XCV100-4TQ144I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 98 40960 2700 144-LQFP |
|---|---|
| Quantity | 1,495 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 98 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-4TQ144I – Virtex® FPGA IC, 144-LQFP
The XCV100-4TQ144I is a Virtex® SRAM-based Field Programmable Gate Array offered in a 144-LQFP package. It integrates approximately 2,700 logic elements, about 40 Kbits of on-chip RAM, 98 user I/Os and a gate-equivalent density of 108,904 gates, making it suitable for embedded logic, interface bridging and mid-density programmable designs. Built on a 0.22 μm, 5-layer-metal process with on-chip clock management and flexible memory primitives, this device targets industrial applications that require reprogrammability and system-level integration.
Key Features
- Logic Capacity — Approximately 2,700 logic elements and a gate-equivalent count of 108,904 to implement mid-density logic and control functions.
- Embedded Memory — Approximately 40 Kbits of block RAM with configurable LUTs that can be used as 16-bit/32-bit RAM, dual-ported RAM or shift registers for flexible on-chip storage.
- I/O and Interface Flexibility — 98 user I/Os with Multi-standard SelectIO™ support for a wide range of interface standards and direct connections to compatible external memory devices.
- Clock Management — Four dedicated delay-locked loops (DLLs) and multiple global and local clock distribution nets for advanced clock control and low-skew routing.
- Arithmetic and DSP Support — Dedicated carry logic and multiplier support for high-speed arithmetic and signal-processing building blocks.
- Configuration and Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (including SelectMAP™, JTAG and serial modes).
- Process and Quality — Fabricated on a 0.22 μm CMOS process with 5-layer metal and 100% factory-tested devices.
- Package and Industrial Grade — Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20) rated for industrial temperature operation from −40 °C to 100 °C.
- Power Supply — Core voltage specified between 2.375 V and 2.625 V for predictable power design and system integration.
- Standards and Testability — IEEE 1149.1 boundary-scan support and built-in die-temperature sensing for board-level test and monitoring.
Typical Applications
- Industrial Control — Implement custom control logic, state machines and I/O aggregation for factory automation and machine control systems operating across the industrial temperature range.
- Protocol Bridging and Interface Conversion — Use the device’s flexible I/O standards and reprogrammability to bridge between legacy and modern interfaces or to implement custom front-end adapters.
- Embedded Processing and Glue Logic — Replace multi-chip glue logic with a single reprogrammable FPGA to reduce BOM and simplify board routing for embedded systems.
- Prototyping and In-System Reconfiguration — Leverage unlimited re-programmability and multiple configuration modes for iterative development, field updates, and prototype validation.
Unique Advantages
- Reprogrammable Hardware — SRAM-based configuration enables unlimited in-system reprogramming for design iteration and field updates without hardware changes.
- Integrated Clock Control — Four DLLs and multiple clock nets allow precise clock distribution and low-skew timing for synchronous designs.
- Flexible Memory Primitives — LUT-configurable RAM and dedicated block RAM provide adaptable on-chip storage to match diverse buffering and data-path requirements.
- Industrial Temperature Rating — Specified operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Testability and Monitoring — Boundary-scan support and die-temperature sensing facilitate production test, validation and system health monitoring.
- Compact Surface-Mount Packaging — 144-LQFP/TQFP package supports dense board layouts while providing ample I/O count for typical mid-density applications.
Why Choose XCV100-4TQ144I?
The XCV100-4TQ144I provides a balanced mid-density FPGA option that combines reprogrammability, on-chip memory and dedicated clock-management features in a compact 144-pin LQFP package. Its electrical and thermal specifications—core supply range of 2.375–2.625 V and industrial temperature rating—make it suitable for embedded designs that require deterministic operation and field-updatable logic.
This device is well suited for engineering teams needing a flexible, testable FPGA platform for interface logic, control functions and prototyping where ease of in-system reconfiguration, clock control and memory configurability reduce system complexity and help accelerate development cycles.
Request a quote or contact sales to discuss availability, pricing, and how the XCV100-4TQ144I can fit into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








