XCV1000E-7FG1156C

The XCV1000E-7FG1156C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 1156-ball BGA package designed for high-density, reprogrammable digital logic. This 1.8 V-class FPGA delivers a balance of logic capacity, on-chip memory and rich I/O to support high-performance embedded systems, communications interfaces and memory-interfacing designs.

With 27,648 logic elements, 660 user I/O pins and approximately 0.39 Mbits of embedded memory, the device is positioned for applications that require substantial logic resources, flexible I/O standards and in-system reprogramming.

Key Features

• Logic Capacity — 27,648 logic elements and 6,144 CLBs provide substantial programmable logic for complex digital designs.
• On-chip Memory — Approximately 393,216 bits (≈0.39 Mbits) of embedded RAM to support buffering, packet processing and local data storage.
• I/O Density & Flexibility — 660 user I/O pins with series-level support for differential signaling standards such as LVDS, BLVDS and LVPECL for high-speed interface designs.
• Clock Management — Series features include multiple digital DLLs for clock multiply/divide and improved clock distribution for DDR and high-speed serial applications.
• Power Supply — Core supply specified from 1.71 V to 1.89 V, aligned with the Virtex‑E 1.8 V architecture for lower-power operation.
• Packaging & Mounting — Surface-mount 1156-BBGA package (supplier package listed as 1156-FBGA, 35 × 35 mm) for compact board-level integration.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• High-speed Communications — Implement protocol engines, SERDES endpoints and interface bridging using the device’s large I/O count and differential signaling support.
• Memory Interface Controllers — On-chip RAM and series-level support for high-performance external memory interfaces make the device suitable for memory controller logic and buffering.
• PCI and System I/O — The Virtex‑E family includes PCI-compliant support for 3.3 V 32/64-bit, 33/66-MHz designs referenced in the series specification.
• Reconfigurable Logic Prototyping — SRAM-based in-system programmability enables iterative hardware development and field updates.

Unique Advantages

• Substantial Logic & I/O in a Single Device: 27,648 logic elements and 660 I/Os reduce the need for multiple discrete devices and simplify board layout.
• Embedded Memory for Local Processing: Approximately 0.39 Mbits of on-chip RAM supports packet buffering, temporary storage and local lookup tables without external memory.
• Flexible Clocking: Series-level digital DLLs enable clock multiplication, division and zero-delay conversion for precise timing in high-speed designs.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for typical commercial applications and deployments.
• Compact BGA Packaging: 1156-ball BGA (35 × 35 mm supplier footprint) allows high-density board integration while maintaining thermal and signal integrity for complex systems.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose XCV1000E-7FG1156C?

The XCV1000E-7FG1156C combines substantial programmable logic, a high I/O count and on-chip memory in a compact BGA package, making it well suited for designers who need reprogrammable logic with robust interface capability. Its 1.8 V core domain and series-level low-power design focus support efficient system-level power budgets while retaining performance for demanding digital and interface tasks.

Engineers building communications equipment, memory controllers or reconfigurable prototypes will find the device’s mix of logic capacity, embedded RAM and flexible clocking advantageous. Series documentation also references toolchain support and development system compatibility to help accelerate design integration and iteration.

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