XCV100-4TQ144I

IC FPGA 98 I/O 144TQFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 98 40960 2700 144-LQFP

Quantity 1,495 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O98Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-4TQ144I – Virtex® FPGA IC, 144-LQFP

The XCV100-4TQ144I is a Virtex® SRAM-based Field Programmable Gate Array offered in a 144-LQFP package. It integrates approximately 2,700 logic elements, about 40 Kbits of on-chip RAM, 98 user I/Os and a gate-equivalent density of 108,904 gates, making it suitable for embedded logic, interface bridging and mid-density programmable designs. Built on a 0.22 μm, 5-layer-metal process with on-chip clock management and flexible memory primitives, this device targets industrial applications that require reprogrammability and system-level integration.

Key Features

  • Logic Capacity — Approximately 2,700 logic elements and a gate-equivalent count of 108,904 to implement mid-density logic and control functions.
  • Embedded Memory — Approximately 40 Kbits of block RAM with configurable LUTs that can be used as 16-bit/32-bit RAM, dual-ported RAM or shift registers for flexible on-chip storage.
  • I/O and Interface Flexibility — 98 user I/Os with Multi-standard SelectIO™ support for a wide range of interface standards and direct connections to compatible external memory devices.
  • Clock Management — Four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for advanced clock control and low-skew routing.
  • Arithmetic and DSP Support — Dedicated carry logic and multiplier support for high-speed arithmetic and signal-processing building blocks.
  • Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (including SelectMAP™, JTAG and serial modes).
  • Process and Quality — Fabricated on a 0.22 μm CMOS process with 5-layer metal and 100% factory-tested devices.
  • Package and Industrial Grade — Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20) rated for industrial temperature operation from −40 °C to 100 °C.
  • Power Supply — Core voltage specified between 2.375 V and 2.625 V for predictable power design and system integration.
  • Standards and Testability — IEEE 1149.1 boundary-scan support and built-in die-temperature sensing for board-level test and monitoring.

Typical Applications

  • Industrial Control — Implement custom control logic, state machines and I/O aggregation for factory automation and machine control systems operating across the industrial temperature range.
  • Protocol Bridging and Interface Conversion — Use the device’s flexible I/O standards and reprogrammability to bridge between legacy and modern interfaces or to implement custom front-end adapters.
  • Embedded Processing and Glue Logic — Replace multi-chip glue logic with a single reprogrammable FPGA to reduce BOM and simplify board routing for embedded systems.
  • Prototyping and In-System Reconfiguration — Leverage unlimited re-programmability and multiple configuration modes for iterative development, field updates, and prototype validation.

Unique Advantages

  • Reprogrammable Hardware — SRAM-based configuration enables unlimited in-system reprogramming for design iteration and field updates without hardware changes.
  • Integrated Clock Control — Four DLLs and multiple clock nets allow precise clock distribution and low-skew timing for synchronous designs.
  • Flexible Memory Primitives — LUT-configurable RAM and dedicated block RAM provide adaptable on-chip storage to match diverse buffering and data-path requirements.
  • Industrial Temperature Rating — Specified operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Testability and Monitoring — Boundary-scan support and die-temperature sensing facilitate production test, validation and system health monitoring.
  • Compact Surface-Mount Packaging — 144-LQFP/TQFP package supports dense board layouts while providing ample I/O count for typical mid-density applications.

Why Choose XCV100-4TQ144I?

The XCV100-4TQ144I provides a balanced mid-density FPGA option that combines reprogrammability, on-chip memory and dedicated clock-management features in a compact 144-pin LQFP package. Its electrical and thermal specifications—core supply range of 2.375–2.625 V and industrial temperature rating—make it suitable for embedded designs that require deterministic operation and field-updatable logic.

This device is well suited for engineering teams needing a flexible, testable FPGA platform for interface logic, control functions and prototyping where ease of in-system reconfiguration, clock control and memory configurability reduce system complexity and help accelerate development cycles.

Request a quote or contact sales to discuss availability, pricing, and how the XCV100-4TQ144I can fit into your next design.

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