XCV100E-6FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 81920 2700 256-BGA

Quantity 67 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-6FG256C – Virtex®-E FPGA, 256-BGA, 176 I/O

The XCV100E-6FG256C is a Virtex®-E series field programmable gate array (FPGA) in a 256-ball BGA package designed for commercial embedded and communications applications. It provides a compact, surface-mount FPGA solution with a high I/O count and on-chip programmable logic suitable for implementing custom interfaces, memory controllers, and system glue logic.

Configured for 1.8 V core operation and RoHS compliance, this device balances moderate logic density with substantial I/O connectivity and embedded RAM to support diverse system-level functions in space-constrained designs.

Key Features

  • Logic Capacity — Approximately 2,700 logic elements and 128,236 equivalent gates for implementing combinational and sequential logic functions.
  • Embedded Memory — Total on-chip RAM of 81,920 bits (approximately 0.08 Mbits) to support buffers, FIFOs and small data stores.
  • I/O and Interface Flexibility — 176 user I/Os that support a wide range of single-ended and differential signaling standards (series documentation highlights LVDS, BLVDS and LVPECL support at the family level).
  • Package and Mounting — 256-ball FBGA (17 × 17) package in a surface-mount form factor for board-level integration where space and signal routing density matter.
  • Power and Voltage — Core supply specified from 1.71 V to 1.89 V (1.8 V nominal), enabling lower-power logic operation compared with older 2.5 V families.
  • Operating Range — Commercial grade temperature range of 0 °C to 85 °C suitable for standard embedded and communications equipment.
  • Configuration and Ecosystem (series) — Virtex-E family documentation describes SRAM-based in-system reprogrammability and support from Xilinx development tools for design implementation and iteration.
  • Compliance and Reliability — RoHS-compliant manufacturing and 100% factory-tested devices as documented for the Virtex-E family.

Typical Applications

  • High-speed communications — Implement protocol logic, serializers/deserializers, and custom interface bridging using the device’s high I/O count and family-level support for differential standards.
  • Memory interface controllers — Use on-chip logic and embedded RAM to build SRAM or SDRAM interface logic and buffering for mid-range memory systems.
  • PCI and bus-based systems — The Virtex-E family documentation includes PCI-compliant capabilities; this device can be applied where PCI-compatible logic and glue are required.
  • Embedded control and prototyping — Rapidly iterate FPGA-based control logic, algorithm acceleration, or system prototyping leveraging in-system reprogrammability.

Unique Advantages

  • High I/O density: 176 user I/Os provide ample external connectivity for multi-channel interfaces and complex boards.
  • Compact BGA package: 256-FBGA (17×17) delivers a small board footprint while maintaining routing density for high-pin-count designs.
  • Low-voltage core: 1.8 V core supply reduces power consumption relative to higher-voltage families, benefiting thermal and power budgets.
  • On-chip memory resources: Approximately 0.08 Mbits of embedded RAM supports local buffering and small data structures without external memory.
  • Commercial-grade, RoHS-compliant: Manufactured to commercial specifications and RoHS-compliant for standard electronics applications.
  • Reprogrammable architecture (series): SRAM-based in-system configuration documented for the Virtex-E family enables design updates and field revisions.

Why Choose XCV100E-6FG256C?

The XCV100E-6FG256C provides a balanced solution for designers who need moderate logic density combined with a large number of I/Os in a compact BGA package. Its 1.8 V core operation, surface-mount 256-FBGA footprint, and commercial temperature rating make it appropriate for embedded and communications applications where board space, I/O count, and reprogrammability are priorities.

Backed by the Virtex-E family’s documented features—such as differential signaling support, in-system configuration, and toolchain support—this device is well suited for teams building prototype systems, interface logic, or mid-range FPGA-based controllers that require a proven, reprogrammable platform.

Request a quote or submit an inquiry for pricing and availability on the XCV100E-6FG256C to move your design forward.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up