XCS40XL-5PQ208C
| Part Description |
Spartan®-XL Field Programmable Gate Array (FPGA) IC 169 25088 1862 208-BFQFP |
|---|---|
| Quantity | 1,214 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 169 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 784 | Number of Logic Elements/Cells | 1862 | ||
| Number of Gates | 40000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 25088 |
Overview of XCS40XL-5PQ208C – Spartan®-XL FPGA, 208-BFQFP
The XCS40XL-5PQ208C is a Spartan®-XL field programmable gate array (FPGA) IC from AMD, provided in a 208-BFQFP surface-mount package. It delivers reconfigurable logic resources, on-chip memory and a large I/O count in a commercial-grade device suitable for a range of embedded designs.
With 1,862 logic elements, approximately 25 kbits of embedded RAM and 169 I/O pins, this device is intended for commercial applications where compact package integration, moderate logic capacity and flexible I/O are required. The device operates from 3.0 V to 3.6 V and across a 0 °C to 85 °C temperature range.
Key Features
- Core Logic Provides 1,862 logic elements (approximately 40,000 equivalent gates) for implementing custom digital logic and state machines.
- On-Chip Memory Includes approximately 25 kbits of embedded RAM for buffering, small data tables and temporary storage within the FPGA fabric.
- I/O Capacity 169 user I/O pins support extensive external interfacing for sensors, peripherals and parallel/serial connections.
- Power Single-supply operation from 3.0 V to 3.6 V simplifies power rail design for compatible commercial systems.
- Package & Mounting 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for board-level integration where board area and component density matter.
- Operating Range Commercial-grade specification with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems Provides reconfigurable logic and on-chip RAM for control, interfacing and custom digital functions in commercial products.
- Prototyping and Development Useful for designers implementing and validating custom logic blocks and I/O interfaces before committing to fixed silicon.
- Peripheral and Interface Bridging High I/O count supports signal aggregation, protocol bridging and glue-logic tasks between subsystems.
Unique Advantages
- Balanced Logic and Memory: 1,862 logic elements combined with approximately 25 kbits of RAM enable compact implementations of control logic and small data structures without external memory.
- High I/O Density: 169 I/O pins allow flexible connectivity to multiple peripherals and subsystems, reducing the need for external bus extenders.
- Compact, Surface-Mount Package: 208-BFQFP packaging supports moderate pin count integration while maintaining a board-friendly surface-mount profile.
- Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match typical commercial product environments.
- RoHS Compliant: Manufactured to meet RoHS requirements for environmentally conscious production.
Why Choose XCS40XL-5PQ208C?
The XCS40XL-5PQ208C positions itself as a practical, commercial-grade FPGA option for designs that require a moderate amount of programmable logic, embedded RAM and extensive I/O in a compact 208-pin BFQFP package. Its 1,862 logic elements, approximately 25 kbits of on-chip memory and 169 I/Os provide designers with the capability to implement custom control, interfacing and glue-logic functions without excessive board-level complexity.
This AMD Spartan®-XL device is suited to engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with defined supply and thermal limits (3.0–3.6 V, 0 °C–85 °C), enabling predictable integration into commercial product designs.
Request a quote or submit an inquiry to receive pricing and availability information for the XCS40XL-5PQ208C.

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