XCV1000E-8FG1156C

The XCV1000E-8FG1156C is a commercial-grade Virtex®-E FPGA offered in a 1156-BBGA surface-mount package. It combines high logic density with a large I/O count and on-chip RAM to address demanding embedded and high-bandwidth interface tasks.

Targeted at applications requiring reprogrammable logic, parallel processing and flexible I/O, this device delivers 27,648 logic elements, 660 I/O pins and approximately 0.39 Mbits of embedded memory while operating from a 1.71 V to 1.89 V core supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• High-density logic — 27,648 logic elements (logic cells) and 1,569,178 gates for complex combinational and sequential designs.
• On-chip memory — 393,216 bits of total RAM (approximately 0.39 Mbits) to support buffering, FIFOs and local data storage.
• Extensive I/O — 660 user I/O pins to enable broad connectivity with external devices and interfaces.
• 1.8 V core supply — Nominal VCCINT range of 1.71 V to 1.89 V consistent with Virtex®-E family operation.
• Advanced I/O and signaling (series-level) — Series features include SelectI/O+ technology and support for differential standards such as LVDS, BLVDS and LVPECL for high-speed, source-synchronous interfaces.
• Clock management (series-level) — Family-level built-in clock management with multiple digital DLLs for clock multiply/divide and DDR-friendly duty-cycle synthesis.
• Packaging and mounting — 1156-BBGA (supplier device package 1156-FBGA, 35 × 35 mm) in a surface-mount form factor for compact board-level integration.
• Commercial grade and compliance — Designed for commercial operation (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High-performance embedded systems — Reconfigurable logic for compute-intensive control, signal processing and custom hardware acceleration.
• Network and communications interfaces — Large I/O count and series-level differential signaling support for front-end protocol handling and bridging.
• Memory interface controllers — On-chip RAM and series-level memory hierarchy features enable buffering and interface logic for external SRAM/DDR links.
• PCI-based systems — Series-level support for PCI-compliant 3.3 V, 32/64-bit, 33/66-MHz interfaces makes the device suitable for PCI logic and gateway designs.

Unique Advantages

• Significant logic capacity: 27,648 logic elements provide the headroom for medium- to large-scale FPGA designs without external gate arrays.
• High I/O density: 660 I/O pins simplify board-level connectivity and reduce the need for external multiplexing.
• On-chip RAM for latency-sensitive tasks: 393,216 bits of embedded memory enable local buffering, fast FIFOs and temporary data storage.
• Flexible clocking and high-speed interfaces (series-level): Built-in DLLs and differential signaling support allow robust clock distribution and high-rate serial/parallel links.
• Compact, surface-mount packaging: 1156-BBGA (35 × 35 mm) provides a dense footprint for space-constrained PCB designs.
• RoHS compliant: Meets environmental compliance expectations for commercial products.

Why Choose XCV1000E-8FG1156C?

The XCV1000E-8FG1156C positions itself as a versatile, high-density Virtex®-E FPGA optimized for commercial embedded designs that require significant logic resources, broad I/O connectivity and on-chip memory. Its 1.8 V core operation, surface-mount 1156-BBGA package and RoHS compliance make it suitable for compact, production-oriented PCBs operating in standard commercial environments.

Engineers developing reconfigurable hardware for networking, high-speed interfaces, PCI-based expansion or compute-acceleration tasks will find the device’s combination of logic capacity, I/O count and embedded RAM well suited for reducing external components and accelerating time-to-market.

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