XCV100E-6PQ240C

The XCV100E-6PQ240C is a Virtex®-E Field Programmable Gate Array (FPGA) IC from AMD supplied in a 240-pin BFQFP surface-mount package. It combines a mid-range logic capacity with a high I/O count and on-chip RAM to address interface‑heavy and memory‑centric designs.

Designed around the Virtex‑E 1.8 V FPGA family architecture, this device delivers flexible I/O options, embedded memory resources, and clock management features suited to system integration in commercial applications operating from 0 °C to 85 °C.

Key Features

• Core Architecture  Virtex‑E 1.8 V FPGA architecture with 2,700 logic elements and 128,236 gates for mid-density programmable logic.
• On‑Chip Memory  Approximately 81,920 bits of embedded RAM for local buffering and small embedded memory structures.
• I/O Resources  158 user I/O pins provided in the 240‑BFQFP package to support high‑pin‑count interfaces and board-level connectivity.
• High‑Performance I/O Technologies (family level)  Virtex‑E family supports advanced differential signalling standards (LVDS, BLVDS, LVPECL) and source‑synchronous data transmission options for high‑speed interfaces.
• Clock Management (family level)  Virtex‑E family includes multiple digital Delay‑Locked Loops (DLLs) and support for DDR timing schemes to simplify clocking and timing for high‑speed designs.
• Power and Supply  VCCINT (internal core) operating range 1.71 V to 1.89 V; I/O buffers are compatible with family‑level multi‑standard I/O schemes.
• Package and Mounting  Supplied in a 240‑pin BFQFP (240‑PQFP 32×32) surface‑mount package for compact board implementation.
• Commercial Grade and Environmental  Commercial temperature rating (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High‑speed interface bridging  Use the device where dense I/O and differential signalling options are required to implement protocol bridging and board‑level interface logic.
• Memory‑interface control  On‑chip RAM and family memory features support buffering and control logic for external memory interfaces in embedded systems.
• Custom logic and glue‑logic  Mid‑density logic and abundant I/O make the part suitable for replacing discrete glue logic or implementing custom peripheral controllers.
• Prototyping and system integration  Surface‑mount 240‑pin packaging and reprogrammability allow use in development platforms and prototype boards.

Unique Advantages

• Balanced mid‑range capacity: 2,700 logic elements and 128,236 gates provide a practical balance of logic resources without the overhead of larger devices.
• Significant I/O density: 158 I/O pins in a compact 240‑pin BFQFP package enable complex board‑level connectivity and multi‑channel interfaces.
• On‑chip memory for buffering: 81,920 bits of embedded RAM reduce the need for external buffering in many applications.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for broad commercial deployment.
• Surface‑mount packaging: 240‑PQFP (32×32) footprint supports standard SMD assembly flows for compact designs.

Why Choose XCV100E-6PQ240C?

The XCV100E-6PQ240C offers a practical, commercially graded FPGA solution for engineers who need a mid‑density programmable device with a high I/O count and on‑chip memory. Its Virtex‑E family architecture brings proven clock management and differential I/O capabilities to support interface‑driven designs.

This device is well suited for development and production applications that demand flexible logic implementation, substantial I/O connectivity, and compact BFQFP packaging. Its combination of logic elements, embedded RAM, and family‑level features provides a reliable platform for system integration and prototyping in commercial environments.

Request a quote or submit a purchase inquiry for the XCV100E-6PQ240C to obtain availability and pricing information tailored to your project needs.