XCV100-6BG256C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA |
|---|---|
| Quantity | 1,072 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BBGA | Number of I/O | 180 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-6BG256C – Virtex® Field Programmable Gate Array (FPGA) IC 180 40960 2700 256-BBGA
The XCV100-6BG256C is an AMD Virtex-series FPGA offering programmable, SRAM-based logic in a 256-BBGA package. It provides 2,700 logic elements, approximately 40 kbits of embedded RAM, and 180 user I/O pins for medium-density, high-performance programmable designs.
Designed for commercial-temperature applications, this device supports in-system reconfiguration and a wide set of on-chip resources—making it suitable for prototype systems, interface bridging, and designs that require flexible I/O and on-chip memory. Core supply voltage is 2.375 V to 2.625 V.
Key Features
- Programmable Logic Capacity — 2,700 logic elements and 108,904 system gates provide substantial programmable resources for mid-scale designs.
- Embedded Memory — Approximately 40,960 bits of on-chip RAM for buffering, small FIFOs, and local data storage.
- Rich I/O — 180 user I/Os to support multi-channel interfaces and diverse board-level connectivity.
- Package and Mounting — 256-BBGA package (supplier designation 256-PBGA 27×27) with surface-mount mounting for dense board layouts.
- SRAM-based In-System Configuration — SRAM configuration with unlimited re-programmability and multiple programming modes for flexible development and field updates.
- Clock Management — Built-in clock-management circuitry including four delay-locked loops (DLLs) and dedicated global/ local clock nets for advanced timing control.
- Advanced Architecture — Dedicated carry logic and multiplier support, cascade chains for wide functions, and abundant registers for high-performance arithmetic and control.
- Family-Level Performance — Virtex family architecture supporting system performance up to 200 MHz and 66-MHz PCI compliance as described for the series.
- Commercial Temperature Rating — Rated for 0 °C to 85 °C operation.
- RoHS Compliant — Device meets RoHS requirements for environmental compliance.
Typical Applications
- PCI and Compact PCI Interfaces — Implement PCI-compliant logic paths and Compact PCI hot-swap functionality using the device's multi-standard I/O and system-level timing features.
- Embedded System Prototyping — Rapid, in-system reconfiguration enables iterative development of control logic, data paths, and system integration tasks.
- High‑performance Data Path and Buffering — On-chip RAM and dedicated arithmetic resources support packet buffering, small FIFOs, and compute-intensive datapath functions.
- Multi‑standard I/O Bridging — Multi-standard SelectIO-style interfaces accommodate diverse external memory and peripheral signaling options for interface conversion and bridging.
Unique Advantages
- Flexible Re-programmability: SRAM-based configuration allows unlimited re-programmability and multiple programming modes for iterative development and field updates.
- Balanced Compute and Memory: 2,700 logic elements paired with approximately 40 kbits of embedded RAM supports both control logic and local data storage on a single device.
- Comprehensive Clock Control: Four DLLs and hierarchical clock distribution enable precise timing strategies for synchronous designs.
- Broad I/O Count: 180 I/Os provide connectivity headroom to integrate multiple peripherals and buses without external multiplexing.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and 100% factory tested as part of the Virtex family specification.
Why Choose XCV100-6BG256C?
The XCV100-6BG256C positions itself as a versatile mid-density Virtex FPGA that combines a balanced set of logic, memory, and I/O resources in a compact 256-BBGA package. Its SRAM-based in-system configuration, dedicated clock-management blocks, and arithmetic support make it well suited to engineers building prototype systems, interface logic, and medium-complexity datapath designs.
Backed by the Virtex family architecture and AMD manufacturing, this device offers predictable electrical characteristics (2.375 V to 2.625 V supply) and RoHS compliance, helping teams shorten development cycles while preserving design flexibility and upgradability.
If you would like pricing, availability, or to request a quote for the XCV100-6BG256C, please submit a quote request or contact sales for further assistance.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








