XCV1000E-6FG680I

The XCV1000E-6FG680I is a Virtex®-E field programmable gate array (FPGA) from AMD, offered in a 680-ball LBGA exposed pad package for surface-mount applications. It provides a high-density, reprogrammable logic fabric suitable for industrial designs that require extensive I/O, embedded memory, and a wide operating temperature range.

Key on-chip resources include 27,648 logic elements, approximately 0.39 Mbits of embedded memory, and 512 I/O pins. The device runs from a 1.71 V to 1.89 V core supply and is rated for industrial operation from −40 °C to 100 °C.

Key Features

• Logic Capacity  27,648 logic elements and approximately 1,569,178 system gates provide substantial programmable logic for complex designs.
• Embedded Memory  Approximately 0.39 Mbits of on-chip RAM for distributed and block memory requirements.
• I/O and Interface Density  512 user I/O pins support high connectivity and flexible interface implementations; the Virtex‑E family capability includes support for multiple high-performance I/O standards and differential signalling (as described for the family).
• Performance and Clock Management  Family-level performance features include up to 130 MHz internal operation (four LUT levels) and eight digital Delay-Locked Loops (DLLs) for on-chip clock conditioning and DDR-friendly duty-cycle control.
• Memory and External Interface Support  Architecture supports high-bandwidth memory hierarchies and interfaces to external memories (family-level details describe support for high-speed SRAM and DDR SDRAM interfaces).
• Configuration and Re-programmability  SRAM-based in-system configuration enables unlimited re-programmability for iterative development and field updates.
• Package and Mounting  680-LBGA exposed pad (supplier package: 680-FTEBGA, 40 × 40 mm) in a surface-mount form factor for high-pin-count board designs.
• Power and Voltage  Core supply range of 1.71 V to 1.89 V, enabling integration into 1.8 V-based power domains.
• Operating Range and Compliance  Industrial-grade temperature range of −40 °C to 100 °C and RoHS-compliant manufacturing.

Typical Applications

• Industrial Control  High I/O count and industrial temperature rating make this FPGA suitable for factory automation, motor control, and process-control logic where durability and re-programmability are required.
• Communications and Networking  Dense logic, abundant I/Os, and family support for differential signalling and high-speed interfaces support protocol processing, line cards, and I/O-heavy networking functions.
• Memory Interface and Processing  Embedded RAM and family-level memory hierarchy capabilities enable external memory interfacing and buffering for packet processing or high-bandwidth data paths.
• Prototyping and In-System Development  SRAM-based configuration and re-programmability allow iterative development, in-field updates, and prototype validation of complex systems.

Unique Advantages

• Substantial Logic and Gate Count: 27,648 logic elements and ~1.57 million gates provide capacity for sizeable digital designs without external glue logic.
• High I/O Density: 512 I/Os simplify board-level routing for multi-channel and multi-protocol systems, reducing the need for external multiplexers.
• On-Chip Memory: Approximately 0.39 Mbits of embedded RAM lowers dependency on external memory for intermediate buffering and state storage.
• Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation, supporting deployments in demanding ambient conditions.
• Flexible Packaging: 680-LBGA exposed pad (680-FTEBGA, 40 × 40 mm) supports high-pin-count, high-density PCB layouts typical in advanced embedded systems.
• RoHS Compliance: Environmentally compliant manufacturing aligns with current assembly and environmental requirements.

Why Choose XCV1000E-6FG680I?

The XCV1000E-6FG680I balances substantial programmable logic, embedded memory, and a high I/O count in a single industrial-grade FPGA package. Its 1.8 V core supply, extensive logic resources, and packaged form factor make it well suited for complex industrial, communications, and memory-interface designs that require field re-programmability and robust operating-temperature capability.

For teams building mid-density to high-density programmable systems, this Virtex‑E device offers a combination of integration and configurability that supports iterative development and long-term deployment in industrial environments.

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