XCV100E-7FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 81920 2700 256-BGA

Quantity 480 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-7FG256C – Virtex®-E FPGA, 256-BGA, 176 I/O

The XCV100E-7FG256C is a Virtex®-E series Field Programmable Gate Array (FPGA) in a 256-ball BGA package, offering a balance of logic, embedded memory, and flexible I/O for mid-density, high-performance digital designs. The device provides reprogrammable SRAM-based logic with a 1.8 V core supply range and is targeted at applications requiring configurable logic, on-chip memory and multi-standard interface support.

With approximately 2,700 logic elements, 176 I/O pins, and about 0.082 Mbits of embedded memory, this surface-mount FPGA is suited for designs that need moderate gate count, configurable I/O, and proven Virtex-E family capabilities such as advanced I/O standards and on-die clock management.

Key Features

  • Logic Resources — Approximately 2,700 logic elements and 128,236 gates provide a compact, reprogrammable fabric for custom digital logic and control functions.
  • Embedded Memory — Total on-chip RAM of 81,920 bits (approximately 0.082 Mbits) for local buffering, small FIFOs and state storage.
  • I/O and Interface Flexibility — 176 I/O pins in a 256-ball FBGA (17 × 17) package; the Virtex-E family supports a wide set of high-performance I/O standards and differential signalling options for high-bandwidth interfaces.
  • Clock Management — Family-level clocking features include multiple digitally controlled DLLs for clock multiply/divide and low-jitter timing management suitable for synchronous high-speed designs.
  • Power and Supply — Core voltage supply range of 1.71 V to 1.89 V (1.8 V class device), designed for lower-power operation compared with earlier-generation FPGAs in this family.
  • Package & Mounting — 256-FBGA (17 × 17) surface-mount package, enabling compact board-level integration for space-constrained designs.
  • Operating Environment — Commercial-grade operating temperature range from 0 °C to 85 °C and RoHS-compliant construction.
  • In-System Reprogrammability — SRAM-based configuration allows unlimited reprogramming for iterative development and field updates (family-level capability).

Typical Applications

  • High-performance memory interfaces — Implement controllers and glue logic for external memory systems where configurable timing and interface adaptation are required.
  • Custom peripheral and bus bridging — Use the device’s flexible I/O and support for multiple interface standards to implement PCI, parallel and serial bridging functions.
  • Embedded logic and control — Integrate custom state machines, protocol processing and control functions using the on-chip logic and embedded RAM.
  • Prototyping and in-field updates — SRAM-based configuration enables rapid prototyping and in-system reconfiguration for iterative design cycles and feature updates.

Unique Advantages

  • Balanced resource set: Approximately 2,700 logic elements and ~0.082 Mbits of embedded memory provide a compact solution for mid-density designs without overprovisioning board space.
  • Flexible I/O capability: 176 available I/Os in a 256-ball FBGA allow designers to support multiple peripheral interfaces and signaling standards on a single device.
  • Low-voltage core operation: 1.71–1.89 V supply range (1.8 V class) reduces core power relative to older, higher-voltage FPGA families.
  • Field reprogrammability: SRAM-based configuration supports unlimited reprogramming for development iterations and in-field feature changes.
  • Proven family-level features: Virtex-E family clock management, differential signalling support and multi-standard I/O give designers access to mature tools and documented design methodologies.
  • Compact, surface-mount packaging: 256-FBGA (17 × 17) enables dense PCB integration while maintaining a high I/O count.

Why Choose XCV100E-7FG256C?

The XCV100E-7FG256C delivers a pragmatic combination of logic capacity, embedded memory, and extensive I/O in a compact 256-BGA package. Its 1.8 V-class operation, reprogrammable SRAM fabric and Virtex-E family features make it a suitable choice for engineers building mid-density FPGA designs that require configurable interfaces, in-system updates and reliable clock management.

Supported by the Virtex-E family development ecosystem, this device is appropriate for design teams seeking a field-updatable platform with flexible I/O and established FPGA toolflow support for prototyping, interface bridging, and embedded control applications.

Request a quote or submit a pricing inquiry to get availability and lead-time details for the XCV100E-7FG256C. Our team can provide purchasing and ordering information to support your design schedule.

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