XCS30XL-5TQ144C

The XCS30XL-5TQ144C is a Spartan®-XL Field Programmable Gate Array (FPGA) from AMD provided in a 144-pin LQFP surface-mount package. It delivers a mid-range combination of programmable logic, on-chip RAM and I/O density for designers targeting commercial embedded systems and consumer electronic applications.

With 1,368 logic elements, approximately 18,432 bits of total on-chip RAM, 113 user I/O and a 3.0–3.6 V supply range, this device balances integration and flexibility for low- to mid-density logic implementations within a commercial temperature range (0 °C to 85 °C).

Key Features

• Programmable Logic Density Contains 1,368 logic elements (approximately 30,000 equivalent gates) suitable for glue logic, protocol bridging and small to mid-size custom logic functions.
• Embedded Memory Provides 18,432 bits of total on-chip RAM to support buffer storage, small lookup tables and state machines without external memory.
• I/O Capability 113 user I/O pins allow for multiple peripheral connections, parallel interfaces and mixed-signal front-end routing within the package.
• Package and Mounting Available in a 144-pin LQFP surface-mount package (supplier package listed as 144-TQFP, 20 × 20 mm) for standard PCB assembly processes.
• Power and Operating Range Operates from 3.0 V to 3.6 V supply rails and is specified for commercial operation from 0 °C to 85 °C.
• Compliance and Grade Commercial-grade device with RoHS compliance for lead-free assembly and regulatory alignment in consumer and commercial products.

Typical Applications

• Embedded System Prototyping Use the FPGA for proof-of-concept designs and platform validation where mid-range programmable logic and on-chip RAM accelerate development cycles.
• Peripheral and Interface Control Leverage 113 I/O pins to implement interface bridging, custom bus logic and peripheral management in consumer electronics and instrumentation.
• Control and Sequencing Implement state machines, timing control and small control loops using the device's logic elements and embedded RAM for compact control functions.
• Signal Glue Logic Integrate discrete functions and protocol adapters into a single FPGA to reduce BOM and simplify PCB routing in commercial products.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 1,368 logic elements paired with 18,432 bits of on-chip RAM supports a wide range of mid-density designs without immediate need for external memory.
• High I/O Count in a Compact Package: 113 user I/O in a 144-pin LQFP package enables extensive peripheral connectivity while maintaining a small PCB footprint.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet common requirements for consumer and general-purpose commercial applications.
• Standard Supply Voltage: 3.0–3.6 V supply range simplifies power design for systems using common 3.3 V rails.
• Surface-Mount Assembly Friendly: 144-pin surface-mount package supports standard automated assembly and reflow processes for efficient manufacturing.
• RoHS Compliant: Supports lead-free assembly and regulatory requirements for commercial devices.

Why Choose XCS30XL-5TQ144C?

The XCS30XL-5TQ144C positions itself as a practical mid-density FPGA choice for engineers and product teams needing a compact, programmable logic device with a solid complement of I/O and on-chip RAM. Its combination of 1,368 logic elements, 113 user I/O and a 144-pin surface-mount package makes it well suited to embedded prototypes, consumer electronics controls and interface consolidation tasks.

As a commercial-grade, RoHS-compliant FPGA from AMD, it provides a predictable specification set—including a 3.0–3.6 V supply range and 0 °C to 85 °C operating temperature—that helps streamline design decisions for cost-sensitive and space-constrained products.

Request a quote or submit an inquiry to receive pricing and availability for the XCS30XL-5TQ144C and to discuss how it can fit into your next design.