XCV1000E-7BG560I

The XCV1000E-7BG560I is an industrial-grade Virtex®-E field programmable gate array (FPGA) IC from AMD supplied in a 560-LBGA exposed-pad metal package. It combines a high-density logic fabric with substantial on-chip RAM and flexible I/O to address mid- to high-complexity embedded designs.

This device is suited for applications requiring a balance of logic capacity, embedded memory, and a large number of general-purpose I/O pins, with verified operation across a wide industrial temperature range and a 1.8 V core supply domain.

Key Features

• Logic Capacity — 6,144 CLBs and 27,648 logic elements provide substantial programmable logic for complex combinational and sequential designs.
• Embedded Memory — Approximately 0.39 Mbits of on-chip RAM (393,216 total bits) for buffering, FIFOs, and local data storage.
• I/O Density — 404 general-purpose I/O pins for broad connectivity to peripherals, memory, and high-speed interfaces.
• Family-Level Performance Features — Virtex-E series capabilities include fast 1.8 V operation, SelectI/O+ technology, support for differential signalling (LVDS/LVPECL/BLVDS), and built-in clock management with multiple DLLs.
• Gate Count — 1,569,178 gates providing design scaling for larger logic and control functions.
• Voltage and Power — Core supply specified at 1.71 V to 1.89 V for the device's 1.8 V internal logic domain.
• Package — 560-LBGA exposed pad, metal; supplier device package listed as 560-MBGA (42.5 × 42.5 mm) for board-level planning.
• Temperature and Grade — Industrial grade with operating range from −40 °C to 100 °C for robust deployment in industrial environments.
• Standards and Architecture — Series documentation highlights support for high-performance interfaces (PCI 3.3 V options, DDR links), multiple I/O standards, and advanced SelectRAM+/block RAM architecture.
• Compliance — RoHS compliant.

Typical Applications

• High-density embedded control — Implement complex state machines, protocol handling, and signal processing with abundant logic elements and on-chip RAM.
• Interface bridging and protocol conversion — Large I/O count and SelectI/O+ family features enable flexible interfacing between disparate buses and memory systems.
• Communications and data aggregation — Use embedded memory and extensive I/O to buffer, route, and preprocess data streams in industrial communications equipment.
• FPGA-based system prototyping — Leverage the programmable fabric and series clock-management features for rapid development of medium-complexity system prototypes.

Unique Advantages

• Balanced logic and memory ratio — 27,648 logic elements combined with approximately 0.39 Mbits of embedded RAM supports mixed compute and buffering requirements without external memory for many use cases.
• High I/O availability — 404 I/Os give designers flexibility to connect sensors, peripherals, and external memories directly to the FPGA fabric.
• Industrial readiness — −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
• Defined core supply range — 1.71–1.89 V supply specification simplifies power budgeting for 1.8 V core designs.
• Predictable packaging — 560-pin LBGA exposed-pad metal package (42.5 × 42.5 mm) aids thermal planning and high-density PCB layout.

Why Choose XCV1000E-7BG560I?

The XCV1000E-7BG560I positions itself as a capable Virtex‑E family FPGA for designers who need a combination of significant logic resources, on-chip memory, and a large complement of I/O in an industrial-rated package. Its specified supply range, thermal rating, and RoHS compliance make it suitable for long-life embedded systems where stability and manufacturability matter.

This device is appropriate for engineering teams building medium- to high-complexity digital systems that require flexible I/O, in-system reprogrammability, and a proven series-level feature set for clock management and high-speed signaling.

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