XCV100-4CS144I

The XCV100-4CS144I is a Virtex® SRAM-based Field Programmable Gate Array delivering a balance of logic capacity, embedded memory, and flexible I/O in a 144‑TFBGA (CSPBGA) package. Designed for industrial applications, the device provides reprogrammable programmable-logic capability with on-chip configuration and integrated clock-management features suitable for complex digital designs.

This device is targeted at applications requiring reprogrammability, multi-standard I/O support and on-chip RAM for buffering and state storage, while operating across an industrial temperature range and low-voltage supply.

Key Features

• Logic Capacity — 2,700 logic elements (equivalent to 108,904 system gates) for implementing complex combinational and sequential logic.
• Embedded Memory — 40,960 bits of on-chip RAM available for lookup tables, dual-ported RAMs, and small data buffers.
• I/O Resources — 94 user I/O pins to interface with external devices and systems.
• Clock and Timing — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global and local clock nets for advanced clock control.
• Reprogrammable Configuration — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes.
• Interface Flexibility — Multi-standard SelectIO™ interfaces and support for fast interfaces to external high-performance RAMs.
• Package & Mounting — 144‑TFBGA, CSPBGA surface-mount package; supplier device package listed as 144‑LCSBGA (12×12).
• Power and Operating Range — Core supply range 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C.
• Quality & Compliance — 100% factory tested and RoHS compliant.

Typical Applications

• PCI and Compact PCI systems — Suitable for designs requiring 66‑MHz PCI compliance and hot-swappable Compact PCI support as indicated in the device family specification.
• In-system programmable prototypes — SRAM-based architecture with unlimited re-programmability supports iterative development and field updates.
• Embedded system control and glue logic — On-chip RAM and abundant logic elements enable custom control, signal processing glue, and state machines.
• Memory interface buffering — Built-in support for fast external RAM interfaces and embedded RAM for temporary data storage and buffering.

Unique Advantages

• Reprogrammable silicon — SRAM-based configuration enables design changes and updates without replacing hardware.
• Integrated clock management — Four DLLs and multiple clock nets facilitate complex timing architectures and low-skew distribution.
• Compact BGA footprint — 144‑TFBGA package provides a high-density solution for space-constrained PCB designs.
• Industrial temperature rating — Specified for −40 °C to 100 °C operation to support industrial environments.
• Compliance and test assurance — RoHS compliance and 100% factory testing provide confidence for production deployment.
• Flexible I/O standards — Multi-standard SelectIO capability enables direct interfacing with a variety of external devices and memory.

Why Choose XCV100-4CS144I?

The XCV100-4CS144I combines a mid-range logic element count with substantial on-chip RAM and flexible I/O in a compact, surface-mount BGA package. Its SRAM-based, reprogrammable architecture and integrated clock-management resources make it well suited for engineers who need in-system configurability, iterative development capability, and reliable operation across industrial temperature ranges.

Choose this device for designs that require a balance of logic density, embedded memory, configurable I/O, and tested industrial-grade hardware backed by the Virtex family specification and associated development tool support.

Request a quote or submit your requirements to receive pricing and availability for the XCV100-4CS144I.