XCV1000E-7BG560C

The XCV1000E-7BG560C is a Virtex®-E field programmable gate array (FPGA) in a 560-ball LBGA exposed-pad metal package, manufactured by AMD. This SRAM-based, reprogrammable device delivers a balance of logic capacity, on-chip memory and high-performance I/O for demanding embedded and interface-rich designs.

Targeted at applications requiring high-speed interfaces and flexible memory architectures, the device combines 27,648 logic elements, approximately 0.39 Mbits of embedded memory and up to 404 I/O pins to support complex system integration while operating from a 1.71 V to 1.89 V supply.

Key Features

• Logic Capacity — 27,648 logic elements and 1,569,178 equivalent gates provide substantial programmable logic for medium-to-high density designs.
• On‑chip Memory — Approximately 0.39 Mbits of embedded RAM (393,216 total RAM bits) to support packet buffers, FIFOs and local scratch storage.
• I/O Density & Flexibility — Up to 404 I/Os to enable broad external connectivity and multiple high-speed interfaces.
• High‑Performance I/O Standards (series-level) — Family-level support for LVDS, BLVDS and LVPECL differential signaling and a broad set of interface standards to accommodate high-speed serial and parallel links.
• Clock Management — Series documentation notes advanced built-in clock management including multiple digital DLLs for flexible clocking and DDR-friendly synthesized duty cycles.
• Package & Mounting — 560-LBGA exposed pad, metal package; stated supplier package 560-MBGA (42.5 × 42.5 mm); designed for surface-mount assembly.
• Power & Supply — Internal supply range of 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V family.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• High‑speed interface bridging — Leverage the device’s high I/O count and family-level support for differential standards to implement protocol adapters and bridge logic between fast external subsystems.
• Memory interface and controllers — On-chip RAM and documented series-level support for high-performance external memories make this FPGA suitable for implementing memory controllers and buffers.
• Embedded system prototyping — Reprogrammable SRAM architecture and substantial logic capacity facilitate rapid development and iterative hardware/software co-design.
• PCI-compliant systems — Series documentation lists PCI compliance (3.3 V, 32/64-bit, 33/66-MHz) useful for PCI interface and legacy bus integration.

Unique Advantages

• Significant programmable resources: 27,648 logic elements and over 1.56M gates enable complex functionality on a single device, reducing external ASIC or discrete logic needs.
• Embedded memory for local buffering: Approximately 0.39 Mbits of on-chip RAM reduces latency for packet handling, FIFOs and temporary data storage.
• Flexible I/O and clocking: High I/O count and the family’s advanced clock management features support diverse interface topologies and timing architectures.
• Surface-mount, exposed-pad package: 560-LBGA with metal exposed pad and a 560-MBGA supplier package dimension (42.5 × 42.5) supports thermal management and dense PCB layouts.
• Commercial-grade suitability: Specified 0 °C to 85 °C operating range aligns with commercial embedded and communication system requirements.
• Environmentally compliant: RoHS compliance simplifies regulatory considerations for product assemblies.

Why Choose XCV1000E-7BG560C?

The XCV1000E-7BG560C places substantial programmable logic, embedded memory and a high I/O count into a compact 560-ball LBGA package, making it a strong choice for designers who need on-board flexibility for interface acceleration, memory bridging and rapid prototyping. Its 1.71 V–1.89 V internal supply aligns with the Virtex‑E family’s 1.8 V architecture and the device benefits from documented family-level capabilities such as advanced clock management and differential I/O support.

This part is appropriate for commercial embedded systems where reconfigurability, integration and a broad set of I/O options reduce BOM complexity and accelerate time-to-market. The combination of logic density, embedded RAM and package-level thermal considerations provides a durable platform for mid- to high-density FPGA implementations supported by established development toolflows.

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