XCV1000E-6BG560I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 404 393216 27648 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 426 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 27648 | ||
| Number of Gates | 1569178 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 393216 |
Overview of XCV1000E-6BG560I – Virtex®-E FPGA, 560-LBGA
The XCV1000E-6BG560I is a Virtex®-E series field programmable gate array (FPGA) supplied by AMD, offered in a 560-pin LBGA exposed-pad metal package. This industrial-grade, surface-mount device provides high logic density, significant embedded RAM and a large I/O count to support complex digital designs.
Targeted at industrial and high-performance embedded systems, the device combines 27,648 logic elements, approximately 0.39 Mbits of on-chip RAM and 404 user I/Os with the Virtex‑E series’ advanced clocking and high-speed interface capabilities to address demanding interface, memory and I/O-centric applications.
Key Features
- Core Logic 27,648 logic elements and approximately 1,569,178 gates provide substantial programmable logic capacity for complex functions and custom accelerators.
- Embedded Memory Approximately 0.39 Mbits (393,216 bits) of on-chip RAM for local buffering, lookup tables and state storage.
- I/O Density 404 user I/Os enable wide interfacing options for parallel buses, memory interfaces and multi-channel I/O systems.
- Voltage and Power Internal supply range 1.71 V to 1.89 V (1.8 V family), consistent with the Virtex‑E 1.8 V architecture.
- Clocking and Timing (series features) Virtex‑E family features such as eight fully digital DLLs and series-level internal performance characteristics support precise clock management and synchronous designs.
- Memory/Interface Performance (series features) The Virtex‑E family includes a flexible SelectRAM+ memory hierarchy and high-performance external memory interfacing options to support demanding bandwidth requirements.
- Package & Mounting 560-LBGA exposed pad, metal package (560-MBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly and thermal conduction.
- Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental compatibility.
Typical Applications
- Industrial Control High I/O count and industrial temperature rating make the device suitable for motor control, PLCs and complex automation logic.
- High‑Performance Interfaces Large I/O complement and series-level high-speed interface features support bridging, protocol adaptation and custom I/O subsystems.
- Embedded Computing & Acceleration Substantial logic element count and on-chip RAM support custom hardware acceleration and embedded processing functions.
- Memory Interface Prototyping On-chip memory and Virtex‑E series memory hierarchy features enable prototyping of external memory controllers and high-bandwidth buffering solutions.
Unique Advantages
- High Logic Capacity: 27,648 logic elements allow implementation of complex state machines, datapaths and custom accelerators without immediate need for multi‑chip partitioning.
- Generous I/O Count: 404 user I/Os reduce external glue logic and simplify board-level connectivity for wide buses and multi-channel systems.
- Industrial Reliability: −40 °C to 100 °C operating range and industrial-grade classification support deployment in harsh and temperature-variable environments.
- Package Thermal Performance: 560-LBGA with exposed pad and metal construction facilitates thermal management in dense, high-power designs.
- Standards‑Ready Series Capabilities: Virtex‑E series clocking and memory architecture features (DLLs, SelectRAM+) provide a foundation for high‑performance timing and memory interface designs.
- Regulatory Compliance: RoHS-compliant construction supports environmentally conscious product development and regulatory requirements.
Why Choose XCV1000E-6BG560I?
The XCV1000E-6BG560I brings a balanced combination of logic capacity, embedded memory and I/O density in an industrial-grade FPGA package. It is well suited for designers who need substantial on-chip resources and a high pin count for complex interfacing and acceleration tasks while maintaining industrial temperature resilience.
Choosing this device leverages the Virtex‑E series’ clocking and memory architecture for designs that require precise timing and robust memory handling. It delivers a scalable platform for mid-to-high complexity FPGA designs where performance, integration and long-term availability are key considerations.
If you would like pricing, availability or a formal quote for the XCV1000E-6BG560I, please submit a request and our team will respond with the necessary commercial details.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








