XCV100-4BG256C

The XCV100-4BG256C is an SRAM-based Virtex FPGA that delivers reprogrammable, high-density programmable logic for commercial embedded and system applications. It integrates 2,700 logic elements and approximately 108,904 system gates with 40,960 bits of on-chip RAM and 180 general-purpose I/O, offering a compact, configurable platform for protocol processing, interface logic, and system glue.

Designed for applications requiring flexible clocking, multi-standard I/O and in-system reprogrammability, this device is supplied in a 256-BBGA (256-PBGA, 27 × 27) surface-mount package and operates from a 2.375 V to 2.625 V core supply over a 0 °C to 85 °C commercial temperature range.

Key Features

• Core logic and density – 2,700 logic elements and 108,904 system gates provide a programmable fabric suitable for medium-complexity designs and system-level glue logic.
• Embedded memory – 40,960 bits of on-chip RAM (approximately 0.041 Mbits) support LUT-based RAM configurations and block RAM usage for buffering and small data stores.
• I/O and interface support – 180 available I/O pins with multi-standard SelectIO capability and family-level support for 16 high-performance interface standards to simplify protocol and bus interfacing.
• Clocking and timing – Built-in clock-management features include four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and 24 secondary local clock nets for flexible, low-skew clock architectures.
• Programmability and configuration – SRAM-based in-system configuration enables unlimited re-programmability with four programming modes (master serial, SelectMAP, slave serial and JTAG) for deployment and iterative development.
• Arithmetic and logic support – Architecture includes dedicated carry logic, multiplier support and cascade chaining for efficient implementation of arithmetic and wide-input functions.
• Package and electrical – 256-BBGA package (supplier device package: 256-PBGA 27 × 27), surface-mount mounting; core voltage supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C.
• Manufacturing and compliance – Device family manufactured on a 0.22 μm, 5-layer-metal process and 100% factory tested; RoHS compliant.

Typical Applications

• Communications & Networking – Implement protocol engines, packet processing glue logic and custom data paths using the device’s logic density, multi-standard I/O and dedicated arithmetic resources.
• Embedded Prototyping & Development – Rapidly iterate hardware functions and validate algorithms in-system using SRAM-based reprogrammability and multiple configuration modes.
• Interface Bridging & Protocol Conversion – Use the 180 I/O and SelectIO capabilities to bridge disparate buses or convert between legacy and modern interfaces in compact system designs.
• Compact PCI and Hot-Swap Systems – Family-level support for 66-MHz PCI compliance and hot-swappable operation makes the device suitable for Compact PCI implementations that require reconfigurable logic.

Unique Advantages

• Highly integrated programmable fabric: Combines 2,700 logic elements, embedded RAM and 180 I/O to reduce external components and minimize board-level complexity.
• Flexible clocking infrastructure: Four DLLs and multiple global/local clock nets simplify multi-clock-domain designs and reduce clock routing effort.
• Multiple in-system configuration modes: SRAM-based architecture with four programming modes enables iterative development and field reconfiguration without hardware changes.
• Targeted arithmetic support: Dedicated carry logic and multiplier support accelerate implementation of DSP and arithmetic-heavy functions.
• Commercial-grade robustness: Surface-mount 256-BBGA packaging, defined supply-voltage range and 0 °C to 85 °C operating range suit a wide range of commercial embedded systems.
• Verified manufacturing and compliance: 100% factory tested production and RoHS compliance support predictable supply and regulatory needs.

Why Choose XCV100-4BG256C?

The XCV100-4BG256C positions itself as a flexible, mid-density Virtex FPGA option that balances programmable logic resources, embedded memory and a substantial I/O count in a compact 256-BBGA package. Its combination of reprogrammable SRAM configuration, multiple clock-management resources and dedicated arithmetic support makes it well suited for development, interface logic, and medium-complexity system designs where field updates and rapid prototyping are important.

With family-level development support and proven manufacturing test coverage, this device provides a practical platform for teams that need a configurable hardware building block with clear electrical and thermal operating parameters for commercial applications.

Request a quote or submit an inquiry for pricing and availability for the XCV100-4BG256C today.