XCV1000-4BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal

Quantity 28 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1124022ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV1000-4BG560I – Virtex® Field Programmable Gate Array (FPGA) IC, 404 I/O, 27,648 logic elements

The XCV1000-4BG560I is a Virtex family SRAM-based Field Programmable Gate Array from AMD designed for high-density, reprogrammable logic implementations. It combines extensive logic capacity with embedded memory and flexible I/O to address complex digital designs.

Targeted at system-level and industrial applications that require configurable logic, high I/O counts, and reliable operation across a wide temperature range, this device delivers a balance of performance, integration, and on-board resources for prototyping, communications, and embedded processing tasks.

Key Features

  • Core architecture Built on a 0.22 μm, 5-layer-metal CMOS process; SRAM-based configuration enables unlimited re-programmability and multiple configuration modes.
  • Logic capacity Approximately 27,648 logic elements and 1,124,022 system gates for implementing large, complex designs.
  • Embedded memory Approximately 131,072 bits (~0.13 Mbits) of on-chip RAM and configurable LUT-based RAM options for local storage and buffering.
  • I/O and interface flexibility 404 user I/O pins with multi-standard SelectIO support and family-level features such as 16 high-performance interface standards and 66-MHz PCI compliance for board- and system-level interfacing.
  • Clock management Four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets and multiple local clock nets for precise clock control.
  • Arithmetic and DSP support Dedicated carry logic, multiplier support, and cascade chaining for high-speed arithmetic and wide-input functions.
  • Configuration modes SRAM-based in-system configuration with four programming modes, including Select-MAP, slave serial, JTAG, and master serial options.
  • Package, power and thermal 560-LBGA exposed pad metal package (560-MBGA, 42.5×42.5 mm supplier package), surface-mount mounting, 2.375 V to 2.625 V core supply range, and rated for operation from −40 °C to 100 °C.
  • Compliance and testing RoHS compliant and 100% factory tested per device-family specification.

Typical Applications

  • PCI and CompactPCI systems — Leverage the device’s 66-MHz PCI compliance and hot-swappable family-level support for board-level interfaces and expansion cards.
  • High-speed interface bridging — Use the 404 I/O pins and SelectIO multi-standard support to implement protocol translators, protocol aggregation, and custom I/O logic.
  • Digital signal processing and arithmetic acceleration — Dedicated multipliers and carry chains enable implementation of DSP kernels, filters, and arithmetic-heavy blocks.
  • System prototyping and configurable logic — SRAM-based, reprogrammable architecture is suited for iterative development and hardware emulation of complex logic designs.

Unique Advantages

  • Highly reconfigurable hardware: SRAM-based architecture provides unlimited re-programmability and multiple configuration modes to accelerate development cycles.
  • Substantial logic and gate density: 27,648 logic elements and over 1.1 million gates enable integration of complex functions that reduce external component count.
  • Flexible I/O ecosystem: 404 I/Os and multi-standard interface support simplify connection to a wide range of peripherals and memory devices.
  • Integrated clock control: Multiple DLLs and global/local clock nets minimize external clocking complexity for multi-domain designs.
  • Industrial temperature rating: −40 °C to 100 °C operating range and robust LBGA packaging support deployment in industrial environments.

Why Choose XCV1000-4BG560I?

The XCV1000-4BG560I positions itself as a high-capacity, reprogrammable FPGA well suited to engineers building complex, interface-rich systems. Its combination of abundant logic elements, embedded memory, extensive I/O, and on-chip clock-management resources helps consolidate functions, reduce BOM complexity, and accelerate time-to-prototype.

This device is appropriate for teams needing a scalable, field-reprogrammable platform with industrial temperature support and established configuration options. Its family-level features and factory testing provide a predictable foundation for system designs that require flexibility and reliable operation.

Request a quote or submit availability and lead-time inquiries to receive pricing and procurement details for the XCV1000-4BG560I.

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