XCV100E-7BG352C

The XCV100E-7BG352C is a Virtex®-E family Field Programmable Gate Array (FPGA) in a 352‑land BGA exposed‑pad package, designed for commercial applications requiring a flexible, reprogrammable logic solution. This device integrates 2,700 logic elements, approximately 0.08 Mbits of on‑chip RAM (81,920 bits), and 196 user I/Os to support complex glue logic, protocol bridging, and moderate-density digital processing tasks.

Built on the Virtex‑E architecture, the device benefits from the family’s low‑voltage 1.8 V core technology and SelectI/O/SelectRAM capabilities described in the Virtex‑E specification, providing a balance of performance, I/O flexibility, and in‑system reprogrammability for embedded and communications-focused designs.

Key Features

• Core Logic — 2,700 logic elements and approximately 128,236 equivalent gates enable implementation of medium-complexity logic functions and state machines.
• On‑Chip Memory — 81,920 total RAM bits (approximately 0.08 Mbits) of embedded memory for FIFOs, buffers, and small lookup tables.
• I/O Capacity — 196 user I/Os configurable for a variety of interface needs; supports high‑density external connectivity in a compact footprint.
• Power and Voltage — Core supply operating range 1.71 V to 1.89 V consistent with Virtex‑E 1.8 V cores; device optimized for surface‑mount board assembly.
• Packaging — 352‑land L‑BGA with exposed pad, metalized (supplier package 352‑MBGA, 35×35 mm), supporting high‑density PCB designs and thermal mounting.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant construction for modern assembly requirements.
• Virtex‑E Family Capabilities — As part of the Virtex‑E family, the device benefits from family features such as high‑speed SelectI/O+ interface options, built‑in clock management (DLLs), and SRAM‑based in‑system configuration (reprogrammability).

Typical Applications

• Protocol Bridging & Interface Conversion — Use the device’s configurable I/O and logic capacity to translate between legacy and modern interfaces or to implement custom protocol bridges.
• Embedded Control & Glue Logic — Implement timing control, bus arbitration, and peripheral interfacing for compact embedded systems.
• Data Buffering & Small Packet Processing — On‑chip RAM and moderate logic resources support packet FIFOs, small buffering tasks, and preprocessing of data streams.
• Prototyping & In‑System Development — SRAM‑based reprogrammability allows iterative hardware development and firmware updates without board rework.

Unique Advantages

• Balanced Logic and Memory — 2,700 logic elements combined with 81,920 bits of embedded RAM provide a capable mid‑range platform for mixed control and data tasks.
• Rich I/O Count in a Compact Package — 196 I/Os in a 352‑LBGA package enable dense board designs while preserving significant external connectivity.
• Commercial Temperature Fit — Rated for 0 °C to 85 °C, suitable for a wide range of commercial and office‑environment applications.
• RoHS Compliant — Meets standard environmental requirements for modern electronics manufacturing.
• Surface‑Mount Ready — Designed for surface‑mount assembly with an exposed pad for improved thermal conduction on populated PCBs.

Why Choose XCV100E-7BG352C?

The XCV100E-7BG352C delivers a practical mix of logic density, embedded memory, and I/O capability in a commercially graded, RoHS‑compliant package. It is well suited to designers who need a reprogrammable FPGA with moderate resources for protocol interfacing, control logic, and small‑scale data handling in compact board layouts.

As part of the Virtex‑E family, this device benefits from established architecture features—such as SelectI/O, on‑chip RAM resources, and in‑system SRAM configuration—that help accelerate development and simplify design updates over the product lifecycle.

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