XCS40-3BG256C

The XCS40-3BG256C is an AMD Spartan® field programmable gate array (FPGA) in a 256-ball BGA package, designed for commercial electronic applications that require reconfigurable digital logic. It delivers a combination of on-chip memory, a sizable I/O count, and a compact surface-mount package for integration into space-constrained boards.

With 1,862 logic elements and approximately 25 kbits of embedded RAM, this device targets designers seeking flexible logic implementation and moderate on-chip memory within a commercial temperature range and standard 5 V supply domain.

Key Features

• Core Logic 1,862 logic elements provide the programmable fabric for implementing custom logic, state machines, and datapaths.
• Embedded Memory Total on-chip RAM of 25,088 bits (approximately 25 kbits) for buffering, small FIFOs, and configuration storage.
• I/O Density 205 available I/O pins support broad interfacing options for parallel/serial connectivity and external peripherals.
• Gate Equivalent Approximately 40,000 gates for mapping moderate-complexity designs while maintaining a compact footprint.
• Package and Mounting 256-ball BGA package (supplier device package: 256-PBGA, 27 × 27 mm) optimized for surface-mount assembly and PCB space efficiency.
• Power Operates from a 4.75 V to 5.25 V supply range to match common commercial power rails.
• Operating Range Commercial temperature rating from 0 °C to 85 °C, suitable for general-purpose electronic systems.
• RoHS Compliance Device is RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, glue logic, and protocol bridging where reprogrammability and moderate logic density are required.
• User Interface Control — Manage front-panel logic, custom display drivers, or keypad/state handling using available I/O and on-chip memory for buffering.
• Sensor and Peripheral Interfacing — Aggregate and preprocess signals from multiple sensors or peripherals using the FPGA’s I/O and programmable logic.

Unique Advantages

• Balanced Logic and Memory: Combines 1,862 logic elements with approximately 25 kbits of RAM to support a range of moderate-complexity designs without external memory for small buffers.
• High I/O Count: 205 I/O pins enable flexible interfacing to multiple peripherals and buses, simplifying system integration.
• Compact BGA Package: 256-ball BGA (27 × 27 mm supplier package) provides high pin density in a surface-mount form factor for space-constrained PCBs.
• Commercial Temperature and Standard Power: Rated 0 °C to 85 °C and 4.75 V–5.25 V operation to match common commercial system requirements.
• RoHS Compliant: Supports lead-free assembly processes and environmental compliance needs.

Why Choose XCS40-3BG256C?

The XCS40-3BG256C positions itself as a practical choice for designers needing a reprogrammable, mid-density FPGA for commercial electronic designs. Its mix of logic elements, on-chip RAM, and a high I/O count in a compact 256-BBGA package makes it suitable for applications where board space and interface flexibility are important.

For teams building commercial-grade products that require configurable logic, I/O versatility, and standard power/temperature compatibility, this Spartan® FPGA offers a straightforward, verifiable silicon option that integrates into existing design flows and assembly processes.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XCS40-3BG256C.