XCV100E-6PQ240I
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 158 81920 2700 240-BFQFP |
|---|---|
| Quantity | 212 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 158 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 128236 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of XCV100E-6PQ240I – Virtex®-E Field Programmable Gate Array (FPGA) IC 158 81920 2700 240-BFQFP
The XCV100E-6PQ240I is an SRAM-based Virtex®-E field programmable gate array in a 240-BFQFP surface-mount package, offered in an industrial grade variant. It combines reprogrammable logic, on-chip memory and flexible I/O to address industrial and embedded system designs that require deterministic operation across a wide temperature range.
With 2,700 logic elements, 158 user I/Os and approximately 0.08 Mbits of embedded memory (81,920 bits), this device balances logic capacity and I/O density for applications that need configurable hardware acceleration and high-bandwidth interfacing while operating from a 1.71 V to 1.89 V core supply.
Key Features
- FPGA Core 2,700 logic elements and 128,236 equivalent gates provide programmable logic resources for custom implementations.
- Embedded Memory Approximately 0.08 Mbits (81,920 bits) of on-chip RAM for buffering, FIFOs and small local data stores.
- I/O Capacity & Flexibility 158 user I/Os allow broad external interfacing; family-level SelectI/O+ technology and differential signaling support (LVDS, BLVDS, LVPECL) are part of the Virtex‑E feature set.
- Clock Management (Family-Level) Virtex‑E family devices include advanced clock circuitry such as eight fully digital Delay-Locked Loops (DLLs) for scalable clocking and DDR-friendly timing.
- Memory & Interface Support (Family-Level) The Virtex‑E family provides SelectRAM+ memory hierarchy and design support for high-performance external memories and DDR links.
- Package & Mounting 240-BFQFP (supplier package: 240-PQFP 32×32) in a surface-mount form factor suitable for board-assembly workflows.
- Power & Operating Range Core supply specified from 1.71 V to 1.89 V; rated for operation from −40 °C to 100 °C (industrial grade).
- Compliance & Test RoHS compliant and family documentation indicates 100% factory testing for production-level quality assurance.
Typical Applications
- Industrial Control Deterministic operation across −40 °C to 100 °C and industrial-grade classification make it suitable for automation control, motor drive logic and factory instrumentation.
- High‑Speed Interfaces Use in designs requiring robust I/O and differential signaling support for high-bandwidth links and source-synchronous data paths.
- Memory Interface & Bridging Implement custom memory controllers and data-path logic leveraging the Virtex‑E family’s memory hierarchy and external memory interface support.
- In-System Programmable Logic SRAM-based architecture enables field reprogramming for iterative development, feature upgrades, and in‑field customization.
Unique Advantages
- Balanced Logic and I/O Density: 2,700 logic elements with 158 I/Os provide a practical ratio of compute fabric to external connectivity for mixed-signal and control-focused designs.
- Flexibility for Diverse I/O Standards: Family-level SelectI/O+ and differential signaling support simplify interfacing to modern high-speed standards and external transceivers.
- Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet demanding environmental conditions common in industrial deployments.
- Reprogrammable In-System Configuration: SRAM-based architecture enables iterative updates and in-field feature changes without hardware swaps.
- Proven Production Quality: RoHS compliance and family documentation noting 100% factory testing support reliable supply-chain integration.
- Efficient Power Envelope: Low-voltage core operation (1.71 V–1.89 V) helps minimize core power consumption in power-sensitive systems.
Why Choose XCV100E-6PQ240I?
The XCV100E-6PQ240I delivers a compact, industrial-grade Virtex‑E FPGA option where a combination of reprogrammable logic, moderate embedded memory and a substantial I/O count are required. Its industrial temperature rating, surface-mount 240-BFQFP packaging and RoHS compliance make it a suitable selection for robust embedded systems, industrial automation and high-speed interface applications.
Designed for engineering teams that need field-updatable hardware and flexible I/O, this device provides a scalable solution backed by Virtex‑E family capabilities—balancing integration, configurability and production-level testing to support long-term deployment.
Request a quote or submit a parts inquiry for XCV100E-6PQ240I to check availability, lead times and pricing for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








