XCV1000E-6FG900C

The XCV1000E-6FG900C is a 1.8 V Virtex®-E SRAM-based Field Programmable Gate Array (FPGA) in a 900-ball BGA package. It delivers dense programmable logic, substantial embedded memory, and a high I/O count for designs that require configurable high-bandwidth interfaces and on-chip system logic.

This commercial-grade FPGA is suited for applications that demand flexible I/O standards, clock management, and reprogrammability while operating within a 0 °C to 85 °C range and a 1.71 V–1.89 V core supply window.

Key Features

• Core Logic — Approximately 27,648 logic elements provide programmable fabric for custom digital functions and complex state machines.
• Configurable Logic Blocks (CLBs) — Architecture includes 6,144 CLBs for structured logic implementation and partitioning.
• Embedded Memory — Approximately 0.39 Mbits of on-chip RAM (393,216 total RAM bits) for embedded buffers, FIFOs, and small data stores.
• I/O Density — 660 I/O pins support high-pin-count systems and parallel interfaces; SelectI/O+ style architecture supports a broad set of interface standards as described in the Virtex‑E family documentation.
• High-Speed Interfaces — Series-level features include support for differential signalling (LVDS, BLVDS, LVPECL) and double data rate links; suitable for high-bandwidth, source-synchronous designs per the Virtex‑E family specification.
• Clocking and Timing — Family-level clock management features include multiple digital DLLs for clock multiply/divide and low-jitter clock distribution (eight DLLs at the series level).
• On-Chip Arithmetic Support — Dedicated carry logic and multiplier support (series-level capability) for high-performance arithmetic and DSP-style functions.
• Package and Mounting — 900-BBGA (900-FBGA supplier package, 31×31) surface-mount package for compact board integration.
• Power and Temperature — Core supply range 1.71 V to 1.89 V and operating temperature 0 °C to 85 °C (commercial grade).
• Regulatory — RoHS compliant.

Typical Applications

• High-speed interface bridging — Implement protocol adapters and memory interface logic for DDR SDRAM and ZBT SRAM systems utilizing the family-level memory and I/O support.
• Custom logic and acceleration — Offload arithmetic and signal-processing tasks using the device’s dedicated carry chains and multiplier resources.
• In-system reconfigurable designs — Use SRAM-based in-system configuration for iterative development, field updates, and prototype validation.

Unique Advantages

• Significant programmable density: Approximately 27,648 logic elements enable complex, multi-function designs without immediate reliance on external ASICs.
• Substantial embedded memory: Roughly 0.39 Mbits of on-chip RAM supports buffering, small data storage, and embedded state machines.
• High I/O count: 660 I/Os allow parallel datapaths and multiple high-speed interfaces on a single device.
• Flexible clock management: Series clocking features (multiple DLLs) enable tailored clock trees and DDR-friendly timing strategies.
• Reprogrammability: SRAM-based configuration permits design iteration and field updates without hardware replacement.
• Compact system integration: 900-ball BGA packaging offers high pin density in a space-efficient footprint for board-level assembly.

Why Choose XCV1000E-6FG900C?

The XCV1000E-6FG900C positions itself as a versatile, commercially rated Virtex‑E FPGA that balances programmable logic capacity, embedded memory, and extensive I/O resources. It is well suited for engineering teams building high-bandwidth interface controllers, custom accelerators, or reconfigurable prototypes that require on-board flexibility and series-level clocking and signaling features.

Backed by the Virtex‑E family architecture and SRAM-based reprogrammability, this part supports iterative development and long-term design adaptability while meeting commercial temperature and power specifications.

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