XCV1000E-6HQ240C

The XCV1000E-6HQ240C is a Virtex®-E field programmable gate array (FPGA) provided in a 240-BFQFP exposed pad package. It delivers high-density, reprogrammable digital logic suitable for demanding embedded and interface-centric designs.

Built on the Virtex‑E family architecture, this device combines a large number of logic elements and on-chip RAM with extensive I/O capability and configurable clocking to support high-performance data paths and system interfaces.

Key Features

• Programmable logic — 27,648 logic elements reported in product data, supporting complex custom logic implementations.
• Configurable logic blocks — Device data lists 6,144 CLB equivalents for structured logic partitioning and design scalability.
• On-chip memory — Approximately 0.39 Mbits of embedded memory (393,216 total RAM bits) for buffering, FIFOs, and local storage.
• I/O capacity — 158 user I/O pins to interface with peripherals, memories, and external logic.
• Differential signalling and interface support — Virtex‑E family features include support for LVDS, BLVDS and LVPECL differential standards and PCI‑compliant operation (3.3 V, 32/64‑bit, 33/66‑MHz) as described in the product family specification.
• Clock management — Family-level documentation describes multiple digital DLLs for flexible clock multiplication, division and duty-cycle control to support high-speed timing domains.
• Performance and density — Family performance indicators include internal operation up to 130 MHz (four LUT levels) and architectural elements for high-speed arithmetic and multiplier support as noted in the Virtex‑E specification.
• Package and mounting — Surface-mount 240-BFQFP exposed pad (supplier package 240‑PQFP, 32×32) for PCB assembly and thermal conduction.
• Power and temperature — Core supply range 1.71 V to 1.89 V; commercial operating temperature range 0 °C to 85 °C.
• Manufacturing and compliance — RoHS compliant and 100% factory tested per the product family documentation.

Typical Applications

• High-speed interface controllers — Use the device’s I/O count and family support for differential signalling and PCI-compliant interfaces to implement custom buses and protocol bridges.
• External memory interfaces — On-chip RAM and Virtex‑E memory hierarchy features support designs that require high-bandwidth connections to external SRAMs and SDRAMs.
• Custom digital processing — Large logic capacity and dedicated arithmetic resources enable custom datapath and signal-processing blocks for specialized embedded systems.
• In-system reprogrammable designs — SRAM-based configuration allows iterative development and field updates for evolving system requirements.

Unique Advantages

• Substantial logic capacity: 27,648 logic elements provide the headroom for complex, multi-module FPGA designs without immediate need to migrate to a larger family device.
• Embedded memory on-chip: Approximately 0.39 Mbits of RAM enables local buffering and state retention for performance-sensitive paths.
• Flexible I/O and signalling: 158 I/Os and family-level support for multiple differential standards simplify integration with high-speed peripherals and communication links.
• Configurable clocking: Architecture-level DLL resources support flexible clock domain management for low-skew, high-frequency operation.
• Commercial-grade reliability: Defined operating range (0 °C to 85 °C) and RoHS compliance make the device suitable for a wide range of standard commercial applications.
• Surface-mount exposed-pad package: 240-BFQFP exposed pad offers PCB-friendly thermal conduction and a compact footprint for board-level designs.

Why Choose XCV1000E-6HQ240C?

The XCV1000E-6HQ240C combines significant programmable logic density with on-chip memory and flexible I/O to address demanding embedded and interface-centric designs. Its Virtex‑E family features—such as differential signalling support, in-system SRAM configuration, and configurable clock management—align the device with projects that require reprogrammability, protocol flexibility, and substantial local resources.

This part is well suited for engineering teams building high-performance interface controllers, memory gateway logic, and custom digital processing blocks where commercial-temperature operation and RoHS compliance are required. The device’s balance of logic, memory and I/O supports scalable designs and iterative development workflows.

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