27×27) footprint enables dense, space-conscious PCB layouts.
  • Commercial temperature and RoHS compliance: Rated for 0°C to 85°C and RoHS compliant for mainstream product deployments.

Why Choose XCS30XL-5BG256C?

The XCS30XL-5BG256C delivers a practical combination of logic elements, embedded RAM, and high I/O count in a compact surface-mount package, making it well suited for commercial designs that need reprogrammable digital logic and flexible interfacing. Its 3 V–3.6 V supply range and commercial temperature rating match common system requirements.

Choose this FPGA when you need a mid-range, reconfigurable solution that balances integration and board-space efficiency while maintaining RoHS environmental compliance.

Request a quote or submit a quote request to obtain pricing and availability for the XCS30XL-5BG256C.

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