XCV100E-6BG352C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 196 81920 2700 352-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 488 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 352-MBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-LBGA Exposed Pad, Metal | Number of I/O | 196 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 128236 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of XCV100E-6BG352C – Virtex®-E FPGA, 352-LBGA
The XCV100E-6BG352C is a Virtex®-E family field programmable gate array supplied in a 352-pin metal LBGA package with an exposed pad. This commercial-grade, surface-mount FPGA delivers moderate logic density and flexible I/O for embedded and system-level designs that require reprogrammability and integration in a compact footprint.
Designed around a 1.8 V core supply range, the device is suited to a range of commercial applications where on-chip logic, memory and extensive I/O are required alongside support from the Virtex-E family development ecosystem.
Key Features
- Logic Capacity Approximately 2,700 logic elements (128,236 equivalent system gates) for implementing combinational and sequential logic functions.
- Embedded Memory Total on-chip RAM of 81,920 bits—approximately 0.082 Mbits—supporting local buffering, FIFOs and small data stores.
- I/O Resources 196 user I/O pins to support multiple interfaces and board-level connectivity in medium-complexity designs.
- Core Voltage 1.71 V to 1.89 V supply range for the internal logic and memory, compatible with 1.8 V system designs.
- Package & Mounting 352-LBGA metal package with exposed pad (supplier package: 352-MBGA 35×35); surface-mount mounting for compact PCB integration.
- Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
- RoHS Compliance RoHS-compliant device suitable for lead-free assembly processes.
- Virtex‑E Family Capabilities As a member of the Virtex‑E series, the device benefits from family-level features such as high-performance SelectI/O+ technology, multi-standard differential signalling support (LVDS, BLVDS, LVPECL), multiple DLLs for clock management, and support through Xilinx Foundation and Alliance Series development tools (family-level information).
Typical Applications
- Embedded Systems Implements custom logic, peripheral interfaces and glue logic in compact, reprogrammable embedded platforms.
- Interface Bridging Handles protocol adaptation and I/O aggregation where multiple signal standards and numerous I/Os are required.
- Prototyping & Proof‑of‑Concept Useful for evaluating custom logic and system functions in laboratory and development environments due to reprogrammability.
- Telecommunications & Networking Supports moderate-density packet processing, control-plane functions or interface logic that benefit from FPGA reconfiguration and on-chip memory.
Unique Advantages
- Moderate logic density in a compact package: 2,700 logic elements and a 352-LBGA footprint enable significant functionality in space-constrained PCBs.
- Extensive I/O count: 196 I/Os provide flexibility for mixed-signal interfaces, parallel buses and multi-channel connectivity without external translators.
- Low-voltage core operation: 1.71–1.89 V supply range aligns with 1.8 V system architectures to simplify power-rail design.
- RoHS compliant and surface-mount ready: Facilitates lead-free manufacturing and modern SMT assembly flows.
- Family-level ecosystem support: Leverages Virtex‑E development tools and methodologies for design synthesis and debugging (family-level capability).
- Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments and office/indoor environments.
Why Choose XCV100E-6BG352C?
The XCV100E-6BG352C combines the Virtex‑E family’s architectural advantages with a compact 352-LBGA package, offering a balance of logic capacity, on-chip RAM and extensive I/O for commercial embedded and system-level designs. Its 1.8 V core supply range and surface-mount form factor make it straightforward to integrate into modern PCBs while meeting RoHS requirements.
This device is well suited to engineers and procurement teams looking for a reprogrammable, moderate-density FPGA solution backed by the Virtex‑E family toolchain and documentation—ideal for prototyping, interface logic and small-to-medium complexity control and data-processing tasks.
Request a quote or submit a pricing request for the XCV100E-6BG352C to initiate procurement and availability checks.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








