XCV1000-5BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal

Quantity 246 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1124022ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV1000-5BG560C – Virtex® FPGA, 404 I/O, ~0.13 Mbit RAM, 27,648 Logic Elements, 560-LBGA

The XCV1000-5BG560C is a Virtex® Field Programmable Gate Array (FPGA) in a 560-LBGA exposed-pad metal package. It delivers 27,648 logic elements and approximately 1,124,022 system gates with 131,072 bits of embedded RAM, targeting high-density, reprogrammable digital logic applications.

Built on the Virtex architecture, the device offers extensive I/O (404 pins), dedicated clock management and memory flexibility. It is intended for commercial-grade systems operating from 0°C to 85°C with a supply range of 2.375 V to 2.625 V.

Key Features

  • Core Capacity — 27,648 logic elements and 1,124,022 system gates provide large-scale programmable logic resources for complex designs.
  • Embedded Memory — 131,072 total on-chip RAM bits (approximately 0.13 Mbits); Virtex architecture supports LUT-based RAM, 16-bit/32-bit configurations and dedicated 4k-bit dual-ported RAM blocks.
  • I/O and Interface Support — 404 user I/O pins with multi-standard SelectIO™ capability to support a variety of high-performance interface standards.
  • Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and 24 secondary local clock nets for advanced timing control.
  • Arithmetic and DSP Support — Dedicated carry logic and multiplier support for high-speed arithmetic and signal-processing tasks.
  • In-System Reprogrammability — SRAM-based configuration with unlimited re-programmability and multiple programming modes for flexible development and field updates.
  • Package and Power — Surface-mount 560-LBGA exposed pad, metal; supplier package listed as 560-MBGA (42.5 × 42.5 mm). Core supply range: 2.375 V to 2.625 V. RoHS compliant.
  • Commercial Temperature Grade — Specified operating range from 0°C to 85°C for commercial applications.
  • Manufacturing and Test — Fabricated on a 0.22 μm, 5-layer-metal process and 100% factory tested; supported by FPGA Foundation™ and Alliance development environments.

Typical Applications

  • High-performance system logic and prototyping — Use the large logic capacity and reprogrammability for rapid prototyping and complex system-level glue logic.
  • PCI and Compact PCI subsystems — Virtex family features include PCI-compliant operation and Compact PCI hot-swap capability suitable for board-level I/O subsystems.
  • Custom memory interfaces — On-chip memory flexibility plus fast external RAM interfaces enable buffering, packet handling and custom memory controllers.
  • Signal processing and arithmetic engines — Dedicated multiplier support and carry logic accelerate DSP and mathematics-heavy functions.

Unique Advantages

  • High-density programmable logic: 27,648 logic elements and over one million system gates provide the capacity to integrate complex functions on a single device, reducing component count.
  • Flexible embedded memory: Approximately 0.13 Mbits of RAM with configurable LUT and dual-port options simplifies implementation of FIFOs, buffers and small on-chip storage.
  • Comprehensive clock control: Multiple DLLs and hierarchical clock nets enable precise timing strategies across large designs.
  • Broad I/O capability: 404 I/O pins with multi-standard SelectIO support allow direct interfacing to diverse external devices and buses.
  • Field upgradability: SRAM-based configuration supports in-system reprogramming and multiple programming modes for iterative development and firmware updates.
  • Proven manufacturing and tool support: 0.22 μm process, 100% factory testing and support from established development toolchains help accelerate design bring-up and verification.

Why Choose XCV1000-5BG560C?

The XCV1000-5BG560C combines substantial logic capacity, flexible on-chip memory and advanced clock management in a compact 560-LBGA package suited for commercial-temperature systems. Its reprogrammable SRAM architecture and broad I/O support make it a practical choice for designers implementing complex digital logic, custom interfaces, and signal-processing functions.

Backed by factory testing and development-tool support from the Virtex ecosystem, this device offers a scalable, reliable platform for commercial applications that require high integration, in-field flexibility and controlled operating conditions.

Request a quote or submit a pricing inquiry for the XCV1000-5BG560C to evaluate suitability for your next design project.

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