XCV100E-6CS144I

The XCV100E-6CS144I is an industrial‑grade Virtex®-E field programmable gate array supplied by AMD. This 1.8 V SRAM‑based FPGA delivers a compact, surface‑mount solution in a 144‑TFBGA/CSPBGA package, tailored for designs that require reprogrammability, on‑chip memory and flexible I/O in a small footprint.

Typical use cases include high‑performance logic integration, protocol bridging and memory interface applications where deterministic temperature range (‑40 °C to 100 °C), a 1.71–1.89 V core supply and 94 available I/O pins are important design drivers.

Key Features

• Logic Capacity — Approximately 2,700 logic elements arranged across 600 CLBs, supporting medium‑density FPGA implementations.
• On‑Chip Memory — 81,920 total RAM bits of embedded memory (approximately 0.08 Mbits) for local storage and buffering.
• I/O and Interface — 94 user I/O pins in the 144‑TFBGA package, enabling diverse external connectivity and interface implementations.
• Core and Power — 1.71 V to 1.89 V core voltage supply aligned with the Virtex‑E 1.8 V family characteristics for low‑voltage operation.
• Package and Mounting — Surface mount 144‑TFBGA (supplier package: 144‑LCSBGA 12×12) for compact board layouts and high‑density systems.
• Industrial Temperature Range — Specified operating range from ‑40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly and regulatory compliance.
• Family-Level Capabilities — Virtex‑E series features in the datasheet include high‑performance SelectI/O+ technology, multiple DLLs for clock management, and support for differential I/O standards such as LVDS and LVPECL (series capability; consult device datasheet for device‑specific details).

Typical Applications

• High‑speed data interfaces — Implement protocol bridging and custom PHY interfaces using the device’s flexible I/O and differential signalling support at the series level.
• Memory controller and buffering — On‑chip RAM and family support for synchronous block RAM enable local buffering and memory interface logic for external SRAM/DDR devices.
• Industrial control and automation — Industrial temperature rating and surface‑mount packaging suit embedded controllers, motor control interfaces and factory automation modules.
• Embedded system prototyping — Reprogrammability and a compact BGA package make the device suitable for iterative development of mid‑density FPGA designs.

Unique Advantages

• Compact, high‑function density — 144‑TFBGA packaging with ~2,700 logic elements provides a balance of capability and small PCB area.
• Industrial suitability — Rated for ‑40 °C to 100 °C operation to support industrial application requirements.
• Deterministic power domain — Narrow core voltage window (1.71–1.89 V) simplifies power supply design for 1.8 V FPGA systems.
• Reprogrammable logic — SRAM‑based architecture enables in‑system reconfiguration to iterate designs or field‑update functionality.
• Clear integration path — 94 I/O pins and family‑level support for a range of I/O standards enable direct interfacing to external memories, transceivers and peripherals.

Why Choose XCV100E-6CS144I?

The XCV100E-6CS144I positions itself as a compact, industrial‑rated Virtex‑E FPGA option for engineers who need reprogrammable logic, embedded RAM and a flexible I/O set in a small BGA footprint. Its specified core voltage range, package options and operating temperature make it well suited to mid‑density designs requiring reliable operation in industrial environments.

This device is appropriate for teams building protocol bridges, memory interfaces, embedded controllers or prototype systems that benefit from the Virtex‑E family features while staying within a modest logic and memory footprint.

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