XCV1000E-6FG680C

The XCV1000E-6FG680C is a Virtex®-E series SRAM-based FPGA optimized for commercial applications that require substantial programmable logic, large I/O counts, and embedded memory. This device combines high-density reconfigurable logic with flexible I/O capabilities and on-chip RAM to support complex digital designs and high-bandwidth interfaces.

Key attributes include 27,648 logic elements, approximately 0.4 Mbits of embedded RAM, 512 I/Os, and a 680-ball exposed-pad LBGA package. The device operates from a core voltage range of 1.71 V to 1.89 V and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity — 27,648 logic elements providing the programmable fabric needed for medium-to-high density designs.
• On‑Chip Memory — Approximately 393,216 total RAM bits of embedded memory to support buffers, FIFOs, and local storage for data-path and control logic.
• I/O Density and Flexibility — 512 I/Os for wide parallel interfaces and board-level connectivity in a single device package.
• Clock and Timing Support — Series-level clock management features include multiple DLLs and DDR-friendly clocking to support high-speed, synchronous designs.
• High‑Speed Interface Support — SelectI/O and differential signaling support at the series level enable a variety of high-performance interface standards and source-synchronous architectures.
• Power and Voltage — Core supply range of 1.71–1.89 V suitable for the Virtex‑E 1.8 V family architecture.
• Package and Mounting — 680-LBGA exposed pad package (680-FTEBGA, 40×40) in a surface-mount form factor for compact, high-density board designs.
• Operating Conditions — Commercial grade operation from 0 °C to 85 °C.
• Compliance and Test — RoHS-compliant and 100% factory tested as part of the Virtex-E family production specification.

Typical Applications

• High‑Speed Memory Interfaces — Implements memory controllers and interface logic using the on-chip RAM and high-speed I/O to connect to external SRAMs or DDR memories.
• Data Acquisition and Processing — Local embedded RAM and plentiful logic elements enable buffering, packet processing, and real-time data-path functions.
• System Integration and Prototyping — Reconfigurable fabric supports hardware prototyping, custom I/O bridging, and integration of complex digital subsystems on a single device.
• High‑I/O Peripheral Control — Large I/O count provides the flexibility to interface to numerous peripherals, buses, and sensors in commercial systems.

Unique Advantages

• High Programmable Density: 27,648 logic elements provide ample capacity for complex state machines, datapaths, and custom logic functions, reducing the need for multiple devices.
• Substantial Embedded Memory: Approximately 0.4 Mbits of on-chip RAM supports buffering and local storage, improving throughput and lowering external memory dependence.
• Large I/O Count: 512 I/Os allow wide parallel interfaces and flexible board-level connectivity, simplifying system partitioning.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS-compliant to meet commercial manufacturing and regulatory requirements.
• Compact, Assembly‑Ready Package: 680-LBGA exposed-pad surface-mount package enables high-density PCB layouts and thermal performance for typical commercial boards.
• SRAM-Based Reprogrammability: In-system reconfiguration capability supports iterative development and field updates without hardware changes.

Why Choose XCV1000E-6FG680C?

The XCV1000E-6FG680C delivers a balanced combination of logic capacity, embedded memory, and high I/O density in a single Virtex®-E device targeted at commercial designs. Its core voltage range, package options, and series-level feature set make it suitable for developers who require reconfigurable hardware with substantial on-chip resources and flexible interface options.

This FPGA is well suited for engineering teams implementing medium-to-high complexity digital systems that benefit from in-system programmability, abundant local memory, and broad I/O capability. The device’s series pedigree also provides access to established development tools and reference methodologies, supporting efficient design iteration and integration.

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