XCV100-6FG256C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA |
|---|---|
| Quantity | 991 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 108904 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 40960 |
Overview of XCV100-6FG256C – Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA
The XCV100-6FG256C is a Virtex® SRAM-based Field Programmable Gate Array designed for high-performance, reprogrammable digital logic. Built on the Virtex family architecture, it delivers a balance of density and speed suitable for systems requiring fast, flexible programmable logic and on-chip memory resources.
Key strengths include a large logic resource set, substantial embedded RAM, a 176-pin I/O complement, and support for standard in-system configuration modes, making it applicable to PCI and Compact PCI-capable system designs and other high-performance embedded applications.
Key Features
- Logic Capacity — Approximately 2,700 logic elements and 108,904 system gates provide a substantial fabric for implementing complex digital functions.
- Embedded Memory — Approximately 40,960 bits of on-chip RAM for data buffering, FIFOs and small on-chip storage requirements.
- I/O Resources — 176 user I/O pins to support broad interfacing needs with external devices and subsystems.
- Clock and Timing — Built-in clock-management features in the Virtex family include multiple DLLs and hierarchical global/local clock distribution for advanced clock control and low skew.
- Arithmetic and Logic Support — Architecture includes dedicated carry logic and multiplier support for efficient arithmetic operations and DSP-oriented functions.
- Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes enables unlimited re-programmability and flexibility during development and deployment.
- Package and Mounting — Supplied in a 256-ball BGA (256-FBGA, 17×17) surface-mount package for compact board-level integration.
- Power and Operating Range — Core supply specified from 2.375 V to 2.625 V; commercial operating temperature range of 0 °C to 85 °C.
- Manufacturing and Compliance — RoHS compliant and 100% factory tested as part of the Virtex product family.
Typical Applications
- PCI and Compact PCI Systems — Suitable for designs that require 66‑MHz PCI-compliant interfaces and hot‑swappable Compact PCI operation as supported by the Virtex family.
- High-performance Embedded Processing — Use for custom control logic, protocol handling, or hardware acceleration leveraging dedicated arithmetic resources and on-chip RAM.
- Prototyping and Mask‑Programmed Replacement — Ideal for replacing or validating mask-programmed gate arrays during development with reprogrammable logic.
- Interface Bridging and Glue Logic — 176 I/Os and flexible I/O standards in the Virtex family make it well-suited for complex interface aggregation and protocol bridging tasks.
Unique Advantages
- Reprogrammable Flexibility: SRAM-based configuration enables unlimited reprogramming cycles for iterative development and field updates.
- Balanced Performance and Density: The combination of ~2,700 logic elements and ~40,960 bits of embedded RAM supports compact implementations of complex logic without excessive external memory.
- Robust Clock Management: Multiple DLLs and hierarchical clock nets from the Virtex architecture help achieve low-skew, high-frequency system timing.
- Broad I/O Capability: 176 I/O pins provide the connectivity needed to interface with a wide range of peripherals and external memory devices.
- Compact, Board-Ready Package: 256-ball FBGA (17×17) supports high-density PCB layouts and surface-mount assembly processes.
- Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic systems.
Why Choose XCV100-6FG256C?
The XCV100-6FG256C brings proven Virtex-series FPGA capabilities—rich logic resources, embedded RAM, comprehensive clock control and configurable I/O—into a compact 256‑ball BGA package. Its balance of reprogrammability, arithmetic support, and on-chip memory makes it a practical choice for engineers developing high-performance embedded systems, PCI/Compact PCI designs, and hardware prototypes that benefit from in-field updates and iterative design.
Supported by the Virtex development ecosystem and factory-tested production, the part offers designers an established platform for scalable logic implementations where commercial‑grade thermal and voltage ranges are required.
Request a quote or submit a purchase inquiry to get pricing, availability, and lead-time information for the XCV100-6FG256C. Our team can provide the details needed to integrate this Virtex FPGA into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








