XCV1000-6BG560C

The XCV1000-6BG560C is a Virtex® SRAM-based Field Programmable Gate Array from AMD, delivered in a 560-LBGA exposed-pad metal package. It combines a high logic capacity and abundant I/O with a hierarchical memory and clock-management architecture suitable for demanding programmable-logic applications.

Designed for commercial-grade systems, this device targets applications requiring dense programmable logic, flexible I/O support, and on-chip memory for buffering and state storage while operating within a 2.375 V to 2.625 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 27,648 logic elements and approximately 1,124,022 system gates provide the programmable fabric needed for complex custom logic and system functions.
• Embedded Memory — Approximately 0.13 Mbits of on-chip RAM (131,072 bits) supports LUT-based RAM, dual-ported block RAM, and SelectRAM+ configurations for data buffering and temporary storage.
• I/O and Interface Flexibility — 404 user I/O pins with multi-standard SelectIO™ capabilities enable direct interfacing to a variety of external memory and peripheral devices.
• Clock Management — Integrated clock-management resources include multiple dedicated delay-locked loops and global/local clock distribution to support synchronized, low-skew designs.
• Package and Mounting — 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) with surface-mount construction for compact board integration and thermal conduction.
• Supply and Temperature — Core supply range of 2.375 V to 2.625 V and commercial operating temperature from 0 °C to 85 °C for mainstream electronic applications.
• Configuration and Fabric — SRAM-based, reprogrammable architecture with support for multiple configuration modes and a process optimized for place-and-route efficiency.
• Compliance — RoHS compliant, aligning with standard lead-free manufacturing requirements.

Typical Applications

• PCI and CompactPCI Systems — Family-level PCI compliance and hot-swap support make this device suitable for programmable logic in PCI/CompactPCI platforms and add-in cards.
• High-density Logic Integration — Use as a central programmable fabric for complex control, data-path processing, and custom logic consolidation in embedded systems.
• Memory Interface and Bridging — On-chip RAM and flexible I/O enable fast interfaces to external high-performance memories and bridging between heterogeneous peripherals.
• Prototyping and System Development — Reprogrammable SRAM-based configuration supports iterative development and in-system testing of digital designs.

Unique Advantages

• Substantial Logic and Gate Count: 27,648 logic elements and over 1.1 million gates provide the capacity to implement large, complex designs without external FPGA partitioning.
• Flexible Embedded Memory: 131,072 bits of on-chip RAM configured for LUT-RAMs and block RAMs reduces dependency on external buffering for many designs.
• Robust Clocking Resources: Dedicated DLLs and multi-tier clock distribution simplify timing management for synchronous, high-performance designs.
• Extensive I/O: 404 I/O pins with multi-standard SelectIO support simplify integration with diverse external devices and memory types.
• Surface-Mount 560-LBGA Package: A compact 42.5 × 42.5 mm MBGA package with exposed pad enables effective thermal conduction and high-density board layouts.
• Reprogrammable SRAM Architecture: In-system reprogramming supports iterative development cycles and field updates without hardware replacement.

Why Choose XCV1000-6BG560C?

The XCV1000-6BG560C positions itself as a high-capacity, commercial-grade Virtex FPGA that balances logic density, embedded memory, and flexible I/O in a single surface-mount package. Its combination of 27,648 logic elements, substantial on-chip RAM, and advanced clocking resources make it well suited for designers who need a programmable platform for complex data-paths, protocol bridging, and system-level logic consolidation.

For teams focused on scalability and iterative development, the SRAM-based reprogrammability and broad tooling support inherent to the Virtex family help accelerate time-to-innovation while maintaining a compact BOM and reliable board-level integration.

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