XCV100E-7FG256C
| Part Description |
Virtex®-E Field Programmable Gate Array (FPGA) IC 176 81920 2700 256-BGA |
|---|---|
| Quantity | 480 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 600 | Number of Logic Elements/Cells | 2700 | ||
| Number of Gates | 128236 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of XCV100E-7FG256C – Virtex®-E FPGA, 256-BGA, 176 I/O
The XCV100E-7FG256C is a Virtex®-E series Field Programmable Gate Array (FPGA) in a 256-ball BGA package, offering a balance of logic, embedded memory, and flexible I/O for mid-density, high-performance digital designs. The device provides reprogrammable SRAM-based logic with a 1.8 V core supply range and is targeted at applications requiring configurable logic, on-chip memory and multi-standard interface support.
With approximately 2,700 logic elements, 176 I/O pins, and about 0.082 Mbits of embedded memory, this surface-mount FPGA is suited for designs that need moderate gate count, configurable I/O, and proven Virtex-E family capabilities such as advanced I/O standards and on-die clock management.
Key Features
- Logic Resources — Approximately 2,700 logic elements and 128,236 gates provide a compact, reprogrammable fabric for custom digital logic and control functions.
- Embedded Memory — Total on-chip RAM of 81,920 bits (approximately 0.082 Mbits) for local buffering, small FIFOs and state storage.
- I/O and Interface Flexibility — 176 I/O pins in a 256-ball FBGA (17 × 17) package; the Virtex-E family supports a wide set of high-performance I/O standards and differential signalling options for high-bandwidth interfaces.
- Clock Management — Family-level clocking features include multiple digitally controlled DLLs for clock multiply/divide and low-jitter timing management suitable for synchronous high-speed designs.
- Power and Supply — Core voltage supply range of 1.71 V to 1.89 V (1.8 V class device), designed for lower-power operation compared with earlier-generation FPGAs in this family.
- Package & Mounting — 256-FBGA (17 × 17) surface-mount package, enabling compact board-level integration for space-constrained designs.
- Operating Environment — Commercial-grade operating temperature range from 0 °C to 85 °C and RoHS-compliant construction.
- In-System Reprogrammability — SRAM-based configuration allows unlimited reprogramming for iterative development and field updates (family-level capability).
Typical Applications
- High-performance memory interfaces — Implement controllers and glue logic for external memory systems where configurable timing and interface adaptation are required.
- Custom peripheral and bus bridging — Use the device’s flexible I/O and support for multiple interface standards to implement PCI, parallel and serial bridging functions.
- Embedded logic and control — Integrate custom state machines, protocol processing and control functions using the on-chip logic and embedded RAM.
- Prototyping and in-field updates — SRAM-based configuration enables rapid prototyping and in-system reconfiguration for iterative design cycles and feature updates.
Unique Advantages
- Balanced resource set: Approximately 2,700 logic elements and ~0.082 Mbits of embedded memory provide a compact solution for mid-density designs without overprovisioning board space.
- Flexible I/O capability: 176 available I/Os in a 256-ball FBGA allow designers to support multiple peripheral interfaces and signaling standards on a single device.
- Low-voltage core operation: 1.71–1.89 V supply range (1.8 V class) reduces core power relative to older, higher-voltage FPGA families.
- Field reprogrammability: SRAM-based configuration supports unlimited reprogramming for development iterations and in-field feature changes.
- Proven family-level features: Virtex-E family clock management, differential signalling support and multi-standard I/O give designers access to mature tools and documented design methodologies.
- Compact, surface-mount packaging: 256-FBGA (17 × 17) enables dense PCB integration while maintaining a high I/O count.
Why Choose XCV100E-7FG256C?
The XCV100E-7FG256C delivers a pragmatic combination of logic capacity, embedded memory, and extensive I/O in a compact 256-BGA package. Its 1.8 V-class operation, reprogrammable SRAM fabric and Virtex-E family features make it a suitable choice for engineers building mid-density FPGA designs that require configurable interfaces, in-system updates and reliable clock management.
Supported by the Virtex-E family development ecosystem, this device is appropriate for design teams seeking a field-updatable platform with flexible I/O and established FPGA toolflow support for prototyping, interface bridging, and embedded control applications.
Request a quote or submit a pricing inquiry to get availability and lead-time details for the XCV100E-7FG256C. Our team can provide purchasing and ordering information to support your design schedule.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








