XCV1000E-7FG860C

The XCV1000E-7FG860C is a Virtex®-E Field Programmable Gate Array (FPGA) IC offered by AMD. It is built on the 1.8 V Virtex-E architecture and provides reprogrammable, SRAM-based logic tailored for high-performance digital designs.

Designed for applications that require dense logic, abundant I/O and embedded memory, this device delivers 27,648 logic elements, approximately 0.39 Mbits of embedded RAM, and 660 I/O pins in an 860-ball FBG A exposed-pad package. The device supports a 1.71 V to 1.89 V core supply and operates over a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture 1.8 V Virtex-E FPGA family with series-level performance characteristics including documented internal performance targets (130 MHz, four LUT levels).
• Logic Resources 27,648 logic elements and approximately 1,569,178 gates for implementing complex, custom digital logic functions.
• Embedded Memory Approximately 0.39 Mbits (393,216 bits) of on-chip RAM for buffering, FIFOs and local data storage.
• I/O Capacity & Standards 660 user I/O pins in support of high-bandwidth system interfaces; series-level SelectI/O+ technology and differential signaling support are part of the Virtex-E family.
• Clocking & Timing Family-level clock management includes multiple DLLs for clock multiply/divide and duty-cycle control, enabling robust timing for source-synchronous and DDR interfaces.
• Dedicated Arithmetic & DSP Support Architecture includes dedicated carry logic and multiplier support to accelerate arithmetic and DSP functions.
• Package & Mounting 860-ball FBGA exposed-pad package (42.5 × 42.5 mm) optimized for surface-mount assembly and thermal dissipation.
• Power & Temperature Core supply voltage 1.71 V to 1.89 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance RoHS-compliant device meeting environmental requirements for lead-free assembly processes.
• In-System Reprogrammability SRAM-based configuration supports unlimited re-programmability for iterative development and field updates (series-level capability).

Typical Applications

• High-performance interface controllers — Implement PCI-compliant and other bus interface logic using the device's high I/O count and Virtex-E series interface features.
• Memory controller and buffering — On-chip RAM and architecture suited for building interfaces to external memories and local buffering in data-path designs.
• Telecommunications and data communications — Differential signaling support at the family level (LVDS, LVPECL, BLVDS) combined with abundant I/O enables high-speed serial and parallel link designs.
• Custom compute and DSP — Dedicated multiplier support and abundant logic elements let you implement application-specific acceleration and signal-processing blocks.

Unique Advantages

• High-density, reprogrammable logic: 27,648 logic elements provide the capacity to implement complex state machines, datapaths and custom accelerators while allowing design iteration through reprogramming.
• Substantial I/O resources: 660 I/O pins in an 860-FBGA package enable broad external connectivity without extensive board-level multiplexing.
• Embedded memory for local buffering: Approximately 0.39 Mbits of on-chip RAM reduces external memory dependence and lowers system latency for many control and data-path tasks.
• Dedicated arithmetic support: Built-in carry logic and multiplier resources simplify implementation of arithmetic-intensive functions and DSP algorithms.
• Package optimized for thermal and assembly: 860-BGA exposed pad (42.5 × 42.5 mm) allows reliable surface-mount integration and thermal management in compact systems.
• Environmentally compliant: RoHS compliance supports lead-free assembly and meets common environmental procurement requirements.

Why Choose XCV1000E-7FG860C?

The XCV1000E-7FG860C positions itself as a versatile, performance-oriented FPGA for designs that require a balance of logic density, significant I/O, and embedded memory in a compact BGA package. Its Virtex‑E architecture features (including series-level clock management, differential signaling support and dedicated arithmetic resources) make it well suited to systems demanding robust interface support and on-chip data handling.

This device is ideal for embedded systems, communications equipment, high-performance interface controllers and custom compute/DSP applications where reprogrammability and integration can reduce BOM complexity and accelerate development cycles. The combination of commercial-grade temperature range, defined core supply window and RoHS compliance provides predictable integration into standard commercial product lines.

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