XCV100E-8FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 176 81920 2700 256-BGA

Quantity 829 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs600Number of Logic Elements/Cells2700
Number of Gates128236ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV100E-8FG256C – Virtex®-E FPGA, 256-BGA, 176 I/O

The XCV100E-8FG256C is a Virtex®-E family field programmable gate array (FPGA) in a 256-ball BGA package. It provides reprogrammable logic with substantial I/O density and on-chip RAM, suitable for designs that require flexible, in-system configurable digital logic and moderate gate and memory resources.

Built on the Virtex-E architecture, this device combines a 1.8 V core voltage range, a broad set of family-level interface capabilities, and commercial-grade operating conditions for embedded and electronic system designs.

Key Features

  • Logic and Gates  Approximately 2,700 logic elements supporting about 128,236 gates for mid-density logic integration and custom digital functions.
  • Embedded Memory  Approximately 81,920 bits of on-chip RAM for buffering, state storage, and small FIFOs directly inside the FPGA fabric.
  • I/O Capacity  176 user I/Os provide extensive external connectivity from a single device footprint.
  • Power Supply  Core supply specified at 1.71 V to 1.89 V, aligning with the Virtex-E 1.8 V family architecture.
  • Package and Mounting  256-ball BGA (256-FBGA, 17×17) in a surface-mount package ideal for board-level integration where a high-pin-count, compact footprint is required.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant for lead-free assembly processes.
  • Virtex‑E Family Capabilities  Series-level features include fast 1.8 V architecture, advanced SelectI/O+ I/O technology, differential signaling support (LVDS, BLVDS, LVPECL), SelectRAM+ memory hierarchy, and built-in clock management with multiple DLLs — enabling a wide range of interface and timing configurations.

Typical Applications

  • High‑density I/O Interfaces  Use the 176 I/Os to implement interface bridging, protocol adaptation, or custom front-end logic where multiple signals and standards must be supported.
  • Embedded Logic and Control  Leverage the device’s logic elements and on-chip RAM for control algorithms, state machines, and custom processing blocks in embedded systems.
  • Memory Buffering and Glue Logic  On-chip RAM and reprogrammability make this FPGA suitable for buffering, bus conversion, and glue logic between different system components.
  • Prototyping and In‑System Reconfiguration  SRAM-based, reprogrammable architecture supports iterative development and in-system updates for evolving designs.

Unique Advantages

  • Balanced Mid‑Density Solution:  Offers a combination of logic, gates, and on-chip RAM suitable for designs that need more than small CPLDs but do not require very high gate counts.
  • Substantial I/O in a Compact Package:  176 I/Os in a 256-FBGA (17×17) package reduce board complexity while preserving routing flexibility.
  • Family-Level Interface Flexibility:  Virtex‑E SelectI/O+ and differential signaling support allow implementation of multiple I/O standards for mixed-signal system designs.
  • Commercial Temperature and RoHS Compliance:  Commercial operating range (0 °C to 85 °C) and RoHS compliance simplify integration into mainstream electronic products and assembly processes.
  • Surface Mount Form Factor:  Surface-mount 256-BGA simplifies automated PCB assembly and supports higher-density board designs.

Why Choose XCV100E-8FG256C?

The XCV100E-8FG256C positions itself as a practical Virtex‑E FPGA option for designers needing reprogrammable logic with a meaningful complement of I/O and embedded memory in a compact BGA package. Its 1.8 V core, family-level I/O and clock-management features, and commercial-grade temperature range make it well suited to embedded systems, interface logic, and prototyping tasks where flexibility and moderate integration density are priorities.

With RoHS compliance and a surface-mount 256-FBGA footprint, this part addresses modern assembly requirements while providing access to the Virtex‑E family’s development ecosystem and series-level capabilities for clocking, I/O standards, and on-chip memory architectures.

Request a quote or submit an inquiry to receive pricing and availability for XCV100E-8FG256C and to discuss how this Virtex‑E FPGA can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up