XCS40XL-5BG256C

The XCS40XL-5BG256C is a Spartan®-XL field programmable gate array (FPGA) IC from AMD, offered in a 256‑BBGA package. It provides a commercial‑grade, mid-density FPGA fabric with a balance of logic resources, on‑chip RAM, and a large I/O count for embedded and general-purpose digital designs.

With 1,862 logic elements, 25,088 bits of on‑chip RAM and 205 user I/Os, this device is suited to designs that require moderate logic integration, flexible I/O connectivity and compact surface‑mount packaging. The device operates from 3.0 V to 3.6 V and supports a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 1,862 logic elements providing the programmable fabric for implementing custom digital functions and glue logic.
• Embedded Memory  25,088 bits of on‑chip RAM for small buffers, FIFOs or state storage to support local data handling.
• I/O Capacity  205 available I/O pins to interface with multiple peripherals, sensors and external devices.
• Logic Density  An estimated 40,000 gates worth of logic capacity for mid‑range digital designs.
• Power and Voltage  Operates from a 3.0 V to 3.6 V supply, enabling compatibility with common 3.3 V systems.
• Package and Mounting  256‑ball BGA package (supplier package: 256‑PBGA, 27×27) designed for surface‑mount assembly in compact board layouts.
• Commercial Grade & Temperature Range  Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• Interface and I/O Expansion  Use the 205 I/Os to consolidate and manage signals between multiple peripherals and subsystems on a compact PCB.
• Custom Logic and Glue Logic  Implement custom combinational and sequential logic functions using the device’s 1,862 logic elements to reduce discrete component count.
• Local Data Buffering  Leverage 25,088 bits of on‑chip RAM for small buffering, FIFOs or temporary storage in embedded processing paths.
• Prototyping and Development  A suitable mid‑density FPGA for prototyping time‑critical logic or validating digital architectures before scaling to other devices.

Unique Advantages

• Balanced Resource Set:  Combines a mid‑range logic element count with substantial I/O and on‑chip RAM to support a variety of moderate‑complexity designs without unnecessary overhead.
• Compact Surface‑Mount Package:  256‑BBGA (27×27 PBGA) enables space‑constrained board designs while supporting automated surface‑mount assembly.
• Standard 3.3 V Compatibility:  3.0–3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation, suitable for typical consumer and commercial electronics deployments.
• Regulatory Readiness:  RoHS compliance supports lead‑free manufacturing and supply chain requirements.

Why Choose XCS40XL-5BG256C?

The XCS40XL-5BG256C offers a pragmatic balance of logic capacity, embedded RAM and a high I/O count in a compact 256‑BBGA package, making it a practical choice for engineers designing moderate‑complexity digital systems. Its commercial temperature rating and RoHS compliance support standard production and assembly workflows.

Manufactured by AMD, this Spartan®-XL FPGA is appropriate for designers who need a mid‑density programmable device with versatile I/O and on‑chip memory for tasks such as interface consolidation, custom logic implementation and on‑board buffering.

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