XCV100E-6BG352I

IC FPGA 196 I/O 352MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 196 81920 2700 352-LBGA Exposed Pad, Metal

Quantity 99 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O196Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-6BG352I – Virtex®-E Field Programmable Gate Array (FPGA)

The XCV100E-6BG352I is an AMD Virtex‑E series SRAM-based FPGA in a 352‑ball LFBGA package, specified for industrial use. It provides a reprogrammable logic fabric with approximately 2,700 logic elements, on-chip embedded memory, and a broad I/O complement for mid-density designs in communications, industrial control, and embedded systems.

Built on the Virtex‑E family architecture, this device combines 1.8 V core operation with advanced I/O and clock-management features described for the Virtex‑E series to support demanding interface and timing requirements while maintaining reprogrammability and system-level flexibility.

Key Features

  • Core voltage and process — Internal supply range 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V family.
  • Logic capacity — Approximately 2,700 logic elements and about 128,236 gates for mid-density programmable logic implementations.
  • On‑chip memory — Total RAM of 81,920 bits (approximately 81.9 Kbits) of embedded memory for register files, FIFOs, and small buffers.
  • I/O resources — 196 user I/O pins suitable for diverse external interfaces; device is supplied in a 352‑LBGA exposed pad metal package (supplier package: 352‑MBGA, 35×35).
  • Family-level interface and timing features — Virtex‑E family capabilities include SelectI/O+ interface support and differential signalling options, and clock management elements such as multiple DLLs and DDR support as described in the series specification.
  • Configuration and reprogrammability — SRAM‑based in‑system configuration enabling unlimited reprogramming of device logic (Virtex‑E family characteristic).
  • Package and thermal — Surface-mount 352‑LBGA with exposed pad; operating temperature range −40 °C to 100 °C supports industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial automation and control — Industrial temperature rating and 196 I/O pins support sensor interfacing, motor-control logic, and field I/O aggregation.
  • Communications and networking — Family-level support for high-performance I/O standards and clock management is suitable for mid‑range packet processing, protocol bridging, and interface conversion tasks.
  • Embedded system acceleration — On-chip RAM and 2,700 logic elements enable hardware offload of compute-critical functions in embedded controllers and data‑path preprocessing.
  • Prototyping and in‑system reconfigurable designs — SRAM-based configuration allows iterative firmware and hardware development without replacing silicon.

Unique Advantages

  • Reprogrammable hardware — SRAM-based in-system configuration lets you update logic and fix bugs without board-level hardware changes.
  • Balanced mid-range capacity — Approximately 2,700 logic elements and ~128k gates provide a practical trade-off between density and cost for many embedded and control applications.
  • Industrial readiness — Specified operating range from −40 °C to 100 °C and surface-mount 352‑LBGA packaging support deployment in industrial environments.
  • Flexible I/O and packaging — 196 I/Os in a compact 352‑LBGA exposed pad package enable dense I/O routing while maintaining a small PCB footprint.
  • Standards-based family features — Virtex‑E series clock management, SelectI/O+ and differential signalling support (as per the series specification) offer options for high-speed interfaces and precise timing control.

Why Choose XCV100E-6BG352I?

The XCV100E-6BG352I delivers a practical, industrial-grade FPGA option for engineers needing reprogrammable logic with a clear set of mid-range resources: roughly 2,700 logic elements, ~81.9 Kbits of embedded RAM, and 196 I/Os in a 352‑LBGA package. It leverages the Virtex‑E family architecture to provide proven series-level features such as advanced I/O options and digital clock management while operating at a 1.8 V core supply.

This device is suitable for teams building embedded controls, communications interfaces, or prototype systems that require in-field reconfigurability, robust thermal range, and a compact package backed by the Virtex‑E series technical foundation.

Request a quote or submit an inquiry to check pricing and availability for XCV100E-6BG352I.

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