XCV100-5FG256I

The XCV100-5FG256I is an SRAM-based Virtex FPGA offering 2,700 logic elements and approximately 40,960 bits of embedded RAM in a 256‑FBGA (17×17) package. Designed for reprogrammable, high-performance digital designs, this device provides flexible I/O, on-chip memory resources and clock-management features suitable for industrial applications operating from -40°C to 100°C.

This FPGA is targeted at designers requiring in-system programmability, multi-standard I/O interfacing and a compact surface-mount package for board-level integration.

Key Features

• Logic Capacity  2,700 logic elements (CLB array) and approximately 108,904 system gates provide a balance of density and routing resources for moderate-complexity programmable logic designs.
• Embedded Memory  Approximately 40,960 bits of on-chip RAM and configurable LUT-based RAM modes support a variety of embedded storage and buffering functions.
• Multi-Standard SelectIO  Support for multiple high-performance interface standards enables direct connection to a variety of external devices, including direct connection to ZBTRAM devices as documented for the Virtex family.
• Clock Management  Built-in clock-management circuitry (including four dedicated DLLs and multiple global and local clock distribution nets) helps implement advanced clocking schemes and low-skew distribution.
• I/O and Pin Count  176 available I/O pins provide extensive external connectivity for interfaces, peripherals and board-level I/O routing.
• Package and Mounting  256‑FBGA (17×17) surface-mount package simplifies integration on modern PCBs where small-footprint, high-density routing is required.
• Power and Operating Range  Core supply voltage range of 2.375 V to 2.625 V and an operating temperature range of -40°C to 100°C accommodate industrial temperature environments.
• System-Level Features  SRAM-based in-system configuration provides unlimited reprogrammability and multiple programming modes for design iteration and field updates.
• Standards and Performance  Family-level attributes include system performance up to 200 MHz and 66‑MHz PCI compliance for legacy interface compatibility (as specified in the Virtex documentation).
• Compliance  RoHS compliant for regulatory and assembly process compatibility.

Typical Applications

• PCI and Compact PCI expansion  Use in PCI-compliant systems and hot-swappable Compact PCI modules where reprogrammable logic and board-level I/O density are required.
• Interface bridging and memory control  Multi-standard SelectIO and direct connection capability to ZBTRAM devices make the device suitable for protocol bridging and external memory interfacing.
• Industrial control and automation  Industrial-grade operating temperature and surface-mount 256‑FBGA packaging support embedded control, sensor interfacing and motor-control logic in industrial environments.
• In-system configurable prototypes  SRAM-based configuration and unlimited re-programmability enable iterative hardware development, FPGA-based prototypes and field-upgradable products.

Unique Advantages

• Reprogrammable platform:  SRAM-based in-system configuration enables design updates and field revisions without board-level hardware changes.
• Balanced logic and memory:  2,700 logic elements combined with approximately 40,960 bits of embedded RAM provide a versatile mix for control logic, buffering and small to moderate data-path tasks.
• Robust clocking:  Dedicated DLLs and hierarchical clock distribution allow precise timing control for synchronous designs and multi-clock domains.
• Flexible I/O connectivity:  176 I/O pins and multi-standard SelectIO support a wide range of external interfaces and memory connections.
• Industrial readiness:  Rated for -40°C to 100°C operation and supplied in a 256‑FBGA surface-mount package for integration into industrial-grade assemblies.
• Regulatory-friendly:  RoHS compliance supports environmentally constrained production and assembly processes.

Why Choose XCV100-5FG256I?

The XCV100-5FG256I delivers a compact, reprogrammable FPGA solution that combines a moderate logic element count with substantive on-chip RAM and flexible I/O in a 256‑FBGA package. Its built-in clock management, multi-standard I/O capabilities and in-system configurability make it well suited for designers who need a field-upgradable platform with industrial operating range and robust board-level integration.

This device is appropriate for teams developing PCI/Compact PCI modules, interface bridges, industrial control logic and iterative hardware prototypes where reprogrammability, predictable timing resources and package density are key selection criteria.

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