XCV100-5BG256C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA |
|---|---|
| Quantity | 1,411 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-5BG256C – Virtex® Field Programmable Gate Array (FPGA), 256-BBGA
The XCV100-5BG256C is an FPGA device in the Virtex family designed for high-performance, reprogrammable digital logic. It employs an SRAM-based architecture with on-chip configuration memory and a rich set of logic, routing, and I/O resources for system-level integration.
Targeted at commercial embedded and system designs, this device provides a balance of logic capacity, embedded memory, and flexible I/O in a 256-ball BGA package, enabling applications that require in-system reconfigurability and robust clock and interface support.
Key Features
- Logic Capacity — Approximately 2,700 logic elements (20×30 CLB array) providing 108,904 system gate equivalents for medium-density programmable logic.
- Embedded Memory — Approximately 40,960 bits of on-chip RAM for data buffering and small on-chip storage.
- I/O Resources — Up to 180 user I/O pins to support diverse peripheral and bus interfaces.
- Clock Management — Family-level clock features include multiple DLLs and hierarchical global/secondary clock nets for advanced clock control and low-skew distribution.
- Configurable Fabric — LUTs configurable as RAM or shift registers, dedicated carry logic and multiplier support, and abundant registers for arithmetic and control logic.
- SRAM-Based Reprogrammability — In-system configuration with multiple programming modes and unlimited re-programmability suitable for iterative development and field updates.
- Package and Mounting — 256-BBGA package; supplier device package listed as 256-PBGA (27×27). Surface-mount mounting type.
- Power and Temperature — Core voltage supply range 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- System Prototyping and Development — Reprogrammable logic and in-system configuration make the device suitable for iterative hardware development and proof-of-concept designs.
- Interface and Bus Bridging — Up to 180 I/Os and multi-standard SelectIO family capabilities support implementation of custom interface logic and bus bridging functions.
- Embedded Control and Glue Logic — Medium-density logic and on-chip RAM enable integration of control state machines, peripherals, and glue logic within a single device.
- Compact PCI / PCI-Related Systems — Family documentation highlights PCI-compliant operation and Compact PCI hot-swap use cases, applicable where those interface standards are required.
Unique Advantages
- Flexible Reprogrammability — SRAM-based architecture with multiple programming modes supports repeated in-system updates and iterative design refinement.
- Balanced Resource Mix — A combination of ~2,700 logic elements, ~40,960 bits of on-chip RAM, and 180 I/Os reduces the need for external glue logic in medium-complexity designs.
- Advanced Clock and Routing — On-chip clock-management features and hierarchical routing provide deterministic clock distribution and support for complex timing domains.
- Compact, Surface-Mount Package — 256-ball BGA packaging (supplier 256-PBGA, 27×27) enables high-density PCB layouts while maintaining broad I/O capability.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly workflows.
Why Choose XCV100-5BG256C?
The XCV100-5BG256C delivers a practical combination of logic density, embedded memory, and flexible I/O in a reprogrammable Virtex FPGA architecture. Its SRAM-based configuration, on-chip clock-management resources, and dedicated arithmetic support make it well suited for developers needing medium-density programmable logic with predictable timing and in-system update capabilities.
This device is appropriate for commercial embedded systems, interface bridging, and prototyping workflows where reconfigurability, a compact BGA package, and a defined commercial temperature range are required. Its RoHS compliance and surface-mount packaging support common manufacturing and assembly processes.
Request a quote or submit an RFQ to receive pricing and availability for the XCV100-5BG256C. Our team can help you evaluate part suitability for your design and provide lead-time information.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








