XCS30XL-5CS280C

The XCS30XL-5CS280C is an AMD Spartan®-XL Field Programmable Gate Array (FPGA) in a 280‑TFBGA/CSPBGA package. It provides a compact, surface-mount programmable logic solution with 1368 logic elements, 192 user I/O pins and approximately 0.018 Mbits of on-chip RAM for commercial electronic designs.

Designed for applications that require moderate logic capacity and flexible I/O, the device operates from a 3.0 V to 3.6 V supply and is specified for commercial temperature ranges (0 °C to 85 °C). The part is RoHS compliant and available in a 280‑CSBGA (16×16) supplier package.

Key Features

• Core Logic 1368 logic elements (cells) delivering a balance of programmable logic for mid-density designs.
• Embedded Memory Approximately 18,432 bits (≈0.018 Mbits) of on-chip RAM to support small data buffers and state storage.
• I/O Capacity 192 user I/O pins enabling broad connectivity for peripheral interfaces, control signals and glue logic.
• Gate Count Approximately 30,000 equivalent gates for mapping combinational and sequential logic.
• Power Single-supply operation from 3.0 V to 3.6 V for straightforward integration into 3.3 V systems.
• Package & Mounting Surface-mount 280‑TFBGA / CSPBGA package with supplier device package 280‑CSBGA (16×16) for compact board-level footprint.
• Operating Range & Grade Commercial operating temperature of 0 °C to 85 °C; specified for commercial-grade applications.
• Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Mid-density Logic Integration — Implement glue logic, control functions and protocol handlers using the device’s 1368 logic elements and 192 I/O pins.
• I/O Expansion and Interface Bridging — Use the abundant I/O to route signals between subsystems or adapt peripheral interfaces on commercial electronic boards.
• Prototyping and Development — Rapidly validate and iterate digital designs that require modest on-chip RAM and a compact BGA package.
• Commercial Electronic Systems — Deploy in products that operate within a 0 °C to 85 °C range and use a 3.0 V–3.6 V supply rail.

Unique Advantages

• Balanced Resource Set: 1368 logic elements, ~18kbits of embedded RAM and 192 I/O provide a practical mix of resources for mid-range designs without excess board area.
• Compact BGA Package: 280‑TFBGA/CSPBGA packaging and 16×16 280‑CSBGA supplier footprint minimize PCB real estate while supporting surface-mount assembly.
• Single 3.0–3.6 V Supply: Simplifies power architecture for 3.3 V system environments.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with standard commercial product requirements.
• RoHS Compliance: Environmentally compliant for regulated markets and supply chains.

Why Choose XCS30XL-5CS280C?

The XCS30XL-5CS280C positions itself as a compact, commercial-grade FPGA option that combines a practical logic capacity with significant I/O density and on-chip memory. It is suited to designers who need a programmable device that fits tight board footprints while supporting a 3.3 V system environment.

This part delivers predictable, verifiable resources—logic elements, RAM bits, gate equivalence and I/O—that simplify component selection for mid-density digital designs, prototyping and interface-centric applications. RoHS compliance and surface-mount BGA packaging support mainstream manufacturing and regulatory needs.

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