XCV1000-6FG680C

IC FPGA 512 I/O 680FTEBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 512 131072 27648 680-LBGA Exposed Pad

Quantity 510 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FTEBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case680-LBGA Exposed PadNumber of I/O512Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1124022ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV1000-6FG680C – Virtex® FPGA, 512 I/O, 27,648 logic elements, 680-LBGA

The XCV1000-6FG680C is a Virtex® Field Programmable Gate Array (FPGA) packaged in a 680-LBGA with exposed pad. It delivers high-density, reprogrammable logic with 27,648 logic elements and approximately 0.13 Mbits of embedded RAM, making it suitable for complex digital designs that require substantial logic capacity and extensive I/O.

Architected for performance and flexibility, the device targets high-performance digital systems, I/O-intensive designs, and in-system reprogrammable applications where configurable logic, on-chip memory, and advanced clock control are required.

Key Features

  • Logic Capacity  27,648 logic elements and 1,124,022 system gates provide substantial programmable resources for complex logic and arithmetic functions.
  • Configurable Logic Blocks (CLBs)  6,144 CLBs for hierarchical routing and placement efficiency within the FPGA fabric.
  • Embedded Memory  Approximately 0.13 Mbits (131,072 bits) of on-chip RAM with LUTs configurable as RAM or shift registers for flexible local storage.
  • I/O Density  Up to 512 I/O pins to support wide bus interfaces and multiple external peripherals.
  • Clock and Timing  Built-in clock-management resources including multiple delay-locked loops (DLLs) and dedicated global clock distribution nets for low-skew timing.
  • High-speed Arithmetic Support  Dedicated carry logic and multiplier support to accelerate arithmetic and DSP-style operations.
  • Configuration and Re-programmability  SRAM-based in-system configuration offering unlimited re-programmability and multiple programming modes.
  • Package and Mounting  680-LBGA exposed pad (supplier package: 680-FTEBGA, 40×40); surface-mount mounting for compact PCB integration.
  • Electrical and Environmental  Voltage supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
  • Manufacturing Process and Test  Fabricated on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested.

Typical Applications

  • High-performance digital systems  Implements complex control, data-path, and protocol logic where high gate counts and on-chip memory are required.
  • PCI and Compact PCI systems  Family-level support for 66-MHz PCI and hot-swapping in Compact PCI systems makes the device suitable for legacy and embedded I/O cards.
  • Reprogrammable in-system designs  SRAM-based configuration enables iterative development, field updates, and customizable hardware acceleration.
  • I/O-intensive interface hubs  The 512 I/O pins and multi-standard SelectIO interfaces support diverse external memory and peripheral connections.

Unique Advantages

  • High integration density: Combines 27,648 logic elements and over one million system gates to consolidate logic that would otherwise require multiple discrete devices.
  • Flexible on-chip memory: 131,072 bits of embedded RAM and configurable LUT RAM options let designers implement local buffers, FIFOs, and small memories without external components.
  • Robust clocking resources: Multiple DLLs and hierarchical clock distribution enable precise timing control for synchronous designs and high-performance data paths.
  • Extensive I/O capability: 512 I/Os provide the breadth needed for wide buses, parallel interfaces, and mixed-signal front-ends.
  • Proven silicon and testing: 0.22 μm, 5-layer-metal process with full factory testing reduces integration risk and supports reliable deployment.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream electronic applications.

Why Choose XCV1000-6FG680C?

The XCV1000-6FG680C delivers a balanced combination of high logic capacity, flexible on-chip memory, and extensive I/O in a 680-LBGA package. It is well suited for designers who need a reprogrammable platform with strong arithmetic support, comprehensive clocking resources, and the ability to implement complex, I/O-rich systems.

With commercial-grade temperature range, defined supply requirements, and factory testing, the device provides a reliable building block for medium- to high-complexity FPGA applications where scalability, reprogrammability, and integration density matter.

Request a quote or submit an RFQ to obtain pricing and availability for the XCV1000-6FG680C. Our team will provide the information you need to evaluate this FPGA for your design project.

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