XCV1000-4FG680C

IC FPGA 512 I/O 680FTEBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 512 131072 27648 680-LBGA Exposed Pad

Quantity 361 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package680-FTEBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case680-LBGA Exposed PadNumber of I/O512Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1124022ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV1000-4FG680C – Virtex® Field Programmable Gate Array (FPGA), 512 I/O, 27,648 logic elements

The XCV1000-4FG680C is an SRAM-based Virtex FPGA delivering high-capacity, high-performance programmable logic for complex digital systems. Its architecture combines a large array of configurable logic blocks with a rich hierarchy of routing and I/O resources to support demanding interface and compute tasks.

Designed for applications requiring high-speed interfaces and flexible on-chip resources, this device provides the integration and clocking features needed for PCI-compliant modules, hot-swappable Compact PCI designs, and other high-performance embedded systems.

Key Features

  • Logic Capacity — 27,648 logic elements across 6,144 configurable logic blocks (CLBs) and approximately 1,124,022 system gates provide substantial programmable capacity for large designs.
  • On-chip Memory — 131,072 total RAM bits (approximately 0.131 Mbits) of embedded memory with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM and shift registers, plus configurable 4k-bit synchronous dual-ported RAMs.
  • I/O and Interface — 512 user I/O pins with multi-standard SelectIO capability for a wide range of high-performance interface standards; supports direct connection to high-speed external memories.
  • Clock Management — Four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced clock control and low-skew distribution.
  • Performance — Architecture and process enables system performance up to 200 MHz; 66-MHz PCI compliance and hot-swap support for Compact PCI systems.
  • Dedicated Arithmetic Support — Dedicated carry logic and multiplier support with cascade chains for implementing wide arithmetic and high-speed datapaths.
  • Configuration Modes — SRAM-based in-system configuration with unlimited re-programmability and four programming modes (SelectMAP™, slave serial, master serial, and JTAG).
  • Process and Test — Manufactured on a 0.22 μm, 5-layer metal CMOS process and 100% factory tested.
  • Package & Power — 680-LBGA exposed pad (supplier package: 680-FTEBGA 40×40), surface-mount mounting; supply voltage range 2.375 V to 2.625 V; commercial operating temperature 0 °C to 85 °C.
  • System Utilities — Built-in features for system reliability include IEEE 1149.1 boundary-scan logic and an on-die temperature sensor diode.
  • Compliance — RoHS compliant.

Typical Applications

  • PCI and Compact PCI Systems — Implement PCI-compliant interfaces and hot-swappable modules for backplane-based systems requiring reconfigurable logic.
  • High-performance Interface Controllers — Use the multi-standard SelectIO and abundant I/O to bridge high-speed memories and peripherals in custom systems.
  • Mask-Programmed Gate Array Replacement — Deploy as a flexible alternative to mask-programmed gate arrays for prototype and production designs needing in-field reprogramming.
  • Complex Digital Signal & Control Logic — Leverage dedicated arithmetic resources, high logic capacity, and hierarchical memory to implement wide datapaths, controllers, and state machines.

Unique Advantages

  • High Integration: Large logic capacity and substantial on-chip RAM reduce external component count and simplify board-level design.
  • Flexible I/O: 512 I/O pins with multi-standard SelectIO support enable direct interfacing to a wide variety of high-speed devices and memories.
  • Advanced Clocking: Multiple DLLs and extensive global/local clock nets deliver precise clock control for high-performance, timing-sensitive designs.
  • Re-programmability: SRAM-based configuration offers unlimited re-programmability and multiple configuration modes for in-system updates and iterative development.
  • Proven Process & Testing: 0.22 μm 5-layer-metal process and 100% factory testing provide consistent manufacturability and production readiness.
  • System-level Features: Boundary-scan and an on-die temperature sensor assist in board-level diagnostics and system monitoring.

Why Choose XCV1000-4FG680C?

The XCV1000-4FG680C positions itself as a high-capacity, configurable logic solution for engineers building complex digital systems that require large logic densities, flexible I/O, and robust clocking. Its combination of 27,648 logic elements, substantial embedded memory, and dedicated arithmetic resources makes it suitable for demanding interface controllers, reconfigurable processing, and replacement of mask-programmed arrays.

Supported by a standard FPGA tool ecosystem and multiple configuration modes, this device delivers design flexibility and long-term scalability for projects that need field re-programmability, proven process technology, and commercial-grade operating conditions.

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