XCV1000E-6BG560C

The XCV1000E-6BG560C is a Virtex‑E family FPGA supplied in a 560‑ball LFBGA with exposed pad, offering high logic density and flexible I/O for commercial embedded and communications applications. This device combines 27,648 logic elements with approximately 0.39 Mbits of on‑chip RAM and 404 user I/O pins for complex digital designs.

Built around the Virtex‑E architecture, the device supports high‑performance interfaces and memory subsystem designs while operating from a 1.71 V to 1.89 V internal supply and across a 0 °C to 85 °C commercial temperature range. It is RoHS compliant and supplied in a 560‑MBGA (42.5 × 42.5 mm) package with an exposed metal pad for thermal performance.

Key Features

• Core & Logic 27,648 logic elements and approximately 1,569,178 equivalent gates provide substantial programmable logic capacity for mid‑to‑high complexity designs.
• Embedded Memory 393,216 total RAM bits (approximately 0.39 Mbits) of on‑chip memory for local buffering, FIFOs, and small storage structures. The Virtex‑E family also documents configurable distributed RAM and block SelectRAM resources.
• I/O Count & Standards 404 user I/O pins support a wide range of signaling. Family features include differential signaling standards such as LVDS, BLVDS and LVPECL and PCI‑compliant operation for 3.3 V, 32/64‑bit, 33/66 MHz systems.
• Clocking & Timing Virtex‑E family clock management includes multiple digital DLLs (eight per family specification) and support for high‑frequency LVPECL/LVDS clock inputs—enabling robust clocking and DDR-friendly timing.
• Power Supply & Operation Internal supply VCCINT range 1.71 V to 1.89 V. Designed for lower internal power operation characteristic of the Virtex‑E process node and architecture.
• Package & Thermal 560‑LBGA exposed pad, metal package (supplier device package: 560‑MBGA, 42.5 × 42.5 mm) for reliable surface‑mount mounting and thermal dissipation.
• Quality & Compliance Commercial grade device with 0 °C to 85 °C operating temperature and RoHS compliance; the Virtex‑E family is described as 100% factory tested in the product specification.

Typical Applications

• High‑speed interfaces and communications — Use the device where multi‑Gb/s aggregate bandwidth and flexible differential I/O standards are required for protocol bridging and data plane processing.
• Memory controller and buffering — Suitable for designs that need coordinated external memory interfaces such as DDR SDRAM and ZBT SRAM as described by the Virtex‑E family features.
• PCI‑based expansion and host interfaces — Supports PCI 3.3 V, 32/64‑bit, 33/66‑MHz operation for expansion cards and host peripheral implementations.
• In‑system configurable designs and prototyping — SRAM‑based, reprogrammable architecture enables iterative hardware development and field updates.

Unique Advantages

• Substantial programmable capacity: 27,648 logic elements deliver room for complex state machines, datapaths, and control logic without immediate device scaling.
• Integrated on‑chip memory: Approximately 0.39 Mbits of embedded RAM reduces reliance on external buffers for many applications, simplifying BOM and board routing.
• Flexible, high‑performance I/O: 404 I/O pins and family support for multiple differential standards enable diverse interface topologies and high aggregate bandwidth.
• Robust clock management: Family clocking features such as multiple DLLs and DDR‑friendly clock handling simplify timing for high‑speed designs.
• Commercial supply and compliance: Commercial temperature range, RoHS compliance, and factory testing support predictable procurement and manufacturing flow.

Why Choose XCV1000E-6BG560C?

The XCV1000E-6BG560C positions itself as a versatile Virtex‑E FPGA option for commercial embedded and communications designs that require a balance of logic capacity, embedded memory, and flexible I/O. Its 27,648 logic elements, substantial I/O count, and documented Virtex‑E family features for high‑speed interfaces make it suitable for complex interfacing, memory subsystem, and reconfigurable logic tasks.

Engineers and procurement teams benefit from a device that aligns with established Virtex‑E architecture capabilities while offering RoHS compliance and standard commercial operating conditions. The combination of programmable resources, I/O flexibility, and package thermal considerations supports mid‑level system designs that demand performance and reconfigurability.

If you would like pricing or availability details for XCV1000E-6BG560C, request a quote or submit a purchase inquiry and our team will respond with the latest commercial information.