XCV1000-4BG560C

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal

Quantity 27 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells27648
Number of Gates1124022ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits131072

Overview of XCV1000-4BG560C – Virtex® Field Programmable Gate Array, 560-LBGA

The XCV1000-4BG560C is an SRAM-based Virtex FPGA optimized for high-capacity, high-performance programmable logic applications. With a dense logic fabric, hierarchical on-chip memory, and a rich clocking and I/O feature set, it targets complex system designs that require reprogrammability and flexible interfacing.

Typical use cases include high-performance system logic, memory-intense functions, and platform designs that benefit from in-system configurability and broad I/O support.

Key Features

  • Logic Capacity — 27,648 logic elements (27,648 logic cells) and approximately 1,124,022 system gates provide substantial programmable logic resources for large designs.
  • Embedded Memory — Approximately 0.13 Mbits of total on-chip RAM (131,072 bits) with a hierarchical memory system and LUTs that can be configured as 16-bit/32-bit RAMs, dual-ported RAMs, or shift registers.
  • I/O and Interface Flexibility — 404 user I/Os with multi-standard SelectIO support across 16 high-performance interface standards; includes 66‑MHz PCI compliance and hot‑swappable Compact PCI support as indicated in the product specification.
  • Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock distribution nets and 24 secondary local clock nets for advanced clock control and low-skew distribution.
  • Arithmetic and DSP Support — Dedicated carry logic, multiplier support, and cascade chains for implementing wide arithmetic and DSP functions.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for flexible deployment.
  • Package and Mounting — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
  • Electrical and Environmental — Voltage supply range 2.375 V to 2.625 V; commercial-grade operating temperature 0 °C to 85 °C; RoHS compliant.
  • Process and Testing — Fabricated in a 0.22 μm, 5-layer metal CMOS process and 100% factory tested per the product specification.
  • Performance — Series specification documents system performance capability up to 200 MHz for applicable designs.

Typical Applications

  • High-performance system logic — Implement complex control, glue logic, and custom state machines using the device’s large programmable fabric and abundant registers.
  • Memory interface controllers — Use the hierarchical on-chip memory and fast external memory interfaces to build controllers and buffering for high-throughput designs.
  • PCI and Compact PCI subsystems — Leverage 66‑MHz PCI compliance and hot‑swappable Compact PCI capability for embedded expansion and backplane applications.
  • DSP and arithmetic engines — Dedicated carry logic and multiplier support enable implementation of signal processing, filtering, and numeric-intensive blocks.

Unique Advantages

  • High logic density: 27,648 logic elements and over 1.1 million gates let you integrate large functions on a single device, reducing board-level complexity.
  • Flexible memory architecture: Configurable LUT-based RAM and block RAM options provide adaptable on-chip storage for FIFOs, buffers, and state machines.
  • Robust clocking: Multiple DLLs and hierarchical clock nets simplify clock-domain design and reduce skew across large implementations.
  • Broad I/O capability: 404 I/Os with multi-standard SelectIO support enable direct interfacing to a wide range of peripherals and memory devices.
  • In-system programmability: SRAM-based configuration with multiple programming modes allows rapid iteration and field updates without hardware changes.
  • Production-proven manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing support consistent device quality.

Why Choose XCV1000-4BG560C?

The XCV1000-4BG560C combines substantial logic capacity, flexible embedded memory, and advanced clocking and I/O features to address demanding programmable-logic requirements. Its SRAM-based reprogrammability and comprehensive on-chip resources make it suitable for designers who need a scalable, reconfigurable solution for high-performance systems.

As a commercial-grade, RoHS-compliant part supplied in a compact 560-LBGA package and manufactured with rigorous testing, it offers a balanced option for projects requiring high integration, configurability, and production-ready reliability.

Request a quote or submit an inquiry to obtain pricing and availability for the XCV1000-4BG560C.

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