XCV100-4FG256I

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA

Quantity 324 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-4FG256I – Virtex® FPGA 256-BGA, 176 I/O

The XCV100-4FG256I is a Virtex® family Field Programmable Gate Array (FPGA) in a 256-BGA surface-mount package, offering mid-range logic capacity and on-chip memory for reprogrammable system designs. Its SRAM-based architecture supports in-system configuration and unlimited re-programmability, making it suitable for industrial and embedded applications that require field updates and flexible hardware functions.

Built from a high-density architecture optimized for place-and-route efficiency, the device provides a balance of performance and integration for applications that need substantial I/O, embedded RAM, and deterministic clock management within a compact 17×17 FBGA footprint.

Key Features

  • Core logic — Approximately 2,700 logic elements (2,700 logic cells) and 108,904 system gates provide mid-range programmable capacity for combinational and sequential logic.
  • Embedded memory — 40,960 bits of on-chip RAM support LUT-configurable RAM, dual-ported RAM and SelectRAM+ architectures for local buffering and storage.
  • I/O density — 176 user I/O pins enable a wide range of external interfaces and board-level connectivity.
  • Clock management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets support precise clock distribution and low-skew timing architectures.
  • Interface flexibility — Multi-standard SelectIO™ support with 16 high-performance interface standards and fast interfaces to external high-performance RAMs.
  • Configuration — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and updates.
  • Package & mounting — 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration.
  • Power and thermal — Operating supply range of 2.375 V to 2.625 V and an industrial operating temperature range of −40 °C to 100 °C.
  • Manufacturing and reliability — 0.22 µm, 5-layer metal process technology and 100% factory tested.
  • Standards & testability — IEEE 1149.1 boundary-scan support and a die-temperature sensor diode for system diagnostics.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial control — Reprogrammable logic and on-chip RAM enable real-time control, sequencing and interface bridging in industrial equipment across an industrial temperature range.
  • PCI and Compact PCI systems — Device features include PCI-compliant operation and hot-swappability characteristics referenced for Compact PCI environments.
  • Board-level prototyping — SRAM-based in-system configuration and unlimited re-programmability support iterative hardware development and updates without board respins.
  • High-density I/O bridging — 176 I/O pins and multi-standard SelectIO support are useful when implementing complex interface logic between subsystems and external memories.

Unique Advantages

  • Reprogrammable SRAM architecture: Allows unlimited in-system reconfiguration, enabling field updates and hardware iteration without replacing components.
  • Balanced logic and memory: Combines roughly 2,700 logic elements with 40,960 bits of embedded RAM to implement both control logic and local data storage efficiently on a single device.
  • Deterministic clocking: Four DLLs and dedicated global/local clock nets simplify timing design and support predictable system-level performance.
  • High I/O count in a compact package: 176 I/Os in a 256-FBGA (17×17) footprint reduce board area while providing substantial external connectivity.
  • Industrial-ready operating range: Rated for −40 °C to 100 °C operation to meet many industrial deployment environments.
  • Proven development support: Supported by established FPGA development systems and toolchains referenced for the Virtex family to accelerate bring-up and verification.

Why Choose XCV100-4FG256I?

The XCV100-4FG256I is positioned for designs that require a mid-range programmable logic device with a practical mix of logic, embedded RAM and I/O in a compact BGA package. Its SRAM-based, reprogrammable nature combined with deterministic clock resources and a robust operating range makes it a solid choice for industrial and embedded projects that need flexibility, field programmability and reliable operation.

Engineers looking to shorten development cycles and support in-field updates will find the device’s configuration options and established development ecosystem advantageous for prototyping, interface bridging and control-oriented implementations.

Request a quote or submit an inquiry to obtain pricing and availability for the XCV100-4FG256I and to discuss how it fits your next design.

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