XCV1000E-6FG900I

The XCV1000E-6FG900I is a Virtex®-E series FPGA supplied by AMD, designed for high-density, reprogrammable digital logic integration. This device combines 27,648 logic elements with approximately 0.39 Mbits of embedded memory and up to 660 general-purpose I/Os, making it suitable for complex control, interface and data-processing tasks in industrial applications.

Built for flexible I/O and system integration, the device operates from a 1.71 V to 1.89 V internal supply range, is provided in a 900-ball BGA package, and is rated for industrial temperature operation from –40°C to 100°C. It is RoHS compliant.

Key Features

• Logic Capacity  Provides 27,648 logic elements suitable for medium- to high-density FPGA designs.
• Embedded Memory  Approximately 0.39 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
• I/O Density and Flexibility  Up to 660 I/O pins to support broad interfacing requirements; family-level SelectI/O+ technology supports multiple high-performance interface standards and differential signaling (LVDS, BLVDS, LVPECL).
• Clocking and Timing  Family architecture includes advanced clock-management features such as multiple digital DLLs to support synthesized duty cycles and frequency multiplication for high-speed clocking.
• Packaging and Mounting  Surface-mount 900-ball BGA (supplier package: 900-FBGA, 31×31) for compact, high-pin-count system designs.
• Power  Low-voltage internal operation with VCCINT specified from 1.71 V to 1.89 V to support power-efficient designs.
• Industrial Temperature Grade  Qualified for operation from –40°C to 100°C, suitable for industrial environment deployments.
• Compliance  RoHS compliant for regulated manufacturing requirements.

Typical Applications

• High-speed I/O and Interface Bridges  Leverage the device's high I/O count and differential signaling support to implement protocol bridging, data aggregation, and interface translation.
• Embedded Control and Data Processing  Use the logic capacity and on-chip RAM for real-time control, signal processing, or custom state-machine implementations in industrial equipment.
• Memory and Bus Interface Logic  Implement custom memory controllers, bus arbiters, and buffering logic that benefit from the device's memory resources and clock-management features.

Unique Advantages

• High I/O Count: 660 available I/Os enable dense external connectivity and flexible partitioning of interface banks.
• Substantial Logic Resources: 27,648 logic elements support complex combinational and sequential logic without immediate need for external ASICs or glue logic.
• On-chip Memory for Local Storage: Approximately 0.39 Mbits of embedded RAM reduces external memory dependence for buffering and small data structures.
• Industrial Temperature Rating: –40°C to 100°C operation provides robustness for factory and fielded industrial systems.
• Compact High-Pin Package: 900-ball BGA (31×31) combines a small PCB footprint with high I/O and signal density for compact system designs.
• Standards and Compliance: RoHS compliance supports environmentally constrained production and procurement requirements.

Why Choose XCV1000E-6FG900I?

The XCV1000E-6FG900I positions itself as a flexible, industrial-grade FPGA option for designs that require substantial logic capacity, a high number of I/Os, and on-chip memory in a compact BGA package. Its operating temperature range and RoHS compliance make it appropriate for industrial deployments where reliability and regulatory conformance matter.

This device is well suited to engineers and system designers building interface-heavy controllers, mid-range signal-processing blocks, and custom logic subsystems that benefit from reprogrammability, integrated memory, and dense I/O routing.

Request a quote or submit a product inquiry to get pricing, availability, and lead-time information for the XCV1000E-6FG900I.