XCV1000E-6FG1156I

IC FPGA 660 I/O 1156FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 660 393216 27648 1156-BBGA

Quantity 1,830 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1156-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O660Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1569178ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits393216

Overview of XCV1000E-6FG1156I – Virtex®-E 1.8 V FPGA, 1156-BBGA

The XCV1000E-6FG1156I is a Virtex®-E field programmable gate array (FPGA) from AMD offering 27,648 logic elements, approximately 0.39 Mbits of embedded memory (393,216 bits) and 660 I/O pins in a 1156-BBGA package. It is supplied in a surface-mount 1156-FBGA (35×35) form factor and rated for industrial operation.

Designed for reprogrammable high-density logic and high-bandwidth I/O, this device supports a 1.71 V to 1.89 V core supply and operates across an extended temperature range of −40°C to 100°C. The device is RoHS compliant and includes family-level Virtex‑E features such as advanced I/O standards, SelectRAM+ memory architecture and built-in clock management circuitry.

Key Features

  • Core Architecture Virtex‑E 1.8 V FPGA family architecture implemented in a 0.18 µm, 6‑layer metal process; optimized for high-density logic integration.
  • Logic Capacity 27,648 logic elements and approximately 1,569,178 gates provide significant on-chip logic resources for complex designs.
  • Embedded Memory Approximately 0.39 Mbits (393,216 bits) of on-chip RAM. The Virtex‑E family includes the SelectRAM+ memory hierarchy and True Dual‑Port BlockRAM capability for flexible memory configurations.
  • I/O and Interface Support 660 user I/O pins. Series-level SelectI/O+ technology supports a wide range of high-performance interface standards, differential signaling (LVDS, BLVDS, LVPECL), and PCI‑compliant 3.3 V, 32/64‑bit operation at 33/66 MHz.
  • Clock Management Built-in digital clock management with eight Delay‑Locked Loops (DLLs), supporting clock multiply/divide and DDR-friendly 50% duty-cycle synthesis for high-speed clocking.
  • Package & Thermal 1156‑BBGA package (supplier device package: 1156‑FBGA, 35×35); surface mount. Industrial-grade operating temperature range −40°C to 100°C.
  • Power Core supply voltage range 1.71 V to 1.89 V to match Virtex‑E 1.8 V internal logic requirements.
  • Regulatory & Testing RoHS compliant and 100% factory tested as part of the Virtex‑E production product specification.

Typical Applications

  • High‑Speed Interface Bridging Use where PCI 3.3 V and high‑performance differential standards (LVDS/LVPECL) are required for bridging or protocol adaptation.
  • Memory Interface and Control Suitable for designs requiring high-bandwidth memory interfaces such as DDR SDRAM and ZBT SRAM support patterns described for the Virtex‑E family.
  • Complex Digital Systems Ideal for dense logic implementations and system-level integration where on-chip logic, embedded RAM and multiple DLLs simplify clocking and data-path design.

Unique Advantages

  • High-density logic integration: 27,648 logic elements enable complex designs with reduced external glue logic.
  • Substantial I/O capability: 660 I/Os accommodate wide parallel buses, differential pairs, and mixed-signal interface requirements.
  • Flexible memory architecture: Approximately 0.39 Mbits of on-chip RAM combined with SelectRAM+ family features supports diverse memory partitioning and dual-port configurations.
  • Robust clocking: Eight DLLs and DDR-oriented clock synthesis simplify phase and frequency management for high-speed data paths.
  • Industrial reliability: Surface-mount 1156‑BBGA package with −40°C to 100°C operating range and RoHS compliance for industrial environments.
  • Reprogrammable platform: SRAM-based in-system configuration enables unlimited reprogramming for iterative development and field updates.

Why Choose XCV1000E-6FG1156I?

The XCV1000E-6FG1156I delivers a balance of high logic density, extensive I/O and embedded memory in an industrial-grade 1156‑BBGA package. Its Virtex‑E family features—selectable high-performance I/O standards, advanced memory hierarchy and comprehensive clock management—make it suitable for demanding system designs that require reconfigurability and high-bandwidth interfaces.

This device is well suited to engineering teams building complex digital systems, interface bridges and memory-rich controllers who need a reprogrammable, factory-tested FPGA platform backed by the Virtex‑E development ecosystem.

Request a quote or submit an inquiry for pricing and availability for the XCV1000E-6FG1156I today.

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