XCV100E-6BG352I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 196 81920 2700 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 99 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 196 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 128236 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of XCV100E-6BG352I – Virtex®-E Field Programmable Gate Array (FPGA)
The XCV100E-6BG352I is an AMD Virtex‑E series SRAM-based FPGA in a 352‑ball LFBGA package, specified for industrial use. It provides a reprogrammable logic fabric with approximately 2,700 logic elements, on-chip embedded memory, and a broad I/O complement for mid-density designs in communications, industrial control, and embedded systems.
Built on the Virtex‑E family architecture, this device combines 1.8 V core operation with advanced I/O and clock-management features described for the Virtex‑E series to support demanding interface and timing requirements while maintaining reprogrammability and system-level flexibility.
Key Features
- Core voltage and process — Internal supply range 1.71 V to 1.89 V consistent with the Virtex‑E 1.8 V family.
- Logic capacity — Approximately 2,700 logic elements and about 128,236 gates for mid-density programmable logic implementations.
- On‑chip memory — Total RAM of 81,920 bits (approximately 81.9 Kbits) of embedded memory for register files, FIFOs, and small buffers.
- I/O resources — 196 user I/O pins suitable for diverse external interfaces; device is supplied in a 352‑LBGA exposed pad metal package (supplier package: 352‑MBGA, 35×35).
- Family-level interface and timing features — Virtex‑E family capabilities include SelectI/O+ interface support and differential signalling options, and clock management elements such as multiple DLLs and DDR support as described in the series specification.
- Configuration and reprogrammability — SRAM‑based in‑system configuration enabling unlimited reprogramming of device logic (Virtex‑E family characteristic).
- Package and thermal — Surface-mount 352‑LBGA with exposed pad; operating temperature range −40 °C to 100 °C supports industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- Industrial automation and control — Industrial temperature rating and 196 I/O pins support sensor interfacing, motor-control logic, and field I/O aggregation.
- Communications and networking — Family-level support for high-performance I/O standards and clock management is suitable for mid‑range packet processing, protocol bridging, and interface conversion tasks.
- Embedded system acceleration — On-chip RAM and 2,700 logic elements enable hardware offload of compute-critical functions in embedded controllers and data‑path preprocessing.
- Prototyping and in‑system reconfigurable designs — SRAM-based configuration allows iterative firmware and hardware development without replacing silicon.
Unique Advantages
- Reprogrammable hardware — SRAM-based in-system configuration lets you update logic and fix bugs without board-level hardware changes.
- Balanced mid-range capacity — Approximately 2,700 logic elements and ~128k gates provide a practical trade-off between density and cost for many embedded and control applications.
- Industrial readiness — Specified operating range from −40 °C to 100 °C and surface-mount 352‑LBGA packaging support deployment in industrial environments.
- Flexible I/O and packaging — 196 I/Os in a compact 352‑LBGA exposed pad package enable dense I/O routing while maintaining a small PCB footprint.
- Standards-based family features — Virtex‑E series clock management, SelectI/O+ and differential signalling support (as per the series specification) offer options for high-speed interfaces and precise timing control.
Why Choose XCV100E-6BG352I?
The XCV100E-6BG352I delivers a practical, industrial-grade FPGA option for engineers needing reprogrammable logic with a clear set of mid-range resources: roughly 2,700 logic elements, ~81.9 Kbits of embedded RAM, and 196 I/Os in a 352‑LBGA package. It leverages the Virtex‑E family architecture to provide proven series-level features such as advanced I/O options and digital clock management while operating at a 1.8 V core supply.
This device is suitable for teams building embedded controls, communications interfaces, or prototype systems that require in-field reconfigurability, robust thermal range, and a compact package backed by the Virtex‑E series technical foundation.
Request a quote or submit an inquiry to check pricing and availability for XCV100E-6BG352I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








