XCV100-4FG256I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA |
|---|---|
| Quantity | 324 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-4FG256I – Virtex® FPGA 256-BGA, 176 I/O
The XCV100-4FG256I is a Virtex® family Field Programmable Gate Array (FPGA) in a 256-BGA surface-mount package, offering mid-range logic capacity and on-chip memory for reprogrammable system designs. Its SRAM-based architecture supports in-system configuration and unlimited re-programmability, making it suitable for industrial and embedded applications that require field updates and flexible hardware functions.
Built from a high-density architecture optimized for place-and-route efficiency, the device provides a balance of performance and integration for applications that need substantial I/O, embedded RAM, and deterministic clock management within a compact 17×17 FBGA footprint.
Key Features
- Core logic — Approximately 2,700 logic elements (2,700 logic cells) and 108,904 system gates provide mid-range programmable capacity for combinational and sequential logic.
- Embedded memory — 40,960 bits of on-chip RAM support LUT-configurable RAM, dual-ported RAM and SelectRAM+ architectures for local buffering and storage.
- I/O density — 176 user I/O pins enable a wide range of external interfaces and board-level connectivity.
- Clock management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock nets and 24 secondary local clock nets support precise clock distribution and low-skew timing architectures.
- Interface flexibility — Multi-standard SelectIO™ support with 16 high-performance interface standards and fast interfaces to external high-performance RAMs.
- Configuration — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and updates.
- Package & mounting — 256-BGA (256-FBGA, 17×17) surface-mount package for compact board integration.
- Power and thermal — Operating supply range of 2.375 V to 2.625 V and an industrial operating temperature range of −40 °C to 100 °C.
- Manufacturing and reliability — 0.22 µm, 5-layer metal process technology and 100% factory tested.
- Standards & testability — IEEE 1149.1 boundary-scan support and a die-temperature sensor diode for system diagnostics.
- Compliance — RoHS compliant.
Typical Applications
- Industrial control — Reprogrammable logic and on-chip RAM enable real-time control, sequencing and interface bridging in industrial equipment across an industrial temperature range.
- PCI and Compact PCI systems — Device features include PCI-compliant operation and hot-swappability characteristics referenced for Compact PCI environments.
- Board-level prototyping — SRAM-based in-system configuration and unlimited re-programmability support iterative hardware development and updates without board respins.
- High-density I/O bridging — 176 I/O pins and multi-standard SelectIO support are useful when implementing complex interface logic between subsystems and external memories.
Unique Advantages
- Reprogrammable SRAM architecture: Allows unlimited in-system reconfiguration, enabling field updates and hardware iteration without replacing components.
- Balanced logic and memory: Combines roughly 2,700 logic elements with 40,960 bits of embedded RAM to implement both control logic and local data storage efficiently on a single device.
- Deterministic clocking: Four DLLs and dedicated global/local clock nets simplify timing design and support predictable system-level performance.
- High I/O count in a compact package: 176 I/Os in a 256-FBGA (17×17) footprint reduce board area while providing substantial external connectivity.
- Industrial-ready operating range: Rated for −40 °C to 100 °C operation to meet many industrial deployment environments.
- Proven development support: Supported by established FPGA development systems and toolchains referenced for the Virtex family to accelerate bring-up and verification.
Why Choose XCV100-4FG256I?
The XCV100-4FG256I is positioned for designs that require a mid-range programmable logic device with a practical mix of logic, embedded RAM and I/O in a compact BGA package. Its SRAM-based, reprogrammable nature combined with deterministic clock resources and a robust operating range makes it a solid choice for industrial and embedded projects that need flexibility, field programmability and reliable operation.
Engineers looking to shorten development cycles and support in-field updates will find the device’s configuration options and established development ecosystem advantageous for prototyping, interface bridging and control-oriented implementations.
Request a quote or submit an inquiry to obtain pricing and availability for the XCV100-4FG256I and to discuss how it fits your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








