XCV1000-6FG680C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 512 131072 27648 680-LBGA Exposed Pad |
|---|---|
| Quantity | 510 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 680-FTEBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 680-LBGA Exposed Pad | Number of I/O | 512 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 27648 | ||
| Number of Gates | 1124022 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV1000-6FG680C – Virtex® FPGA, 512 I/O, 27,648 logic elements, 680-LBGA
The XCV1000-6FG680C is a Virtex® Field Programmable Gate Array (FPGA) packaged in a 680-LBGA with exposed pad. It delivers high-density, reprogrammable logic with 27,648 logic elements and approximately 0.13 Mbits of embedded RAM, making it suitable for complex digital designs that require substantial logic capacity and extensive I/O.
Architected for performance and flexibility, the device targets high-performance digital systems, I/O-intensive designs, and in-system reprogrammable applications where configurable logic, on-chip memory, and advanced clock control are required.
Key Features
- Logic Capacity 27,648 logic elements and 1,124,022 system gates provide substantial programmable resources for complex logic and arithmetic functions.
- Configurable Logic Blocks (CLBs) 6,144 CLBs for hierarchical routing and placement efficiency within the FPGA fabric.
- Embedded Memory Approximately 0.13 Mbits (131,072 bits) of on-chip RAM with LUTs configurable as RAM or shift registers for flexible local storage.
- I/O Density Up to 512 I/O pins to support wide bus interfaces and multiple external peripherals.
- Clock and Timing Built-in clock-management resources including multiple delay-locked loops (DLLs) and dedicated global clock distribution nets for low-skew timing.
- High-speed Arithmetic Support Dedicated carry logic and multiplier support to accelerate arithmetic and DSP-style operations.
- Configuration and Re-programmability SRAM-based in-system configuration offering unlimited re-programmability and multiple programming modes.
- Package and Mounting 680-LBGA exposed pad (supplier package: 680-FTEBGA, 40×40); surface-mount mounting for compact PCB integration.
- Electrical and Environmental Voltage supply range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C; RoHS compliant.
- Manufacturing Process and Test Fabricated on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested.
Typical Applications
- High-performance digital systems Implements complex control, data-path, and protocol logic where high gate counts and on-chip memory are required.
- PCI and Compact PCI systems Family-level support for 66-MHz PCI and hot-swapping in Compact PCI systems makes the device suitable for legacy and embedded I/O cards.
- Reprogrammable in-system designs SRAM-based configuration enables iterative development, field updates, and customizable hardware acceleration.
- I/O-intensive interface hubs The 512 I/O pins and multi-standard SelectIO interfaces support diverse external memory and peripheral connections.
Unique Advantages
- High integration density: Combines 27,648 logic elements and over one million system gates to consolidate logic that would otherwise require multiple discrete devices.
- Flexible on-chip memory: 131,072 bits of embedded RAM and configurable LUT RAM options let designers implement local buffers, FIFOs, and small memories without external components.
- Robust clocking resources: Multiple DLLs and hierarchical clock distribution enable precise timing control for synchronous designs and high-performance data paths.
- Extensive I/O capability: 512 I/Os provide the breadth needed for wide buses, parallel interfaces, and mixed-signal front-ends.
- Proven silicon and testing: 0.22 μm, 5-layer-metal process with full factory testing reduces integration risk and supports reliable deployment.
- Commercial-grade suitability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream electronic applications.
Why Choose XCV1000-6FG680C?
The XCV1000-6FG680C delivers a balanced combination of high logic capacity, flexible on-chip memory, and extensive I/O in a 680-LBGA package. It is well suited for designers who need a reprogrammable platform with strong arithmetic support, comprehensive clocking resources, and the ability to implement complex, I/O-rich systems.
With commercial-grade temperature range, defined supply requirements, and factory testing, the device provides a reliable building block for medium- to high-complexity FPGA applications where scalability, reprogrammability, and integration density matter.
Request a quote or submit an RFQ to obtain pricing and availability for the XCV1000-6FG680C. Our team will provide the information you need to evaluate this FPGA for your design project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








