XCV100-5TQ144C

IC FPGA 98 I/O 144TQFP
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 98 40960 2700 144-LQFP

Quantity 384 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O98Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-5TQ144C – Virtex® FPGA, 98 I/O, 40,960-bit RAM, 2,700 logic cells, 144-LQFP

The XCV100-5TQ144C is a Virtex® Field Programmable Gate Array (FPGA) from AMD offered in a 144-LQFP package. This SRAM-based FPGA provides a flexible logic fabric with 2,700 logic cells (20×30 CLB array), approximately 108,904 system gates, and 40,960 bits of embedded RAM suited for reprogrammable digital designs.

Engineered for applications requiring dense programmable logic, multi-standard I/O and on-chip memory, the device targets system prototyping, communications and embedded processing platforms that benefit from in-system reconfigurability and integrated clock-management features.

Key Features

  • Logic Capacity — 2,700 logic cells across a 20×30 CLB array (600 configurable logic blocks) and approximately 108,904 system gates to implement complex logic functions and custom datapaths.
  • On-Chip Memory — 40,960 total RAM bits of embedded memory for LUT-configurable RAM, dual-ported RAM, and shift-register configurations to support buffers, FIFOs and small data stores.
  • I/O — 98 user I/O pins with multi-standard SelectIO capability (series-level feature) to support a range of interface standards.
  • Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced timing control.
  • Configuration — SRAM-based in-system configuration enabling unlimited re-programmability and multiple programming modes for field updates and iterative development.
  • Process and Testing — Implemented in a 0.22 μm 5-layer-metal CMOS process and 100% factory tested per the series product specification.
  • Power and Supply — Nominal voltage supply range of 2.375 V to 2.625 V for core operation; surface-mount 144-LQFP package (supplier device package: 144-TQFP 20×20).
  • Commercial Temperature — Rated for commercial operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Communications Equipment — Implement protocol processing, packet buffering and custom interface bridging using on-chip RAM and flexible I/O.
  • System Prototyping — Rapid iteration of ASIC alternatives, algorithm verification and proof-of-concept designs leveraging in-system reprogrammability.
  • Embedded Processing — Custom datapath acceleration and glue logic for embedded controllers and DSP pre/post-processing with integrated memory and clock management.
  • PCI and Compact Systems — Series-level support includes 66-MHz PCI compliance and hot-swappable Compact PCI capability for modular system designs.

Unique Advantages

  • Reprogrammable Development Flow: SRAM-based configuration enables design changes and field updates without hardware replacement, accelerating iteration cycles.
  • Balanced Logic and Memory: Combination of 2,700 logic cells and 40,960 bits of embedded RAM supports mixed-control and data buffering tasks within a single device.
  • Integrated Clock Resources: Multiple DLLs and hierarchical clock nets simplify distribution of low-skew clocks for synchronous designs.
  • Proven Architecture and Tool Support: Backed by the Virtex family development ecosystem and supported design flows referenced in the product specification for streamlined implementation.
  • Compact, Surface-Mount Packaging: 144-LQFP (144-TQFP 20×20) provides a high-pin-count surface-mount footprint for space-constrained boards.

Why Choose XCV100-5TQ144C?

The XCV100-5TQ144C positions itself as a capable, reprogrammable logic device combining medium-density logic, on-chip memory and robust clock-management features in a compact 144-LQFP package. Its SRAM-based architecture and multiple configuration modes make it suitable for teams that require design flexibility and iterative development across communications, embedded processing and prototyping projects.

With clear electrical and environmental specifications—2.375 V to 2.625 V core supply, 0 °C to 85 °C operating range, surface-mount packaging and RoHS compliance—this Virtex FPGA offers a verifiable, supported platform for implementing custom logic, interface bridging and memory-centric functions.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XCV100-5TQ144C. Our team will assist with lead times and ordering details.

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