XCV100-6BG256C

IC FPGA 180 I/O 256BGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA

Quantity 1,072 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BBGANumber of I/O180Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-6BG256C – Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA

The XCV100-6BG256C is an AMD Virtex-series FPGA offering programmable, SRAM-based logic in a 256-BBGA package. It provides 2,700 logic elements, approximately 40 kbits of embedded RAM, and 180 user I/O pins for medium-density, high-performance programmable designs.

Designed for commercial-temperature applications, this device supports in-system reconfiguration and a wide set of on-chip resources—making it suitable for prototype systems, interface bridging, and designs that require flexible I/O and on-chip memory. Core supply voltage is 2.375 V to 2.625 V.

Key Features

  • Programmable Logic Capacity — 2,700 logic elements and 108,904 system gates provide substantial programmable resources for mid-scale designs.
  • Embedded Memory — Approximately 40,960 bits of on-chip RAM for buffering, small FIFOs, and local data storage.
  • Rich I/O — 180 user I/Os to support multi-channel interfaces and diverse board-level connectivity.
  • Package and Mounting — 256-BBGA package (supplier designation 256-PBGA 27×27) with surface-mount mounting for dense board layouts.
  • SRAM-based In-System Configuration — SRAM configuration with unlimited re-programmability and multiple programming modes for flexible development and field updates.
  • Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs) and dedicated global/ local clock nets for advanced timing control.
  • Advanced Architecture — Dedicated carry logic and multiplier support, cascade chains for wide functions, and abundant registers for high-performance arithmetic and control.
  • Family-Level Performance — Virtex family architecture supporting system performance up to 200 MHz and 66-MHz PCI compliance as described for the series.
  • Commercial Temperature Rating — Rated for 0 °C to 85 °C operation.
  • RoHS Compliant — Device meets RoHS requirements for environmental compliance.

Typical Applications

  • PCI and Compact PCI Interfaces — Implement PCI-compliant logic paths and Compact PCI hot-swap functionality using the device's multi-standard I/O and system-level timing features.
  • Embedded System Prototyping — Rapid, in-system reconfiguration enables iterative development of control logic, data paths, and system integration tasks.
  • High‑performance Data Path and Buffering — On-chip RAM and dedicated arithmetic resources support packet buffering, small FIFOs, and compute-intensive datapath functions.
  • Multi‑standard I/O Bridging — Multi-standard SelectIO-style interfaces accommodate diverse external memory and peripheral signaling options for interface conversion and bridging.

Unique Advantages

  • Flexible Re-programmability: SRAM-based configuration allows unlimited re-programmability and multiple programming modes for iterative development and field updates.
  • Balanced Compute and Memory: 2,700 logic elements paired with approximately 40 kbits of embedded RAM supports both control logic and local data storage on a single device.
  • Comprehensive Clock Control: Four DLLs and hierarchical clock distribution enable precise timing strategies for synchronous designs.
  • Broad I/O Count: 180 I/Os provide connectivity headroom to integrate multiple peripherals and buses without external multiplexing.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and 100% factory tested as part of the Virtex family specification.

Why Choose XCV100-6BG256C?

The XCV100-6BG256C positions itself as a versatile mid-density Virtex FPGA that combines a balanced set of logic, memory, and I/O resources in a compact 256-BBGA package. Its SRAM-based in-system configuration, dedicated clock-management blocks, and arithmetic support make it well suited to engineers building prototype systems, interface logic, and medium-complexity datapath designs.

Backed by the Virtex family architecture and AMD manufacturing, this device offers predictable electrical characteristics (2.375 V to 2.625 V supply) and RoHS compliance, helping teams shorten development cycles while preserving design flexibility and upgradability.

If you would like pricing, availability, or to request a quote for the XCV100-6BG256C, please submit a quote request or contact sales for further assistance.

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