XCV100E-6PQG240C

The XCV100E-6PQG240C is a Virtex®-E Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 240-BFQFP (240-PQFP 32×32) surface-mount package. It implements an SRAM-based, reprogrammable FPGA architecture operating from a 1.71 V to 1.89 V core supply and is targeted at commercial-temperature designs.

With 2,700 logic elements, approximately 82 Kbits (81,920 bits) of embedded RAM, and 158 user I/Os, this device is suited to applications that require medium-density logic, flexible I/O signaling, and on-chip memory for control, interface, or data-buffering functions.

Key Features

• Logic Capacity 2,700 logic elements suitable for medium-density FPGA designs and custom logic implementation.
• Embedded Memory Approximately 81,920 bits of on-chip RAM for local data buffering and small embedded memory structures.
• I/O 158 user I/O pins supporting a range of interface configurations and system-level connectivity.
• Performance (Family) Virtex‑E family features include internal performance up to 130 MHz (four LUT levels) and support for high-performance signaling standards as described in the Virtex‑E production specification.
• Configuration SRAM-based in-system reprogrammable architecture, enabling design updates and iterative development.
• Power Core supply range of 1.71 V to 1.89 V in accordance with Virtex‑E 1.8 V device family requirements.
• Package & Mounting 240-BFQFP (supplier package listed as 240-PQFP 32×32), surface-mount package for compact board-level implementation.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Reliability (Family) Virtex‑E family includes features such as built-in clock management DLLs, SelectRAM+ memory hierarchy, and IEEE 1149.1 boundary-scan support as documented in the production specification.
• Compliance RoHS-compliant device.

Typical Applications

• High-performance interfaces Use for protocol bridging and custom interface logic where flexible I/O and medium logic density are required.
• Embedded control & glue logic Implement control state machines, peripheral interfaces, and custom timing logic within a single reprogrammable device.
• Memory interface support On-chip RAM and Virtex‑E family memory features assist in buffering and timing-critical data paths for external memory interfaces.
• Prototype and development Ideal for iterative hardware development cycles that benefit from SRAM-based in-system reconfiguration and rapid design changes.

Unique Advantages

• Reprogrammable FPGA architecture: SRAM-based configuration enables in-system updates and fast design iteration without board-level changes.
• Balanced integration: Combines 2,700 logic elements, embedded RAM, and 158 I/Os in a compact 240-BFQFP package to reduce BOM and board footprint.
• Commercial-temperature suitability: Rated for 0 °C to 85 °C operation, matching many consumer and industrial commercial applications.
• Family-level performance features: Leverages Virtex‑E family capabilities such as DLL-based clock management and high-performance I/O options for system-level timing flexibility.
• RoHS compliance: Supports environmental and regulatory requirements for lead-free assembly.

Why Choose XCV100E-6PQG240C?

The XCV100E-6PQG240C provides a medium-density, 1.8 V Virtex‑E FPGA solution in a compact PQFP package, offering a practical balance of logic capacity, embedded RAM, and I/O count for commercial-temperature applications. Its SRAM-based configurability and Virtex‑E family features support iterative development, interface flexibility, and on-chip memory usage for buffered data paths and control logic.

This device is well suited to designers seeking a reprogrammable FPGA that integrates moderate logic resources and I/O in a surface-mount package, backed by the Virtex‑E production specification and RoHS compliance for standard commercial deployment.

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