XCV100E-6BG352C

IC FPGA 196 I/O 352MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 196 81920 2700 352-LBGA Exposed Pad, Metal

Quantity 488 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package352-MBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case352-LBGA Exposed Pad, MetalNumber of I/O196Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-6BG352C – Virtex®-E FPGA, 352-LBGA

The XCV100E-6BG352C is a Virtex®-E family field programmable gate array supplied in a 352-pin metal LBGA package with an exposed pad. This commercial-grade, surface-mount FPGA delivers moderate logic density and flexible I/O for embedded and system-level designs that require reprogrammability and integration in a compact footprint.

Designed around a 1.8 V core supply range, the device is suited to a range of commercial applications where on-chip logic, memory and extensive I/O are required alongside support from the Virtex-E family development ecosystem.

Key Features

  • Logic Capacity  Approximately 2,700 logic elements (128,236 equivalent system gates) for implementing combinational and sequential logic functions.
  • Embedded Memory  Total on-chip RAM of 81,920 bits—approximately 0.082 Mbits—supporting local buffering, FIFOs and small data stores.
  • I/O Resources  196 user I/O pins to support multiple interfaces and board-level connectivity in medium-complexity designs.
  • Core Voltage  1.71 V to 1.89 V supply range for the internal logic and memory, compatible with 1.8 V system designs.
  • Package & Mounting  352-LBGA metal package with exposed pad (supplier package: 352-MBGA 35×35); surface-mount mounting for compact PCB integration.
  • Operating Range & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • RoHS Compliance  RoHS-compliant device suitable for lead-free assembly processes.
  • Virtex‑E Family Capabilities  As a member of the Virtex‑E series, the device benefits from family-level features such as high-performance SelectI/O+ technology, multi-standard differential signalling support (LVDS, BLVDS, LVPECL), multiple DLLs for clock management, and support through Xilinx Foundation and Alliance Series development tools (family-level information).

Typical Applications

  • Embedded Systems  Implements custom logic, peripheral interfaces and glue logic in compact, reprogrammable embedded platforms.
  • Interface Bridging  Handles protocol adaptation and I/O aggregation where multiple signal standards and numerous I/Os are required.
  • Prototyping & Proof‑of‑Concept  Useful for evaluating custom logic and system functions in laboratory and development environments due to reprogrammability.
  • Telecommunications & Networking  Supports moderate-density packet processing, control-plane functions or interface logic that benefit from FPGA reconfiguration and on-chip memory.

Unique Advantages

  • Moderate logic density in a compact package: 2,700 logic elements and a 352-LBGA footprint enable significant functionality in space-constrained PCBs.
  • Extensive I/O count: 196 I/Os provide flexibility for mixed-signal interfaces, parallel buses and multi-channel connectivity without external translators.
  • Low-voltage core operation: 1.71–1.89 V supply range aligns with 1.8 V system architectures to simplify power-rail design.
  • RoHS compliant and surface-mount ready: Facilitates lead-free manufacturing and modern SMT assembly flows.
  • Family-level ecosystem support: Leverages Virtex‑E development tools and methodologies for design synthesis and debugging (family-level capability).
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments and office/indoor environments.

Why Choose XCV100E-6BG352C?

The XCV100E-6BG352C combines the Virtex‑E family’s architectural advantages with a compact 352-LBGA package, offering a balance of logic capacity, on-chip RAM and extensive I/O for commercial embedded and system-level designs. Its 1.8 V core supply range and surface-mount form factor make it straightforward to integrate into modern PCBs while meeting RoHS requirements.

This device is well suited to engineers and procurement teams looking for a reprogrammable, moderate-density FPGA solution backed by the Virtex‑E family toolchain and documentation—ideal for prototyping, interface logic and small-to-medium complexity control and data-processing tasks.

Request a quote or submit a pricing request for the XCV100E-6BG352C to initiate procurement and availability checks.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up