XCV100-6FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA

Quantity 991 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates108904ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of XCV100-6FG256C – Virtex® Field Programmable Gate Array (FPGA) IC 176 40960 2700 256-BGA

The XCV100-6FG256C is a Virtex® SRAM-based Field Programmable Gate Array designed for high-performance, reprogrammable digital logic. Built on the Virtex family architecture, it delivers a balance of density and speed suitable for systems requiring fast, flexible programmable logic and on-chip memory resources.

Key strengths include a large logic resource set, substantial embedded RAM, a 176-pin I/O complement, and support for standard in-system configuration modes, making it applicable to PCI and Compact PCI-capable system designs and other high-performance embedded applications.

Key Features

  • Logic Capacity — Approximately 2,700 logic elements and 108,904 system gates provide a substantial fabric for implementing complex digital functions.
  • Embedded Memory — Approximately 40,960 bits of on-chip RAM for data buffering, FIFOs and small on-chip storage requirements.
  • I/O Resources — 176 user I/O pins to support broad interfacing needs with external devices and subsystems.
  • Clock and Timing — Built-in clock-management features in the Virtex family include multiple DLLs and hierarchical global/local clock distribution for advanced clock control and low skew.
  • Arithmetic and Logic Support — Architecture includes dedicated carry logic and multiplier support for efficient arithmetic operations and DSP-oriented functions.
  • Configuration and Re-programmability — SRAM-based in-system configuration with multiple programming modes enables unlimited re-programmability and flexibility during development and deployment.
  • Package and Mounting — Supplied in a 256-ball BGA (256-FBGA, 17×17) surface-mount package for compact board-level integration.
  • Power and Operating Range — Core supply specified from 2.375 V to 2.625 V; commercial operating temperature range of 0 °C to 85 °C.
  • Manufacturing and Compliance — RoHS compliant and 100% factory tested as part of the Virtex product family.

Typical Applications

  • PCI and Compact PCI Systems — Suitable for designs that require 66‑MHz PCI-compliant interfaces and hot‑swappable Compact PCI operation as supported by the Virtex family.
  • High-performance Embedded Processing — Use for custom control logic, protocol handling, or hardware acceleration leveraging dedicated arithmetic resources and on-chip RAM.
  • Prototyping and Mask‑Programmed Replacement — Ideal for replacing or validating mask-programmed gate arrays during development with reprogrammable logic.
  • Interface Bridging and Glue Logic — 176 I/Os and flexible I/O standards in the Virtex family make it well-suited for complex interface aggregation and protocol bridging tasks.

Unique Advantages

  • Reprogrammable Flexibility: SRAM-based configuration enables unlimited reprogramming cycles for iterative development and field updates.
  • Balanced Performance and Density: The combination of ~2,700 logic elements and ~40,960 bits of embedded RAM supports compact implementations of complex logic without excessive external memory.
  • Robust Clock Management: Multiple DLLs and hierarchical clock nets from the Virtex architecture help achieve low-skew, high-frequency system timing.
  • Broad I/O Capability: 176 I/O pins provide the connectivity needed to interface with a wide range of peripherals and external memory devices.
  • Compact, Board-Ready Package: 256-ball FBGA (17×17) supports high-density PCB layouts and surface-mount assembly processes.
  • Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic systems.

Why Choose XCV100-6FG256C?

The XCV100-6FG256C brings proven Virtex-series FPGA capabilities—rich logic resources, embedded RAM, comprehensive clock control and configurable I/O—into a compact 256‑ball BGA package. Its balance of reprogrammability, arithmetic support, and on-chip memory makes it a practical choice for engineers developing high-performance embedded systems, PCI/Compact PCI designs, and hardware prototypes that benefit from in-field updates and iterative design.

Supported by the Virtex development ecosystem and factory-tested production, the part offers designers an established platform for scalable logic implementations where commercial‑grade thermal and voltage ranges are required.

Request a quote or submit a purchase inquiry to get pricing, availability, and lead-time information for the XCV100-6FG256C. Our team can provide the details needed to integrate this Virtex FPGA into your next design.

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