XCV100E-6FG256I

The XCV100E-6FG256I is a Virtex®-E family Field Programmable Gate Array provided in a 256-BGA surface-mount package. It delivers reprogrammable logic with 2,700 logic elements, approximately 0.08 Mbits of embedded RAM (81,920 bits) and 176 general I/O pins, designed for industrial-grade applications.

Built on the Virtex‑E 1.8 V FPGA architecture, the device offers series-level capabilities including high-performance internal timing, flexible I/O standards and on-chip memory resources suitable for industrial systems requiring configurable logic, dense I/O and reprogrammability.

Key Features

• Logic Capacity — 2,700 logic elements and approximately 128,236 equivalent gates for implementing custom digital functions and glue logic.
• Embedded Memory — 81,920 bits of on-chip RAM (approximately 0.08 Mbits) for small data buffers, FIFOs and LUT-based storage.
• I/O Density and Flexibility — 176 I/O pins available in a 256-ball FBGA footprint (17×17); supports a wide selection of I/O standards at the Virtex‑E family level.
• Voltage Supply — Internal supply range VCCINT: 1.71 V to 1.89 V, enabling 1.8 V logic operation.
• Performance — Series-level internal performance cited up to 130 MHz (four LUT levels) and built-in clock management with multiple DLLs for clocking flexibility.
• Configuration and Re-programmability — SRAM-based in-system configuration for unlimited re-programmability and iterative development.
• Package and Mounting — 256-BGA (supplier package: 256-FBGA, 17×17), surface-mount for high-density board designs.
• Industrial Thermal Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards and Interfaces (Series Features) — Virtex‑E family supports high-performance differential signaling (LVDS, LVPECL, BLVDS), PCI-compliant operation at 3.3 V (32/64-bit, 33/66 MHz), and high-bandwidth memory interfaces as described in the Virtex‑E product specification.

Typical Applications

• Industrial Control — Reconfigurable logic and robust thermal rating enable custom control logic, protocol bridging and I/O aggregation in industrial systems.
• PCI-Based Interface Logic — Series-level PCI compliance supports implementation of interface controllers and bus adapters for 3.3 V PCI systems.
• High-Speed Memory Interfaces — On-chip RAM and Virtex‑E memory features support designs that require interfaces to fast external memories and controlled timing.
• Differential Signaling Applications — Series support for LVDS, BLVDS and LVPECL allows use in designs that require high-speed differential I/O.

Unique Advantages

• Reprogrammable Architecture: SRAM-based configuration enables rapid iteration and in-field updates without board-level changes.
• Balanced Logic and Memory: Combination of 2,700 logic elements and on-chip RAM provides a compact platform for moderate-complexity custom functions with local buffering.
• Industrial-Grade Reliability: Specified −40 °C to 100 °C operating temperature supports deployment in harsh industrial environments.
• Flexible I/O in a Compact Package: 176 I/Os in a 256-FBGA (17×17) footprint facilitate high-density designs while preserving broad interface options.
• Proven Series-Level Capabilities: Virtex‑E family features such as multiple DLLs, differential signaling support and PCI compliance broaden system-level integration choices.

Why Choose XCV100E-6FG256I?

The XCV100E-6FG256I is positioned for engineers who need a reprogrammable, industrial-grade FPGA with a compact BGA package, moderate logic density and flexible I/O. Its combination of 2,700 logic elements, on-chip RAM and 176 I/Os makes it suitable for industrial control, interface logic and applications requiring field-updateable logic.

As a member of the Virtex‑E family, the device benefits from series-level features such as clock management, differential I/O standards and in-system SRAM configuration—providing a balanced platform for medium-complexity designs where configurability, I/O flexibility and industrial temperature operation are required.

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