XCV100E-6FG256C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 81920 2700 256-BGA |
|---|---|
| Quantity | 67 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 128236 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of XCV100E-6FG256C – Virtex®-E FPGA, 256-BGA, 176 I/O
The XCV100E-6FG256C is a Virtex®-E series field programmable gate array (FPGA) in a 256-ball BGA package designed for commercial embedded and communications applications. It provides a compact, surface-mount FPGA solution with a high I/O count and on-chip programmable logic suitable for implementing custom interfaces, memory controllers, and system glue logic.
Configured for 1.8 V core operation and RoHS compliance, this device balances moderate logic density with substantial I/O connectivity and embedded RAM to support diverse system-level functions in space-constrained designs.
Key Features
- Logic Capacity — Approximately 2,700 logic elements and 128,236 equivalent gates for implementing combinational and sequential logic functions.
- Embedded Memory — Total on-chip RAM of 81,920 bits (approximately 0.08 Mbits) to support buffers, FIFOs and small data stores.
- I/O and Interface Flexibility — 176 user I/Os that support a wide range of single-ended and differential signaling standards (series documentation highlights LVDS, BLVDS and LVPECL support at the family level).
- Package and Mounting — 256-ball FBGA (17 × 17) package in a surface-mount form factor for board-level integration where space and signal routing density matter.
- Power and Voltage — Core supply specified from 1.71 V to 1.89 V (1.8 V nominal), enabling lower-power logic operation compared with older 2.5 V families.
- Operating Range — Commercial grade temperature range of 0 °C to 85 °C suitable for standard embedded and communications equipment.
- Configuration and Ecosystem (series) — Virtex-E family documentation describes SRAM-based in-system reprogrammability and support from Xilinx development tools for design implementation and iteration.
- Compliance and Reliability — RoHS-compliant manufacturing and 100% factory-tested devices as documented for the Virtex-E family.
Typical Applications
- High-speed communications — Implement protocol logic, serializers/deserializers, and custom interface bridging using the device’s high I/O count and family-level support for differential standards.
- Memory interface controllers — Use on-chip logic and embedded RAM to build SRAM or SDRAM interface logic and buffering for mid-range memory systems.
- PCI and bus-based systems — The Virtex-E family documentation includes PCI-compliant capabilities; this device can be applied where PCI-compatible logic and glue are required.
- Embedded control and prototyping — Rapidly iterate FPGA-based control logic, algorithm acceleration, or system prototyping leveraging in-system reprogrammability.
Unique Advantages
- High I/O density: 176 user I/Os provide ample external connectivity for multi-channel interfaces and complex boards.
- Compact BGA package: 256-FBGA (17×17) delivers a small board footprint while maintaining routing density for high-pin-count designs.
- Low-voltage core: 1.8 V core supply reduces power consumption relative to higher-voltage families, benefiting thermal and power budgets.
- On-chip memory resources: Approximately 0.08 Mbits of embedded RAM supports local buffering and small data structures without external memory.
- Commercial-grade, RoHS-compliant: Manufactured to commercial specifications and RoHS-compliant for standard electronics applications.
- Reprogrammable architecture (series): SRAM-based in-system configuration documented for the Virtex-E family enables design updates and field revisions.
Why Choose XCV100E-6FG256C?
The XCV100E-6FG256C provides a balanced solution for designers who need moderate logic density combined with a large number of I/Os in a compact BGA package. Its 1.8 V core operation, surface-mount 256-FBGA footprint, and commercial temperature rating make it appropriate for embedded and communications applications where board space, I/O count, and reprogrammability are priorities.
Backed by the Virtex-E family’s documented features—such as differential signaling support, in-system configuration, and toolchain support—this device is well suited for teams building prototype systems, interface logic, or mid-range FPGA-based controllers that require a proven, reprogrammable platform.
Request a quote or submit an inquiry for pricing and availability on the XCV100E-6FG256C to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








