XCV1000-4BG560C
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 27 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 560-MBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 560-LBGA Exposed Pad, Metal | Number of I/O | 404 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 27648 | ||
| Number of Gates | 1124022 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 131072 |
Overview of XCV1000-4BG560C – Virtex® Field Programmable Gate Array, 560-LBGA
The XCV1000-4BG560C is an SRAM-based Virtex FPGA optimized for high-capacity, high-performance programmable logic applications. With a dense logic fabric, hierarchical on-chip memory, and a rich clocking and I/O feature set, it targets complex system designs that require reprogrammability and flexible interfacing.
Typical use cases include high-performance system logic, memory-intense functions, and platform designs that benefit from in-system configurability and broad I/O support.
Key Features
- Logic Capacity — 27,648 logic elements (27,648 logic cells) and approximately 1,124,022 system gates provide substantial programmable logic resources for large designs.
- Embedded Memory — Approximately 0.13 Mbits of total on-chip RAM (131,072 bits) with a hierarchical memory system and LUTs that can be configured as 16-bit/32-bit RAMs, dual-ported RAMs, or shift registers.
- I/O and Interface Flexibility — 404 user I/Os with multi-standard SelectIO support across 16 high-performance interface standards; includes 66‑MHz PCI compliance and hot‑swappable Compact PCI support as indicated in the product specification.
- Clock Management — Four dedicated delay-locked loops (DLLs) plus four primary low-skew global clock distribution nets and 24 secondary local clock nets for advanced clock control and low-skew distribution.
- Arithmetic and DSP Support — Dedicated carry logic, multiplier support, and cascade chains for implementing wide arithmetic and DSP functions.
- Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes for flexible deployment.
- Package and Mounting — 560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
- Electrical and Environmental — Voltage supply range 2.375 V to 2.625 V; commercial-grade operating temperature 0 °C to 85 °C; RoHS compliant.
- Process and Testing — Fabricated in a 0.22 μm, 5-layer metal CMOS process and 100% factory tested per the product specification.
- Performance — Series specification documents system performance capability up to 200 MHz for applicable designs.
Typical Applications
- High-performance system logic — Implement complex control, glue logic, and custom state machines using the device’s large programmable fabric and abundant registers.
- Memory interface controllers — Use the hierarchical on-chip memory and fast external memory interfaces to build controllers and buffering for high-throughput designs.
- PCI and Compact PCI subsystems — Leverage 66‑MHz PCI compliance and hot‑swappable Compact PCI capability for embedded expansion and backplane applications.
- DSP and arithmetic engines — Dedicated carry logic and multiplier support enable implementation of signal processing, filtering, and numeric-intensive blocks.
Unique Advantages
- High logic density: 27,648 logic elements and over 1.1 million gates let you integrate large functions on a single device, reducing board-level complexity.
- Flexible memory architecture: Configurable LUT-based RAM and block RAM options provide adaptable on-chip storage for FIFOs, buffers, and state machines.
- Robust clocking: Multiple DLLs and hierarchical clock nets simplify clock-domain design and reduce skew across large implementations.
- Broad I/O capability: 404 I/Os with multi-standard SelectIO support enable direct interfacing to a wide range of peripherals and memory devices.
- In-system programmability: SRAM-based configuration with multiple programming modes allows rapid iteration and field updates without hardware changes.
- Production-proven manufacturing: 0.22 μm, 5-layer-metal process and 100% factory testing support consistent device quality.
Why Choose XCV1000-4BG560C?
The XCV1000-4BG560C combines substantial logic capacity, flexible embedded memory, and advanced clocking and I/O features to address demanding programmable-logic requirements. Its SRAM-based reprogrammability and comprehensive on-chip resources make it suitable for designers who need a scalable, reconfigurable solution for high-performance systems.
As a commercial-grade, RoHS-compliant part supplied in a compact 560-LBGA package and manufactured with rigorous testing, it offers a balanced option for projects requiring high integration, configurability, and production-ready reliability.
Request a quote or submit an inquiry to obtain pricing and availability for the XCV1000-4BG560C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








