XCV100E-6BG352I0773

The XCV100E-6BG352I0773 is a Virtex®-E field programmable gate array (FPGA) in a 352-ball BGA package designed for industrial applications. It provides a balanced set of programmable logic resources, on-chip memory, and I/O density for designs that require embedded logic and configurable interfacing.

Key electrical and environmental characteristics include a supply voltage range of 1.71 V to 1.89 V and an operating temperature range of −40 °C to 100 °C, supporting deployment in industrial temperature environments.

Key Features

• Programmable Logic 600 configurable logic blocks (CLBs) providing 2,700 logic elements for implementing custom digital functions.
• Embedded Memory Approximately 0.082 Mbits of on-chip RAM (81,920 bits) for data buffering and small lookup tables.
• Logic Capacity 128,236 equivalent gates available to map medium-scale digital designs.
• I/O Density 196 user I/O pins to support multiple parallel interfaces and external device connections.
• Package & Mounting 352-ball LBGA with exposed pad, metal construction; supplier device package listed as 352-MBGA (35×35). Surface-mount mounting type suitable for PCB assembly.
• Power & Thermal Narrow supply voltage window of 1.71 V to 1.89 V and rated to operate from −40 °C to 100 °C for industrial-grade thermal performance.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High I/O Count: 196 I/O pins allow flexible interfacing with external peripherals and parallel buses.
• Balanced Logic and Memory: Combination of 600 CLBs and ~0.082 Mbits of RAM supports a mix of control, glue-logic, and data buffering tasks.
• Substantial Gate Resources: 128,236 gates enable mapping of moderate-complexity digital functions without external logic expansion.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet robust environmental requirements.
• Compact BGA Package: 352-ball LBGA with exposed pad delivers a compact footprint with thermal management suited for surface-mount assembly.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly processes.

Why Choose XCV100E-6BG352I0773?

The XCV100E-6BG352I0773 positions itself as a versatile Virtex®-E FPGA offering a practical balance of logic, memory, and I/O in a compact BGA package. Its combination of CLBs, logic capacity, and I/O density makes it suitable for engineers who need programmable logic resources within a controlled supply-voltage window and industrial temperature range.

For projects that require configurable FPGA resources with on-chip RAM and robust thermal capability, this device delivers measurable, verifiable specifications that simplify hardware planning and deployment.

Request a quote or submit a request for pricing and availability for the XCV100E-6BG352I0773 to begin procurement and design planning.